Pioneering a new foundation for quantum cryptography with meta-complexity13 June 2025, Taipei, Taiwan  – Hon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing. Researchers from HHRI’s Quantum Computing Division have demonstrated the possibility of constructing quantum cryptography without relying on traditional one-way functions, using instead a novel theoretical framework known as meta-complexity. This groundbreaking result has been accepted at Crypto, the world’s leading conference in cryptography, highlighting HHRI’s advanced research capabilities and its growing influence in the global quantum technology landscape. Figure 1: Overview of the relationships between key quantum cryptographic primitives and quantum computational complexity. Black lines indicate known results or straightforward inferences; red lines highlight HHRI’s new discoveries.This groundbreaking research, led by Dr. Taiga Hirooka, a researcher at HHRI, in collaboration with Professor Tomoyuki Morimae of Kyoto University and scientific advisor to HHRI, is the first to establish a deep theoretical connection between core tools in quantum cryptography—such as one-way puzzles and quantum random number generators—and a fundamental decision problem known as GapK. The GapK problem centers on determining whether a given piece of information is intrinsically complex or can be succinctly described, offering a novel lens through which to understand the foundations of quantum cryptography.   This discovery not only establishes a new theoretical foundation for quantum cryptography, but also paves the way for the development of next-generation Proofs of Quantumness—a critical step toward constructing secure and verifiable quantum technologies. The work aligns with concurrent research from two international teams and is widely seen as marking a new chapter in the evolution of quantum cryptography.   Crypto (International Cryptology Conference) is one of the most prestigious and longest-running academic conferences in the field of cryptography. Established in 1981, it has become a cornerstone of the discipline—alongside Eurocrypt and Asiacrypt—and is one of the three flagship events organized by the International Association for Cryptologic Research (IACR). Crypto attracts leading researchers and industry pioneers from around the globe and has served as the launchpad for numerous foundational advances in cryptographic theory and practice. Publishing at Crypto is widely regarded as one of the highest honors in the field, representing a hallmark of excellence in theoretical rigor, technical innovation, and lasting impact.   HHRI’s latest breakthrough, now accepted at Crypto, not only enhances Taiwan’s presence in the field of quantum cryptography but also highlights Foxconn’s sustained investment and growing expertise in quantum computing. The Hon Hai Research Institute will continue to advance quantum computing research to drive global technological innovation and industrial progress. Crypto 2025：https://crypto.iacr.org/2025/   About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has an average of 40 high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy.

21 May 2025, Taipei, Taiwan – Foxconn continues to advance its digital health initiatives, unveiling a range of innovations at the 2025 GTC Taipei. Highlights include the AI-powered nursing collaborative robot, digital twin smart hospital development, and contributions to the global open-source medical imaging platform MONAI. These achievements will also be spotlighted during keynote sessions at GTC Taipei, underscoring Foxconn’s capabilities as a comprehensive smart healthcare solutions provider.   Leveraging Technology to Address Nursing Workforce Shortages: AI Collaborative Robot Enters Clinical Practice Amid the challenges of an aging population and critical nursing staff shortages, Foxconn has partnered with Taichung Veterans General Hospital (ranked among Newsweek’s World’s Best Smart Hospitals 2025), Kawasaki Heavy Industries, to co-develop Nurabot, an AI-powered nursing collaborative robot.          Nurabot is powered by Foxconn’s proprietary traditional Chinese large language model, FoxBrain, developed by the Hon Hai Research Institute (HHRI). The model supports TTS (text-to-speech), ASR (automatic speech recognition), and NLP (natural language processing), and is deployed via the Hon Hai Data Center. The robot is powered by Isaac for Healthcare, a physical AI platform built on NVIDIA’s three computers for healthcare robotics. NuraBot uses  the NVIDIA Jetson AGX Orin™system-on-moduleand is trainedusingNVIDIA Isaac Sim™ , a reference robotic simulation application built on NVIDIA Omniverse and running on NVIDIA OVX™ for physical-virtual simulation, enabling autonomous navigation, multimodal perception, and real-time environmental modeling.   In clinical applications, Nurabot performs repetitive tasks such as medication delivery, specimen transport, ward patrols, and patient education—helping reduce nurses’ workload by up to 30%. It also enhances care standardization and precision, enabling nursing staff to focus more on core patient care and clinical decision-making. Currently undergoing field trials at Taichung Veterans General Hospital, Nurabot is expected to be formally integrated into the hospital’s nursing team operations by the end of the year. Foxconn further elaborates on this application in the featured talk titled “AI Humanoid Collaborative Nursing Robots: Shaping the Future of Nursing and Care,” showcasing how AI and robotics help alleviate workforce burdens and reshape healthcare environments.   