·      2Q26 revenue, operating profit, net profit all at record highs for same period ·      3Q26 to see strong YoY growth, significant QoQ growth ·      Solid gains in 3Q26 for cloud and networking & smart consumer electronics ·      2027 demand for AI production capacity to stay very strong ·      Capex to grow in US, including Texas, Wisconsin, Ohio, California ·      Electromobility new business gaining ground in New Zealand, Poland, Saudi Arabia--12 August 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317) today announced its second quarter 2026 financial results. Revenue in the April-June quarter reached NT$2.53 trillion, that alongside operating profit and net profit, all set new second-quarter records. Net profit for the quarter was NT$60 billion, and earnings per share reached NT$4.27. Looking ahead to the third quarter, the traditional peak season, operations are expected to gradually pick up. Overall, the July-September quarter is expected to see significant quarter-on-quarter growth and strong year-on-year growth. For the full year 2026, thanks to strong demand for AI servers and growth in smart consumer electronics, the outlook for strong growth remains unchanged. In the second quarter, revenue reached NT$2.53 trillion, up 41% on year; at the same time, gross profit was NT$154.5 billion, rising 36%; operating profit at NT$94.8 billion, increased 68%; and net profit (attributable to the parent company's owners) was NT$60 billion, gaining 35% on year. Gross profit margin, operating profit margin, and net profit margin were 6.12%, 3.75%, and 2.37%, respectively. EPS reached NT$4.27, an increase of NT$1.08 compared to NT$3.19 in the same period last year. Revenue, operating profit, and net profit all reached record highs for the same quarterly period. In the first half of 2026, revenue reached NT$4.65 trillion, increasing 35% from a year ago; at the same time, gross profit was NT$285.5 billion, up 33%; operating profit was NT$170.5 billion, jumping 65%; and net profit was NT$109.9 billion, rising 27%. Gross profit margin, operating profit margin, and net profit margin were 6.15%, 3.67%, and 2.37%, respectively. EPS reached NT$7.84, an increase of NT$1.61 compared to NT$6.23 in the same period last year. Revenue, operating profit, and net profit all reached record highs for the first half of the year. Amid significant market interest regarding the mass production progress of AI and smart consumer electronics products for key clients, Foxconn Rotating CEO Michael Chiang stated the Group is seeing sustained volume growth in AI server racks driven by continued capital expenditure expansion among cloud service providers (CSP). Cloud and networking products are projected for strong growth in the third quarter, with high double-digit increases both on-quarter and on-year. For the same period, revenue for smart consumer electronics, given traditional peak season in the second half of the year, is expected to show significant growth sequentially in the July-September quarter and compared to a year ago. As Foxconn continues to expand its market share in AI server racks, Chiang said Foxconn's advantage in AI lies in providing complete, end-to-end system solutions, rather than just single products. With Vera Rubin (VR) racks entering mass production in the third quarter, overall AI server rack revenue is expected to increase quarter-on-quarter, and shipments are projected to achieve high double-digit growth. For the full year this year, AI rack shipments are also expected to more than double. Shipments of high-performance networking products are moving ahead and full-year revenue from 800G and higher switches is expected to double, while co-packaged optics (CPO) all-optical switches are on track for mass production and shipment in the third quarter. Foxconn’s sustained strength in operational performance comes down to its global footprint and economies of scale, said Chiang. With more than 240 sites in 24 countries, and longstanding, deep development of vertically integrated and highly automated operations, alongside a high in-house production ratio of key components, the Group is able to maintain sound operating efficiency and yields in the face of high unit price and highly complex AI products. Taking an example, he said, currently the Group’s automation rates of processes in computer numerical control (CNC) and surface mount technology (SMT) are close to 100%. Ultimately, it is the collaboration with top-tier customers to develop products, focusing on forward-looking and proprietary technologies, increasing the proportion of high-value-added products, that drives Foxconn's transformation into a technology manufacturing platform service provider. On