To help meet increasing international customer demand faster and cost effectivelySan Francisco, CA and Taipei, Taiwan – May 16, 2025 – Robust.AI, a leader in AI-driven warehouse automation, today announced a strategic manufacturing partnership with Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturing services provider, to expand production of its flagship Carter™ multi-function collaborative robotics platform. The partnership will enable Robust.AI to rapidly fulfill increasing demand from its growing international customer base and strengthen the resilience of its supply chain and manufacturing operations. According to a recent Global Market Insights report, the warehouse automation market is forecasted to grow from $26.5 billion in 2024 to $115.8 billion by 2034 – a CAGR of 15.9%. However, 80% of warehouses lack any automation – not even a conveyor belt according to ResearchandMarkets. While AI is poised to create efficiencies in many industries, labor-intensive jobs in logistics and manufacturing require improvements in both physical capabilities and digital intelligence. Designed to augment existing warehouse operations and workforce, Carter’s drop-in automation capabilities help global manufacturing and logistics providers achieve significant productivity gains. Its collaborative, software-defined functionality allows facilities to dynamically switch functions between fulfillment picking, point-to-point transport, or a mobile sorting wall. This unprecedented flexibility enables customers to easily adapt to changing needs and workflows without additional infrastructure costs. Robust.AI recently announced that its Carter fleet deployment at a DHL Supply Chain facility in Las Vegas, NV, delivered more than 60% productivity gains to existing picking operations within weeks of implementation. “As shifting supply chains and international tariffs add complexity and costs to global logistics operations, our strategic manufacturing partnership with Foxconn will enable us to rapidly fulfil orders for Carter robots, which are delivering improved productivity and efficiency to some of the world’s largest logistics and manufacturing companies,” said Anthony Jules, CEO of Robust.AI. “Foxconn’s unparalleled global manufacturing capabilities make it one of the most trusted partners for advanced manufacturing in the world. Our combined robotics expertise will help multinational companies rapidly and cost-effectively streamline their logistics and warehousing operations and augment existing workforces with collaborative robotic automation solutions.” “Foxconn is pleased to expand its manufacturing partnership with Robust.AI and help accelerate and scale the production of its innovative Carter robotics platform worldwide,” said Bob Deng, EVP at Foxconn. “Our close collaboration at the onset of Carter’s development has contributed to the maturity, scalability and reliability of the platform and its manufacturing processes, allowing customers to confidently invest in Robust.AI’s unique warehouse automation solution and see immediate improvement in their warehousing and logistics capabilities.”  As part of its “3+3” development strategy, Foxconn has been building a diverse range of robots tailored to different application scenarios, and has even gone further to assist customers in manufacturing their own robotic products. The partnership with Robust.AI marks another milestone for Foxconn in the robotics industry. Over the past few months, Foxconn engineers have been working closely with Robust AI, training and helping build Carter robots in the U.S. for the past several months, which will greatly decrease production and deployment times as manufacturing scales.   About Robust.AI Robust.AI is founded and led by a world-class robotics team. We bring AI, robotics, and human-centered design together to make robots broadly useful, effortless to adopt, and delightful to use. For more information, visit www.robust.ai. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

·      1Q25 net profit surges 91% on-year, operating profit up 27% on-year ·      AI server revenue in 2Q expected to nearly double on-quarter & on-year ·      Adjusts 2025 outlook to significant growth from strong growth citing forex ·      Hopes more EV opportunities follow Mitsubishi milestone---14 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its first quarter 2025 financial results. In the first quarter, revenue reached a record high for the period at NT$1.6443 trillion. Net profit attributable to the parent company hit NT$42.1 billion, jumping 91% on year, up by NT$20.1 billion. Earnings per share in the January-March period was NT$3.03. Looking ahead to the second quarter, although a traditionally low season, significant growth can be achieved both on-quarter and on-year, driven by increased demand in the product segments of cloud and networking, and components and others. The full-year outlook is adjusted to significant growth, as revenue conversion into New Taiwan dollars is impacted by exchange rates. However, revenue in US dollars remains unchanged. In the first quarter of 2025, revenue reached NT$1.6443 trillion, up 24% from a year ago. Gross profit was NT$100.5 billion, rising 20% for the same period, while operating profit at NT$46.5 billion, gained 27%, and net profit (attributable to parent company) totaled NT$42.1 billion, surging 91% at the same time. Gross profit margin, operating profit margin and net profit margin were 6.11%, 2.83% and 2.56%, respectively, compared with 6.32%, 2.78% and 1.66% in the same period last year; both operating profit and net profit margins improved; EPS reached NT$3.03, up by NT$1.44 from NT$1.59 in the same period last year. The keyword to sum up first quarter performance is without a doubt: “A.I.” Foxconn Chairman Young Liu reiterated the view that 2025 is the first year of AI, saying that the performance of the AI server business is quite impressive, with revenue growing by more than 50% compared to the same period last year, indicating that demand for computing power is still very strong. Whether AI servers or general-purpose servers, shipment performance has improved significantly. "As our level of automation continues to improve, the production yield is also getting