Launching a Smart Hospital Ecosystem: Digital Twin Deployment for Operational Simulation As part of its smart hospital initiatives, Foxconn is collaborating with several medical institutions under planning and construction, including the Evergreen Branch of Taichung Veterans General Hospital, Baishatun Tung Hospital – Mazu Hospital, and Cardinal Tien Hospital. These collaborations involveconstructingphysically accurate digital twins of smart medical environments with NVIDIA Omniverse™ libraries and technologies.   These digital twins are used across three stages of hospital development: planning and design, workflow simulation, and operational optimization. Even in the early stages of construction and operations, hospitals can simulate AI-driven clinical scenarios, optimize spatial flow, and validate service efficiency and patient experience in advance.   With the integration of NVIDIAVideo Search & Summarization Agent (VSS ), hospitals can analyze real-time video data, automatically identify medical events and anomalies, generate visual summaries, and send real-time alerts. These capabilities empower management teams to make timely, data-driven decisions that enhance care quality and operational performance.   These digital twin environments also serve as key deployment sites for Nurabot, enabling simulation of robot routes, task validation, and training scenarios in virtual space. This accelerates clinical onboarding and cross-site implementation, further optimizing hospital operations and realizing truly patient-centered smart healthcare services.   Contributing to MONAI Open-Source Medical AI Models: Advancing AI Imaging Innovation To advance core AI healthcare technologies, Foxconn has developed CoroSegmentater, a coronary artery segmentation model set to be contributed to the      MONAI Model Zoo as a shared open-source asset for the global medical AI community. Built on 256-slice CTA imaging and powered by MONAI’s Auto3Dseg framework, the model achieves high-precision 3D segmentation of cardiac and coronary structures. CoroSegmentater can be deployed on NVIDIA OVX™ and simulated using Isaac Sim™ to reconstruct heart anatomy and vascular dynamics. It supports various clinical applications, including AI-assisted diagnostics, preoperative planning, and patient communication. The model is being featured in a special session at GTC Taipei, presented by David Niewolny, Sr. Director of Healthcare Business Development at NVIDIA. This contribution reflects Foxconn’s R&D strength in smart healthcare algorithms and its commitment to advancing global medical AI through open collaboration.   Driving Digital Health Globalization and Expanding AI Healthcare Impact Through its collaborationwith NVIDIA and the cross-sector network of HiMEDt (Taiwan Digital Health Alliance), Foxconn is actively promoting the international expansion of Taiwan’s smart healthcare innovations. Moving forward, Foxconn will further enhance its smart hospital AI platforms, robotic applications, and clinical AI model development to transition global smart healthcare from proof-of-concept to large-scale implementation—paving the way toward a truly patient-centered intelligent care ecosystem.

19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) on Monday announced a strategic partnership with Thales Group of France in the fields of semiconductors and space, a move that deepens the industrial expertise and broadens the European footprint of the world’s largest electronics manufacturing service provider. Announced at Choose France, a flagship economic summit convened by French PresidentEmmanuel Macron, the first of two MOUs for Foxconn could aggregate additional European industrial investors to sustain an investment in excess of EUR250 million while ensuring a strong European leadership in an outsourced semiconductor assembly and test (OSAT) facility. Foxconn is exploring the potential in preliminary discussions with government-backed Thales and Radiall, a French connector and component maker. If successfully concluded, the facility would address the European aerospace, automotive, space telecoms and defense advanced packaging markets, while bringing together other European industrial investors. The OSAT project would use fan-out wafer level packaging (FOWLP), which would make such a facility a first in the second-largest economy of the European Union. With this development, Foxconn deepens its industrial expertise and global footprint, strengthening the resilience of the supply chain and making key investments in new businesses. The second MOU covers the domain of satellite constellations. Combining the excellence of Foxconn’s unparalleled advanced manufacturing and space technologies of Thales Alenia Space, a Joint Venture between Thales (67%) and Leonardo (33%), this initiative aims at exploring the value of developing together high quality/high-value series satellite production in order to provide superior technological content to customers for their large telecommunications satellite constellation projects in Low Earth Orbit. Foxconn is an emerging stakeholder in the space ecosystem, launching its own low earth orbit CubeSat in 2023 as proof-of-concept, expanding its next-generation beyond 5G (B5G) capabilities and entering satellite constellation manufacturing with the aim to industrialize the LEO sector with its half-century of ICT experience. Choose France, an annual event since 2018, seeks to promote the France’s economic attractiveness and encourage international investment across the country   About Foxconn here.