the subject of the Group’s cash flow supporting its huge operations and mass production work, Chiang said AI has brought significant benefits to Foxconn's financial performance. Investment expansion and order intake in the first half of this year has led to capital expenditure growing 5% on year to NT$80.9 billion, and net interest expense increasing by NT$6.6 billion annually. However, he pointed out that well-outpacing the spending and interest expense was a bigger 52% year-on-year jump in adjusted EBITDA in the first half, making clear a healthier cash flow. In the January-June period this year, adjusted EBITDA reached NT$227.7 billion, up by NT$77.6 billion. Regarding the ROE and operating profit margin indicators, Chiang stated the ROE for the first half of this year reached 6.21%, an increase of 0.73 percentage point compared to the same period last year, reaching half of the Group's 12% target, with further room for improvement. Operating profit margin – at 3.67% in the January-June period, improving 0.67 percentage point year-on-year – not only met the Group's 3% target, but should also exceed last year's full-year level of 3.2%. Looking ahead to next year, Chiang said customer demand for AI production capacity will still be very strong. Foxconn’s capex will continue to increase in locations including Taiwan, the United States, Mexico and Vietnam; among sites, in response to American localization needs, Texas, Wisconsin, Ohio and California will see build up in R&D and manufacturing capabilities. The Group currently has no plans for direct equity financing and will maintain a sound capital structure to meet future operational and expansion needs. Among positive developments in new business areas, Japan’s Mitsubishi Motors in New Zealand recently officially confirmed EV models under partnership, with Chiang noting vehicle deliveries starting in the second half of this year. In Europe, work with state-backed ElectroMobility Poland (EMP) is continuing to advance, while in MENA, production is expected to officially start in the fourth quarter for the joint venture in EV charging infrastructure in Saudi Arabia. Meanwhile, at home, delivery began in July for new car model CAVIRA based on the MODEL C, and the new Kaohsiung factory also started mass production of MODEL T and electric bus batteries. In a call out for October, Hon Hai Tech Day 2026 this year will be held October 30-31. In its 7th year, Foxconn’s flagship show will take place at an unprecedented scale, combining the first and fourth floors of Taipei Nangang Exhibition Center, Hall 1, to demonstrate the Group’s latest technological achievements from its three major smart platforms and deep integration of AI. New product reveals are planned. The two-day annual conference will launch for the first time a family-friendly pavilion for children to explore cool zones and dream jobs related to technology. Free entry on the second day, hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city. Foxconn sincerely invites one and all to come!     About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

Delivers Production-Grade AI Infra to Accelerate Enterprise AI Adoption Through a Tokenized AI Factory【31 July 2026, Taipei, Taiwan】Visionbay.ai (“Visionbay”), an NVIDIA Cloud Partner (NCP) in Taiwan, today announced the commercial launch of its first 5MW AI cluster powered by NVIDIA HGX B300 systems, the largest deployment of its kind nationwide. Featuring direct liquid cooling, a 2N high-availability architecture, and connected with NVIDIA Quantum-X800 InfiniBand networking, the cluster is purpose-built for large-scale AI training and inference. It has already signed its first long-term enterprise customers and has entered commercial operation with utilization exceeding 90%. Together, these milestones position Visionbay as one of the leading AI infrastructure providers in the Asia-Pacific region. The cluster has also achieved NVIDIA Exemplar Cloud validation for training workloads on NVIDIA HGX B300, making Visionbay one of the first ten organizations globally — and the second in Asia — to achieve NVIDIA Exemplar Cloud validation as an NVIDIA Cloud Partner. The achievement underscores Visionbay's ability to deliver world-class AI infrastructure and software operations at enterprise scale.   