better and better. As I mentioned at the last investor call, the performance of AI servers should be better quarter by quarter," said Chairman Liu. AI server revenue in the second quarter is anticipated to nearly double both on-quarter and on-year. Moreover, we have great confidence in the growth momentum of AI servers this year. As the AI server business continues to expand, the proportion of the cloud and networking product segment this year will be close to that of the smart consumer electronics product segment, he said. Despite being confronted by the geopolitical impact on the economic and trade environment, Foxconn foresaw four to five years ago that "regional manufacturing" would become a trend and began expanding its manufacturing capabilities into different regions at that time. Deploying agile supply chain management and local production strategies, we now have a solid foothold in 233 sites worldwide. The Group's global production bases span 24 countries. In addition to Asia as the main base, we have more than 50 sites in the Americas, and more than 10 sites each in Europe and India. We have accumulated many years of local operating experience and abundant human resources in various regions. This layout allows us to respond quickly to customer needs. Chairman Liu pointed out that in addition to tariffs, geopolitics, and changes in monetary policy around the world that may affect the global economy, and even though current sales forecast have not changed much, the exchange rate may affect revenue after conversion into New Taiwan dollars. Compared to the view in March, the Group is more cautious and is slightly adjusting its outlook to significant growth from strong growth. Chairman Liu also shared news about the Group’s cooperation with Mitsubishi Motors Corp. In the future, we expect to assist Mitsubishi in selling models we design and develop for Oceania, he said, adding that this hits one of our most important EV milestones: securing orders from traditional automakers. Step by step, the Group is realizing its EV business goals. He said that we hope this cooperation with Mitsubishi will lead to opportunities to team up with more international automakers in the future, including other traditional Japanese automakers. Meanwhile, MODEL B should officially begin mass production in the second half of this year. On another front, with batteries being the most critical component in electric vehicles, the Kaohsiung Ho Fa plant already has the capacity for mass production and is providing products to customers for testing. Subsequently, the Group will complement the planning progress of domestic electric bus and commercial vehicle customers to assist in meeting the annual goal of localizing electric vehicles. In the semiconductor field, Chairman Liu pointed out the Group has technical specifications that are superior to the industry in the field of next-generation SiC MOSFET, which can significantly improve power conversion efficiency and reduce energy waste; mass production is expected in the second half of this year. The acquisition of the Fukuyama wafer plant in Japan also goes toward expanding the Group’s semiconductor footprint. Subsidiary Foxsemicon Integrated Technology Inc, which is responsible for semiconductor equipment, also earlier disclosed it would acquire FairTech Corp, which will support Foxconn in potential expansion in the aerospace industry. This will also allow the Group to expand into the drone industry, and, futurely by integrating existing industry technologies, to create more applications. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

World’s largest electronics manufacturer signals responsible innovation & IP defense13 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) announced today that it has joined LOT Network, the leading global patent licensing platform and non-profit community dedicated to protecting companies from costly litigation initiated by patent assertion entities (PAEs). The world’s largest electronics manufacturer and a global leader in technology solutions now joins a robust network of over 5,000 companies, including half of the top 20 U.S. patent holders and major corporations from the S&P Global 100 and Fortune 100. "Electronics manufactured by Foxconn form the backbone of many global industries. It’s our responsibility to proactively protect our customers and our innovation ecosystem," said Dr. Mick Lin, Director of the IP Affairs Division at Foxconn. "Joining LOT Network ensures our resources remain focused on delivering innovative products rather than litigation. We encourage other industry leaders to take similar proactive steps." “Given Foxconn’s global influence and extensive IP holdings, their decision to join LOT Network will directly benefit virtually every company in our membership community,” said Ken Seddon, CEO of LOT Network. He continued, “We have seen that the growing global threats posed by PAEs, especially with the recent introduction of Europe’s Unitary Patent Court and intensified PAE activities worldwide, are driving leaders to focus on comprehensive IP strategies. We are pleased to welcome Foxconn, and applaud their commitment to leadership, innovation and managing evolving risk.” Advancing community protections Foxconn owns an extensive IP portfolio, bringing over 55,000 patent assets spanning consumer electronics, cloud computing, networking solutions, and advanced manufacturing processes into the LOT Network community. Foxconn makes four out of every ten electronics devices in the world, covering numerous products essential to modern life, from smartphones and computers to automotive electronics, cloud infrastructure, healthcare devices, and renewable energy systems. Recent shifts in the patent litigation landscape have heightened the importance of proactive intellectual property management. If a patent owned by a member is later transferred to a PAE, all other members automatically receive a license to that patent – effectively neutralizing it as a litigation threat. Foxconn’s strategic decision to join LOT Network underscores its commitment to safeguarding innovation amidst policy changes that significantly alter patent litigation dynamics.   About LOT Network here. About Foxconn here.