19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) will kick off COMPUTEX 2025 with the industry's most complete set of solutions for enterprise, agentic and physical AI factories, including advanced superchip AI infrastructure systems featuring the NVIDIA GB300 NVL72 architecture,, as well as systems and solutions for humanoid robots and smart manufacturing platforms – all available from the world’s largest electronics manufacturing service provider. A centerpiece of Foxconn’s industry leadership at this year’s COMPUTEX will be Tuesday’s keynote by Foxconn Chairman Young Liu, outlining the competitive edge generative artificial intelligence plus robotics offer to enterprises in their quest for innovation and for Foxconn as it optimizes its three intelligent platforms. Thanks to genAI driving strong growth momentum in the global robotics industry, Foxconn’s collaboration with key partners will be a highlight of its exhibits this year covering robotics from application to manufacturing. “GenAI plus robotics can assist, augment and optimize the way humans can innovate,” said Chairman Liu. “Foxconn’s three smart platforms all are connected to NVIDIA’s brilliant technologies. With the progress of our Smart Manufacturing, Smart EV and Smart City, Foxconn will help accelerate AI factories to become the standard for enterprise IT transformation underpinned by the NVIDIA platform.” On the COMPUTEX stage for the first time, the Foxconn keynote begins at 0930 a.m. local time on 20 May 2025 on 7F at the Taipei Nangang Exhibition Center Hall 2. Foxconn continues to promote smart manufacturing at multiple locations around the world and is working with NVIDIA to optimize production processes through a variety of AI solutions. On the exhibit floor, at Foxconn Booth L0106, the physical display of NVIDIA GB300 NVL72 AI infrastructure for training and reasoning large language models (LLM) with mega-level parameters, represents the state-of-the-art computing core of the AI factory. Foxconn, which holds more than 40% of the global AI server market, is a major supplier of NVIDIA GB200 NVL72 and the upcoming GB300 NVL72 architecture. Moreover, the NVIDIA MGX 4U, also on display, is a highly flexible air-cooled server designed to meet the diverse computing needs of modern data centers. The system can be equipped with up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, combining advanced AI acceleration capabilities with professional-grade graphics performance to provide breakthrough acceleration for multiple workloads such as generative AI, graphics rendering, and video processing. Foxconn will also showcase the latest generation NVIDIA HGX B300 system. As the latest in the HGX architecture, B300 is designed for the AI inference era and has more powerful computing performance and higher memory capacity to meet the growing needs of AI model deployment. Continuing Foxconn's industry-leading vertical integration advantage in AI servers, the Group is also exhibiting a full range of high-speed signal, high-voltage power supply and liquid-cooled full-speed connection solutions, including: new generation AI chip slot solutions, motherboard PCIE high-speed connectors and cables, GB300 Power Clip, Busbar cable and other related products. Through these innovative solutions, Foxconn strengthens its AI server cooling integration capabilities and continues to provide efficient, stable and customizable thermal management services. In the field of robotics and smart manufacturing platforms, Foxconn’s Semiconductor Hybrid Robot will take a prominent place on the exhibit floor, combining its advanced visual recognition and precision motion technology to provide efficient and safe intelligent transportation solutions for the semiconductor industry. Meanwhile, the AI-powered Nurabot, jointly developed by Foxconn, Taichung Veterans General Hospital and Kawasaki Heavy Industries, leverages all three of NVIDIA’s computers for developing and deploying physical AI. Nurabot’s AI models are trained using their FoxBrain AI Factory powered by NVIDIA DGX SuperPOD, simulated using NVIDIA Omniverse, and deployed on NVIDIA Jetson.  This collaborative nursing robot is expected to be deployed to partner hospitals in Taiwan later this year andis estimated to be able to reduce nursing hours by 30% and improve care efficiency and quality.