As generative AI, agentic AI, and multimodal foundation models advance, enterprises need more than access to GPUs — they need infrastructure that can reliably support production environments. NVIDIA Exemplar Cloud is a validation initiative  to optimize infrastructure for predictable, production-scale AI performance. Using the NVIDIA Performance Benchmarking and real-world LLM workloads, including DeepSeek-V3, Llama 3.1, Qwen3, and Grok-1, the validation verifies compute performance, network efficiency, cluster stability, and long-duration operational consistency. For enterprise customers, it provides independent assurance that a platform is ready for production deployment — reducing risk and accelerating AI adoption at scale. The achievement also reinforces Visionbay's vision of building a Tokenized AI Factory. Unlike conventional GPU cloud platforms, Visionbay unifies AI infrastructure, GPU cloud services, an AI operations platform, and Token Factory capabilities into a single platform supporting the entire AI lifecycle — from model training and fine-tuning to inference and AI agent deployment. Operating its data center to Tier III-class standards with enterprise-grade security, Visionbay delivers Day-1 operational readiness, ensuring large-scale GPU clusters can be continuously managed, optimized, and delivered as an enterprise service. This helps enterprises accelerate AI commercialization while lowering operational complexity and deployment risk. Looking ahead, Visionbay will continue expanding its AI infrastructure across the Asia-Pacific region powered by NVIDIA Blackwell and NVIDIA Vera Rubin architectures. Leveraging Foxconn's vertically integrated strengths in critical components, AI infrastructure, and AI software platforms, Visionbay is building an end-to-end Tokenized AI Factory that empowers enterprises, governments, and ecosystem partners to scale AI innovation and help shape the next wave of the AI economy. AboutVisionbay.ai Visionbay.ai is the Hon Hai Technology Group’s dedicated business unit for supercomputing and cloud-AI operations. With a mission to empower Asia’s AI ecosystem, Visionbay.ai integrates national-level computing infrastructure with Hon Hai’s deep strengths in manufacturing, design, and supply-chain orchestration. Its end-to-end AI Factory solutions span high-performance compute, cloud operations, supply-chain integration, AI model and tool development, and an AI App Store. Visionbay.ai helps enterprises accelerate digital and AI transformation while building a trusted and sustainable sovereign-AI ecosystem. To learn more, visit  www.visionbay.ai

Visionbay.ai and IBM collaborate to deliver a trusted, scalable, full-stack AI platform across the region Singapore, July 21, 2026 – Today IBM (NYSE: IBM) and Visionbay.ai (“Visionbay”) – backed by Hon Hai Technology Group (Foxconn) — announced a collaboration to develop an AI platform and expand Visionbay’s AI App Store for enterprises and regulated industries across Asia Pacific.Built on Visionbay’s AI infrastructure and cloud operations, Red Hat OpenShift will provide the hybrid cloud foundation for managing AI workloads and IBM’s watsonx AI portfolio will support AI development and governance capabilities. Together, the companies will provide an integrated AI platform that supports the full AI lifecycle — including model development, fine-tuning, deployment and AI services. By delivering a repeatable, full-stack architecture for enterprise deployment, the platform can help organizations move AI workloads from experimentation into production with greater speed, efficiency, and consistency with built-in enterprise governance.These complementary capabilities can be accessed through Visionbay’s AI App Store, which will offer ready-to-use AI agents and AI applications tailored for businesses, enabling organizations to discover, deploy and govern AI securely while maintaining three critical layers:＊Data Residency – keeping data, models and intellectual property within defined jurisdictions and customer-controlled environments.＊Operational Control – enabling localized operation, management and optimization of critical AI infrastructure.＊Governance and Compliance – adhere to regulatory requirements, security standards and auditability required by governments and regulated industries.Through a Build-Operate-Localize model, IBM and Visionbay will help governments and regulated industries establish the operational foundation needed to scale AI services securely and reliably across environments — enabling local ownership of critical infrastructure, accelerating enterprise adoption, developing AI talent, and creating economic opportunities.The collaboration marks an important milestone in Visionbay's strategy to expand beyond AI infrastructure by growing its AI App Store and software ecosystem, enabling customers to access enterprise AI solutions through a unified commercial platform. It will begin with deployments in Taiwan and expand across Asia Pacific, supporting industries including governments, financial services institutions, telecommunications providers and other regulated sectors.