19 May 2025, Taipei, Taiwan –. Hon Hai Technology Group (Foxconn) today announced that it is partnering with NVIDIA and to build a state-of-the-art AI Factory supercomputing center in Taiwan. This initiative aims to provide the latest NVIDIA Blackwell infrastructure to industry, government, and academia across the region, accelerating Taiwan’s research and application of artificial intelligence. At the same time, Foxconn’s subsidiary, Big Innovation Company, will become the first NVIDIA Cloud Partner (NCP) in Taiwan, further strengthening the collaboration between the two companies. As part of this initiative, Foxconn is establishing Big Innovation Company, a subsidiary building the AI Factory in Taiwan and further deepening collaboration with NVIDIA. Foxconn’s AI factory will be one of Taiwan’s most powerful supercomputers, based on the NVIDIA Blackwell platform providing high performance computing  to industry, government and academia. TSMC researchers plan to leverage the system to advance their research and development with orders-of-magnitude faster performance, compared with previous-generation systems. “Share, collaborate and thrive. Foxconn is partnering with global leaders to shape a smarter way of life. This NVIDIA AI factory is laying the foundation for government, industry and academia to propel Taiwan toward its next era of innovation,” said Foxconn Chairman Young Liu. “NVIDIA AI factories are the infrastructure for the age of AI and robotics,” said Jensen Huang, Founder and CEO of NVIDIA. “Together, Foxconn and NVIDIA are building a state-of-the-art AI infrastructure for Taiwan's world-leading technology and electronics ecosystem.” “At TSMC, innovation lies at the heart of everything we do. By harnessing advanced AI infrastructure, we empower our researchers to accelerate breakthroughs in semiconductor technology, enabling next-generation solutions for our customers and the world,” said Dr. C.C. Wei, Chairman and CEO of TSMC. “Leveraging this AI factory reinforces our commitment to pushing the limits of AI-driven innovation.” The supercomputer will be equipped with NVIDIA Blackwell Ultra systems, including GB300 NVL72 rack system solutions, equipped with NVIDIA NVLink, NVIDIA Quantum InfiniBand and NVIDIA Spectrum-X Ethernet networking, and will become an important engine for the development of Foxconn's three major strategic platforms: Smart Manufacturing, Smart EV, Smart City. Foxconn joins a global network of NCPs, which offer hosted computing and  services using high-performance infrastructure built with NVIDIA GPUs, networking, and AI software. Foxconn will also contribute computing from the new AI Factory to  NVIDIA DGX Cloud Lepton, an AI platform and marketplace recently announced, which will further expand developers and enterprises' access to the global NVIDIA GPU ecosystem.  

To help meet increasing international customer demand faster and cost effectivelySan Francisco, CA and Taipei, Taiwan – May 16, 2025 – Robust.AI, a leader in AI-driven warehouse automation, today announced a strategic manufacturing partnership with Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturing services provider, to expand production of its flagship Carter™ multi-function collaborative robotics platform. The partnership will enable Robust.AI to rapidly fulfill increasing demand from its growing international customer base and strengthen the resilience of its supply chain and manufacturing operations. According to a recent Global Market Insights report, the warehouse automation market is forecasted to grow from $26.5 billion in 2024 to $115.8 billion by 2034 – a CAGR of 15.9%. However, 80% of warehouses lack any automation – not even a conveyor belt according to ResearchandMarkets. While AI is poised to create efficiencies in many industries, labor-intensive jobs in logistics and manufacturing require improvements in both physical capabilities and digital intelligence. Designed to augment existing warehouse operations and workforce, Carter’s drop-in automation capabilities help global manufacturing and logistics providers achieve significant productivity gains. Its collaborative, software-defined functionality allows facilities to dynamically switch functions between fulfillment picking, point-to-point transport, or a mobile sorting wall. This unprecedented flexibility enables customers to easily adapt to changing needs and workflows without additional infrastructure costs. Robust.AI recently announced that its Carter fleet deployment at a DHL Supply Chain facility in Las Vegas, NV, delivered more than 60% productivity gains to existing picking operations within weeks of implementation. “As shifting supply chains and international tariffs add complexity and costs to global logistics operations, our strategic manufacturing partnership with Foxconn will enable us to rapidly fulfil orders for Carter robots, which are delivering improved productivity and efficiency to some of the world’s largest logistics and manufacturing companies,” said Anthony Jules, CEO of Robust.AI. “Foxconn’s unparalleled global manufacturing capabilities make it one of