“IBM and Visionbay.ai will help nations establish AI as a new digital industry — enabling local ownership of critical infrastructure, accelerating enterprise adoption, developing AI talent, and creating economic opportunities across the ecosystem. Our Build-Operate-Localize model represents the next evolution of AI infrastructure. Together with IBM, we are creating the foundation for trusted AI adoption across Asia,” said Neo Yao, CEO, Visionbay.ai.“The AI era is driving the need for a new kind of enterprise infrastructure, and this collaboration will help enterprises and regulated industries unlock their full potential with open, flexible, and secure AI solutions to thrive in a rapidly changing world,” said Hans Dekkers, GM, IBM Asia Pacific. “Through combining Visionbay’s AI infrastructure with IBM’s enterprise AI, hybrid cloud and technology expertise, we are helping clients across Asia Pacific accelerate AI transformation with security, control and consistency.”This collaboration also strengthens Visionbay's software ecosystem, enabling customers to access trusted enterprise AI applications alongside AI infrastructure through a single platform. The integrated platform supports flexible consumption models across the AI value chain — from GPU-as-a-Service (GPUaaS) providing access to accelerated computing resources, AI Platform-as-a-Service (AI PaaS) enabling model development, deployment and governance, to AI-as-a-Service (AIaaS) delivering industry-specific AI solutions for intelligent customer engagement, risk management, operational automation and productivity transformation.

Top-marked Brazil and China’s Yantai sites certified highly in RBA VAP assessment08 July 2026, Taipei, Taiwan – Deepening the core philosophy of “EPS+ESG=Sustainability” at the world’s largest electronics manufacturer, Hon Hai Technology Group (Foxconn) (TWSE:2317) completed independent, third-party audits covering major manufacturing sites including Brazil, Vietnam, China, India and Mexico, reflecting a commitment in governance to drive operational discipline, risk visibility, and continuous improvement across its global footprint. No priority non-conformances as defined by the Responsible Business Alliance (RBA) Validated Assessment Program (VAP) were found. Covering areas of labor rights, occupational health and safety, environmental protection, business ethics and supply chain management, the latest audit returned an overall compliance rate of 89.7%, reflecting solid improvement in the Group’s global audit work for the third year in a row. As of the end of 2025, the Group has completed 85 RBA VAP audits across 65 sites worldwide, earning a total of six Platinum, two Gold, and 33 Silver certifications.In 2025, enhanced RBA VAP audits were also conducted at nine major sites, which were selected based on risk factors including operational complexity, workforce size, geographic risk, and historical stakeholder concerns, with the aim of strengthening ESG governance in higher-risk locations. In its inaugural RBA VAP audit, Foxconn’s Sao Paulo site in Brazil attained top marks, scoring a full 200 and receiving a Platinum certification. Foxconn China’s Yantai site, also undergoing its first RBA VAP audit, earned a Silver certification. Other sites in China, alongside those in India and Mexico, underwent consecutive audits showing continued improvement compared with previous assessments. The nine enhanced audited sites accounted for 121 auditor-days, with 1,279 employees interviewed. The audit scope covered all aspects of the RBA Code of Conduct, including labor, health and safety, environmental protection, business ethics, management systems, and supply chain responsibility. Other key findings included: Sites in China (Chengdu, Zhengzhou, and Yantai) and Mexico (Chihuahua) obtained Silver certification. Environmental conformance reached 93.5%, and business ethics conformance reached 96.5%, maintaining strong performance. Sites undergoing consecutive audits for two years showed, on average, a solid 19.1% improvement gain in points; the Chengdu site improved by 46.2 points, with progress across labor, health and safety, and environmental dimensions. Mexico’s Chihuahua site achieved a 133% improvement in supply chain management compliance, reflecting continued enhancement in supply chain maturity The report also highlighted labor rights, occupational health and safety, and supply chain management as key areas for further improvement. It recommended continued efforts to reduce disparities in ESG management and execution maturity across sites. Looking ahead, Foxconn will continue to enhance global consistency and ESG governance maturity through third-party audits, management system optimization, capability building, and cross-site best practice sharing. Read report here