the most trusted partners for advanced manufacturing in the world. Our combined robotics expertise will help multinational companies rapidly and cost-effectively streamline their logistics and warehousing operations and augment existing workforces with collaborative robotic automation solutions.” “Foxconn is pleased to expand its manufacturing partnership with Robust.AI and help accelerate and scale the production of its innovative Carter robotics platform worldwide,” said Bob Deng, EVP at Foxconn. “Our close collaboration at the onset of Carter’s development has contributed to the maturity, scalability and reliability of the platform and its manufacturing processes, allowing customers to confidently invest in Robust.AI’s unique warehouse automation solution and see immediate improvement in their warehousing and logistics capabilities.”  As part of its “3+3” development strategy, Foxconn has been building a diverse range of robots tailored to different application scenarios, and has even gone further to assist customers in manufacturing their own robotic products. The partnership with Robust.AI marks another milestone for Foxconn in the robotics industry. Over the past few months, Foxconn engineers have been working closely with Robust AI, training and helping build Carter robots in the U.S. for the past several months, which will greatly decrease production and deployment times as manufacturing scales.   About Robust.AI Robust.AI is founded and led by a world-class robotics team. We bring AI, robotics, and human-centered design together to make robots broadly useful, effortless to adopt, and delightful to use. For more information, visit www.robust.ai. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

·      1Q25 net profit surges 91% on-year, operating profit up 27% on-year ·      AI server revenue in 2Q expected to nearly double on-quarter & on-year ·      Adjusts 2025 outlook to significant growth from strong growth citing forex ·      Hopes more EV opportunities follow Mitsubishi milestone---14 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its first quarter 2025 financial results. In the first quarter, revenue reached a record high for the period at NT$1.6443 trillion. Net profit attributable to the parent company hit NT$42.1 billion, jumping 91% on year, up by NT$20.1 billion. Earnings per share in the January-March period was NT$3.03. Looking ahead to the second quarter, although a traditionally low season, significant growth can be achieved both on-quarter and on-year, driven by increased demand in the product segments of cloud and networking, and components and others. The full-year outlook is adjusted to significant growth, as revenue conversion into New Taiwan dollars is impacted by exchange rates. However, revenue in US dollars remains unchanged. In the first quarter of 2025, revenue reached NT$1.6443 trillion, up 24% from a year ago. Gross profit was NT$100.5 billion, rising 20% for the same period, while operating profit at NT$46.5 billion, gained 27%, and net profit (attributable to parent company) totaled NT$42.1 billion, surging 91% at the same time. Gross profit margin, operating profit margin and net profit margin were 6.11%, 2.83% and 2.56%, respectively, compared with 6.32%, 2.78% and 1.66% in the same period last year; both operating profit and net profit margins improved; EPS reached NT$3.03, up by NT$1.44 from NT$1.59 in the same period last year. The keyword to sum up first quarter performance is without a doubt: “A.I.” Foxconn Chairman Young Liu reiterated the view that 2025 is the first year of AI, saying that the performance of the AI server business is quite impressive, with revenue growing by more than 50% compared to the same period last year, indicating that demand for computing power is still very strong. Whether AI servers or general-purpose servers, shipment performance has improved significantly. "As our level of automation continues to improve, the production yield is also getting better and better. As I mentioned at the last investor call, the performance of AI servers should be better quarter by quarter," said Chairman Liu. AI server revenue in the second quarter is anticipated to nearly double both on-quarter and on-year. Moreover, we have great confidence in the growth momentum of AI servers this year. As the AI server business continues to expand, the proportion of the cloud and networking product segment this year will be close to that of the smart consumer electronics product segment, he said. Despite being confronted by the geopolitical impact on the economic and trade environment, Foxconn foresaw four to five years ago that "regional manufacturing" would become a trend and began expanding its manufacturing capabilities into different regions at that time. Deploying agile supply chain management and local production strategies, we now have a solid foothold in 233 sites worldwide. The Group's global production bases span 24 countries. In addition to Asia as the main base, we have more than 50 sites in the Americas, and more than 10 sites each in Europe and India. We have accumulated many years of local operating experience and abundant human resources in various regions. This layout allows us to respond quickly to customer needs. Chairman Liu pointed out that in addition to tariffs, geopolitics, and changes in monetary policy around the world that may affect the global economy, and even though current sales forecast have not changed much, the exchange rate may affect revenue after conversion into New Taiwan dollars. Compared to the view in March, the Group is more cautious and is slightly adjusting its outlook to significant growth from strong growth. Chairman Liu also shared news about the Group’s cooperation with Mitsubishi Motors Corp. In the future, we expect to assist Mitsubishi in selling models we design and develop for Oceania, he said, adding that this hits one of our most important EV milestones: securing orders from traditional automakers. Step by step, the Group is realizing its EV business goals. He said that we hope this cooperation with Mitsubishi will lead to opportunities to team up with more international automakers in the future, including other traditional Japanese automakers. Meanwhile, MODEL B should officially begin mass production in the second half of this year. On another front, with batteries being the most critical component in electric vehicles, the Kaohsiung Ho Fa plant already has the capacity for mass production and is providing products to customers for testing. Subsequently, the Group will complement the planning progress of domestic electric bus and commercial vehicle customers to assist in meeting the annual goal of localizing electric vehicles. In the semiconductor field, Chairman Liu pointed out the Group has technical specifications that are superior to the industry in the field of next-generation SiC MOSFET, which can significantly improve power conversion efficiency and reduce energy waste; mass production is expected in the second half of this year. The acquisition of the Fukuyama wafer plant in Japan also goes toward expanding the Group’s semiconductor footprint. Subsidiary Foxsemicon Integrated Technology Inc, which is responsible for semiconductor equipment, also earlier disclosed it would acquire FairTech Corp, which will support Foxconn in potential expansion in the aerospace industry. This will also allow the Group to expand into the drone industry, and, futurely by integrating existing industry technologies, to create more applications. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

World’s largest electronics manufacturer signals responsible innovation & IP defense13 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) announced today that it has joined LOT Network, the leading global patent licensing platform and non-profit community dedicated to protecting companies from costly litigation initiated by patent assertion entities (PAEs). The world’s largest electronics manufacturer and a global leader in technology solutions now joins a robust network of over 5,000 companies, including half of the top 20 U.S. patent holders and major corporations from the S&P Global 100 and Fortune 100. "Electronics manufactured by Foxconn form the backbone of many global industries. It’s our responsibility to proactively protect our customers and our innovation ecosystem," said Dr. Mick Lin, Director of the IP Affairs Division at Foxconn. "Joining LOT Network ensures our resources remain focused on delivering innovative products rather than litigation. We encourage other industry leaders to take similar proactive steps." “Given Foxconn’s global influence and extensive IP holdings, their decision to join LOT Network will directly benefit virtually every company in our membership community,” said Ken Seddon, CEO of LOT Network. He continued, “We have seen that the growing global threats posed by PAEs, especially with the recent introduction of Europe’s Unitary Patent Court and intensified PAE activities worldwide, are driving leaders to focus on comprehensive IP strategies. We are pleased to welcome Foxconn, and applaud their commitment to leadership, innovation and managing evolving risk.” Advancing community protections Foxconn owns an extensive IP portfolio, bringing over 55,000 patent assets spanning consumer electronics, cloud computing, networking solutions, and advanced manufacturing processes into the LOT Network community. Foxconn makes four out of every ten electronics devices in the world, covering numerous products essential to modern life, from smartphones and computers to automotive electronics, cloud infrastructure, healthcare devices, and renewable energy systems. Recent shifts in the patent litigation landscape have heightened the importance of proactive intellectual property management. If a patent owned by a member is later transferred to a PAE, all other members automatically receive a license to that patent – effectively neutralizing it as a litigation threat. Foxconn’s strategic decision to join LOT Network underscores its commitment to safeguarding innovation amidst policy changes that significantly alter patent litigation dynamics.   About LOT Network here. About Foxconn here.