26 June 2026, Taipei, Taiwan and Pardubice, the Czech Republic – Hon Hai Technology Group (Foxconn) (TWSE:2317) hosted the Czech Tech Day technology exhibition at its Pardubice facility, showcasing the latest high-tech products shaping the present and future of industry. Visitors had a unique opportunity to see these technologies from Foxconn’s global portfolio in the Czech Republic for the very first time, just days after their presentation at the prestigious VivaTech exhibition in Paris. The event offered a comprehensive overview of the key areas driving today’s technological transformation – from artificial intelligence and advanced robotics to electric mobility. Foxconn also demonstrated its role as a technology leader and strategic business partner, connecting global innovation with local manufacturing. Czech Tech Day was attended by representatives of the City of Pardubice, the Pardubice Region, CzechInvest, the Czech Chamber of Commerce, the Taipei Economic and Cultural Office in Prague, and other important partners. The exhibition was also open to all Foxconn employees from Pardubice and Kutná Hora. AI Infrastructure as the Foundation of the Digital Future One of the main attractions was the presentation of state-of-the-art AI infrastructure, including the NVIDIA Vera Rubin NVL72 platform. This high-performance rack-scale system demonstrated a new approach to building data centers that are evolving into so-called “AI factories” – environments designed for developing, training, and deploying artificial intelligence at scale. “The showcased solutions demonstrated how computational performance can be significantly increased while accelerating model training and reducing both operating costs and energy consumption,” said Radka Svobodová, Compliance, PR and Communications Manager at Foxconn. The exhibition also featured modular infrastructure components illustrating the practical deployment of AI in enterprise environments. Foxconn Czech Republic is already involved in the production of critical AI infrastructure, and this manufacturing capacity will continue to expand in the future. Humanoid Robotics and Digital Twins in Manufacturing Another major highlight was the demonstration of a next-generation humanoid robot developed in cooperation with NVIDIA. The robot is capable of autonomously responding to environmental changes, making decisions, and performing complex tasks such as material handling and assembly operations. The presentation also included a demonstration of the Foxconn Omniverse Digital Twin, which connects physical manufacturing operations with their virtual counterpart in real time. This technology enables process simulation, production optimization, and testing without disrupting actual operations. FOXTRON Electric Vehicles Debut in the Czech Republic Another section of the exhibition was dedicated to EVs from FOXTRON Vehicle Technologies, which were presented in the Czech Republic for the first time. Visitors could explore the compact MODEL B, offering a driving range of up to 516 km, as well as the premium seven-seat MODEL D, designed for both family and business use, with a range of up to 800 km. Both vehicles attracted considerable interest from visitors, who had the opportunity to sit inside the cars, explore their premium interiors, and take photographs with them. “Through both the design and manufacturing of electric vehicles, Foxconn is fulfilling its long-term strategy of being not only a manufacturer of products and components, but also an integrator of comprehensive next-generation mobility solutions that combine hardware, software, and proprietary platforms developed in-house,” said Radka Svobodová. Foxconn’s Strong Presence in the Czech Republic The Czech Tech Day exhibition also showcased European production, including manufacturing activities in the Czech Republic, highlighting the country’s importance within Foxconn’s global operations. Foxconn has been operating in the Czech Republic since 2000, employs approximately 4,500 people, and runs two manufacturing facilities in Pardubice and Kutná Hora. Products manufactured in Foxconn’s Czech facilities include desktop computers, monitors, printers, servers, routers, switches, supercomputers, advanced artificial intelligence systems, and portable oxygen concentrators. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