[San Jose, USA – May 2025] — At SID Display Week 2025, the world's premier display industry event, Porotech proudly leads the "One-Stop AR Solution Alliance" alongside key partners Foxconn, Rayprus, GIS, and Jorjin with a grand showcase at the San Jose McEnery Convention Center. This joint exhibition will present a comprehensive, one-stop AR solution spanning materials, optical engines, optical modules, AR glasses full system assembly, and mass production—propelling AR technologies from innovation to commercial reality. Porotech Leads the Charge to Build the World's Most Complete AR Supply Chain As the alliance's core technology leader, Porotech has pioneered the industry's first 8-inch platform designed specifically for MicroLED applications. It achieved a breakthrough pixel pitch of just 1.25μm, demonstrating the boundless potential of GaN-on-Si MicroLED technology. As part of its drive toward commercialization, Porotech has announced the launch of its latest red LED innovation — SpectraCore™. Not only offering 5 times the brightness of any other conventional red emitters, SpectraCore™ also features an ultra-narrow emission spectrum and exceptional color purity. More excitingly, the wavelength remains remarkably stable under all driving conditions, showcasing superior thermal stability and long-term reliability. With this achievement, Porotech has overcome one of the biggest barriers to full-color MicroLED displays: the performance and stability of red emitters. By leveraging its proprietary 8-inch wafer platform to ensure scalable mass production, Porotech is laying the essential groundwork for full-color near-eye displays and marking a critical step forward in the commercialization of MicroLED technology. InGaN Red addresses longstanding challenges in microdisplay technologies. Traditional AlInGaP-based red LEDs have faced issues with low efficiency and poor reliability, hindering their adoption in consumer electronics. Porotech, the first company to commercialize InGaN-based red LEDs in 2021, shattered this technological barrier. InGaN red LEDs deliver superior efficiency and reliability, with optoelectronic properties closely aligned with InGaN blue and green materials — enabling seamless platform integration. However, technical challenges like wavelength drift, broad emission linewidth, and limited color purity have persisted. With SpectraCore, Porotech once again leads the industry by launching an InGaN red LED that excels in brightness, efficiency, and color purity. This LED injects new momentum into AR microdisplay applications and advances full-color microled realization. At SID Display Week 2025, Porotech will demonstrate its comprehensive vertical integration capabilities across the MicroLED ecosystem—from material innovation, wafer processing, Chip-on-Carrier (COC), Chip-on-Wafer (COW), LED chip fabrication, and final panel applications—solidifying its critical role as a catalyst for MicroLED commercialization. Together with its alliance partners, Porotech will unveil the blueprint for next-generation AR display technologies, setting a new global benchmark. Building the strongest AR solution alliance: l   Rayprus: High-Performance AR Optical Engine Modules Rayprus will present its latest AR optical engine technology, featuring high brightness, low power consumption, and precise color management. These modules enable the miniaturization and performance enhancement of advanced AR devices. l   GIS: Advanced Waveguides and Optical Module Integration GIS will showcase lightweight optical waveguides and optical modules, delivering crystal-clear imaging and wide field-of-view designs. With a proven track record of collaborations with global brands, GIS provides complete, high-performance optical solutions for the next generation of AR glasses. l   Jorjin: AR Glasses Design, Manufacturing, and Customization Jorjin will display its latest AR glasses prototypes, highlighting its integrated optical and electronic engineering expertise and ergonomic design. Jorjin's customized design services empower brands and enterprises to deliver market-ready smart wearable devices, fostering the growth of diverse AR applications. l   Foxconn: Full-System Assembly and Mass Production Expertise As a global leader in electronics manufacturing, Foxconn plays the pivotal role of final integrator within the One-Stop AR Solution Alliance. It provides complete AR system assembly and scalable mass production capabilities, bridging the gap between R&D and market deployment. AR Commercialization Enters the Fast Lane — Join Us at SID 2025! SID Display Week 2025 is the world's most influential event in the display industry. The One-Stop AR Solution Alliance showcases the industry's most cutting-edge technological breakthroughs and demonstrates a clear commitment to accelerating AR commercialization. With Porotech at the helm and Foxconn providing robust manufacturing support, complemented by the advanced capabilities of Rayprus, GIS, and Jorjin, the alliance delivers the complete AR solutions, empowering partners to shorten development cycles, reduce integration barriers and transition AR technologies from concept to market reality. We warmly invite industry leaders, technology innovators, and investors to visit the One-Stop AR Solution Alliance at SID 2025 and witness the future of the AR industry firsthand! ====Event Information – SID Display Week 2025==== ·       Date: May 13–15, 2025 ·       Location: San Jose McEnery Convention Center, USA ·       Booth Number: 1208   The "One-Stop AR Solution Alliance" is set to lead the future of smart technologies, and we look forward to creating a new era of AR with you!