Osaka, Japan, June 24, 2026 — Hon Hai Technology Group (Foxconn) (TWSE: 2317) today announced the signing of a Strategic Memorandum of Understanding (MOU) with SHARP Corporation (TYO: 6753). Through a clearly defined collaboration framework and communication mechanism, the two companies will leverage Foxconn’s technology capabilities, global manufacturing footprint, supply chain expertise, and investment ecosystem established under its “3+3+3” strategy, together with SHARP’s brand strength, market channels, and customer service network to explore investment opportunities and other forms of collaboration, accelerating new business development and market expansion. The MOU covers a broad range of strategic areas, including AI infrastructure and solutions, energy and ESG-related applications, robotics and intelligent automation systems, next-generation communications technologies, and smart city initiatives. The two companies will jointly develop innovative products and services to address evolving market needs. As a priority initiative, the companies will evaluate the establishment of a “3+3+3” Joint R&D Platform, combining SHARP’s new business initiatives with Foxconn’s capabilities in AI, energy, robotics, electric vehicles, and next-generation communications. The platform will support joint R&D, proof-of-concept validation, product development, and commercialization efforts. The two companies will also evaluate a business development collaboration platform to accelerate new business deployment by combining SHARP’s market strengths with Foxconn’s manufacturing capabilities, supply chain resources, and global partner network. In AI infrastructure, the companies will build on SHARP’s AI server initiative and explore AI server products and solutions under the SHARP brand, integrating product supply, maintenance services, deployment support, and related business models to meet growing demand for high-performance computing and AI applications. Young Liu, Chairman of Hon Hai Technology Group (Foxconn), said: “As an important affiliated company of the Hon Hai Technology Group (Foxconn), SHARP possesses strong brand value and a solid market foundation. Through this collaboration framework, we look forward to creating synergies between our organizations and developing new business models in growth sectors such as AI, energy, and robotics, further enhancing SHARP’s corporate value and the overall competitiveness of the Foxconn Group.” Tetsuji Kawamura, President and Chief Executive Officer of SHARP Corporation, said: “SHARP has built a strong presence in Japan and global markets. Through this collaboration, we look forward to leveraging Foxconn’s strengths in technological innovation and global supply chain management to drive new business development and create new growth opportunities.” Looking ahead, SHARP and Foxconn will use this MOU as a foundation for future collaboration. Guided by market demand and industry trends, the two companies will continue to advance collaborative initiatives and pursue opportunities that create long-term value.▲ Photo Caption: Witnessed by Foxconn Chairman Young Liu (center), Foxconn and SHARP signed a Strategic MOU. (Photo courtesy of Foxconn)

18 June 2026, Taipei, Taiwan – Hon Hai Research Institute (HHRI) today announced a major breakthrough in its Post-Quantum Cryptography (PQC) research and development. SNOVA, a digital signature algorithm co-developed with deep involvement from HHRI experts, has officially been selected for the third round of the onramp competition of the U.S. National Institute of Standards and Technology (NIST) PQC Standardization Project. Following the technical prowess previously demonstrated by Preon—another candidate algorithm involving HHRI participation—SNOVA's advancement further validates the global cryptographic community's recognition of the Institute's core technological strengths. It signifies that the HHRI team has fully mastered critical, next-generation capabilities in cybersecurity defense. Professor Lih-Chung Wang, a key contributor to the SNOVA algorithm, is currently seconded to HHRI as a Distinguished Researcher. During the secondment period, Professor Wang collaborated closely with the Information Security Research Center's cybersecurity team to investigate hardware acceleration strategies and optimization methods for the mathematical structure underlying SNOVA. In addition to delivering the core advantages of "short signatures" and "low computational overhead" inherent to its algorithm family, SNOVA achieves a critical breakthrough in its "small public key" characteristic. This breakthrough substantially improves the algorithm's universal versatility across diverse application scenarios and boosts hardware computing efficiency. This crucial edge was strategically targeted by the team from an early stage and stands as a pivotal factor in winning NIST's favor and securing its advancement to the third round. Simultaneously holding two pioneering candidate technologies, SNOVA and Preon, reflects HHRI's strategic, multi-path deployment across several post-quantum technological trajectories, encompassing Lattice-based, Multivariate (MQ), and Zero-Knowledge Proof (ZKP) cryptographic frameworks. This multi-path approach aligns perfectly with NIST's overarching strategy of ensuring algorithmic diversity, while granting Hon Hai Technology Group (Foxconn), the parent of HHRI, the research caliber to participate in international standard-setting across diverse technological dimensions. Faced with a future full of uncertainties, this parallel multi-track strategy effectively serves as a multi-layered insurance policy for Foxconn. The NIST PQC Standardization Project is universally acknowledged as the world's most authoritative and influential screening mechanism for post-quantum cryptography. Algorithms submitted by countless top-tier scientists and institutions globally undergo rigorous, multi-round elimination. Advancing to the third round indicates that SNOVA has successfully withstood the most stringent cryptanalysis from the world's leading cryptographers. This achievement proves that HHRI's capabilities in "Quantum Security" are truly world-class, demonstrating its global-tier scientific research strength in cutting-edge, core software cryptography and forward-looking cybersecurity R&D. Looking ahead, Foxconn through HHRI will continue to invest resources in strengthening the security analysis and implementation of SNOVA, fostering its further development and adoption. This milestone is not only a successful paradigm of industry-academia collaboration in Taiwan, but also marks the Group's commitment to transforming into a "Cybersecurity Technology Pioneer," dedicated to providing clients with the most robust and reliable foundational technological protection as the world transitions into the quantum computing era.

17 June 2026, Taipei, Taiwan and Paris, France – Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest artificial intelligence server provider, accelerated its global leadership in AI factories and sovereign AI infrastructure by showcasing at VivaTech its end-to-end integration capabilities that also stand up the world’s most state-of-the-art, rack-scale AI supercomputer. Considered Foxconn’s European debut and a nod to Europe's biggest startup and tech event, the world’s largest electronics manufacturer brought the cutting-edge technology – to the continent for the first time – including NVIDIA Vera Rubin NVL72, NVIDIA HGX platforms and NVIDIA MGX architectures, as well as two of its electric vehicles and advances in humanoid robotics. “Foxconn is connecting with transformation opportunities and diversified business models across European industries. By fostering technology collaboration with industry, start-ups, government and academia, we strengthen our Build-Operate-Localize presence in Europe,” said Foxconn Vice President and Spokesperson James Wu, referring to the Group’s innovative BOL business model that supports local communities. Underscoring the market’s importance, Foxconn, with partners Bull of France, a leader in advanced computing and AI, and NVIDIA also announced a strategic milestone to build the NVIDIA Vera Rubin NVL72 platform from Europe that will commercialize under the Bull brand. At Foxconn Booth 2B41, the NVIDIA Vera Rubin NVL72 represents the next frontier of Agentic AI. On display, as well, were NVIDIA HGX Rubin NVL8 and NVIDIA MGX 4U system, affirming the Group’s manufacturing strengths in high-density AI racks, compute trays, liquid cooling, power delivery, and system integration. Moreover, with its dedicated business unit for AI supercomputing & cloud operations, Visionbay.ai – which is an NVIDIA Cloud Partner (NCP) – the Group showed end-to-end solutions that cover the full stack AI factory operations to technical services and application ecosystems. For the first time in Europe, the public can see and sit in two modern EVs offered by Foxconn unit FOXTRON Vehicle Technologies under a Contract Design and Manufacturing Service, or CDMS, business model. A MODEL B sporty crossover – being sold in Taiwan under the BRIA brand – and a MODEL D lifestyle multipurpose utility vehicle represent the Group’s capabilities in EV platforms, complete vehicle design, smart cockpits and advanced electronic/electrical (E/E) architectures. Meanwhile, a wheeled humanoid demonstrates dual-arm collaboration for precision assembly tasks. The embodied intelligence is derived from actual factory scenarios, combining simulation-based training with on-site iteration to enable rapid deployment and scalable rollout across manufacturing facilities.   About VivaTech here. About Foxconn here.