Takes successful baton from CC Lin and becomes first woman to hold role30 March 2025, Taipei, Taiwan – Underscoring a strong commitment to grow next generation leaders, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has named Kathy Yang Chiu-chin its rotating Chief Executive Officer, effective Monday, setting two major milestones in corporate governance leadership for the world’s largest electronics manufacturing service provider. Yang takes the baton as the second rotating CEO, continuing the bold commitment first set a year ago by Foxconn Chairman Young Liu to deepen sustainable leadership at the global technology giant. Yang’s appointment also makes her the first woman to hold the rotating CEO role, a recognition of the breadth of her expertise in global logistics, trade compliance and worldwide campus operation oversight. “Leadership planning is very important for enterprises that want their operations to be sustainable. The rotating CEO sytem is a key part of that,” said Chairman Liu. “This program equips General Managers with early exposure to Group-level leadership responsibilities, enabling them to develop the skills required for broader roles. Over time, this transitional system will cultivate a pool of leaders with proven expertise in both operational execution and organizational management.” Liu added that inaugural rotating CEO CC Lin, head of Foxconn’s E Business Group, fulfilled CEO responsibilities during his rotation in the past year and achieved outstanding performance in meeting operational goals, setting a good precedent. E Business Group includes gaming, thermal modules, lightweight metal chassis, PCB, EV electronic modules, among its business operation scope. Yang has more than three decades of experience in supply chain and logistics. “Through the strength of the organization and systems, we make corporate governance sustainable, building a more agile, more sustainable leadership structure that can quickly respond to market challenges,” she said. In taking up the relay baton, Yang will focus on business management, continue to promote management optimization and uphold Foxconn’s values to share, collaborate and thrive with its stakeholders. Yang concurrently serves as Foxconn’s Global Chief Campus Operation Officer, a new position established last year aimed at integrating and improving the Group’s global layout and enhancing the service support from headquarters to its campuses, particularly important amid geopolitical changes. She is also Foxconn’s Chief Logistics and Trade Compliance Officer, and is Chairperson and CEO of JUSDA , a leading logistics solutions provider and a key subsidiary of Foxconn. In her time at Foxconn, Yang has progressively taken on growing responsibilities in areas involving global reach, stakeholder engagement and industry domain knowledge. She now leads teams of over 8,000 people around the world. In 2015, Yang led the transformation of the internal logistics arm of Foxconn into an independent subsidiary named JUSDA, driving its annual revenue from USD120 million to today’s USD2.5 billion. Previous to her current roles, Yang spent nearly two decades with US global logistics leader United Parcel Service. Yang is a recognized winner by global diversity leader and champion of women in the C- suite, WeQual, in the Specialist category of the WeQual Awards, Asia-Pacific 2023. She was one of 24 finalists, from which winners were selected in eight categories following a rigorous and highly competitive assessment process.    About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and others. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

One of COMPUTEX’s organizers, TAITRA (Taiwan External Trade Development Council), announced that Young Liu, Chairman of Hon Hai Technology Group (Foxconn), is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision on three intelligent platforms driving industry transformation and the role of robotics in factories of the future. The keynote will be on 09:30, May 20, (UCT+8), at Taipei Nangang Exhibition Center Hall 2, 7F.Foxconn, a leading technology major, has been applying and enabling the acceleration of artificial intelligence, actively integrating AI technology to build its three core platforms for governments and clients: Smart Manufacturing, Smart EV, and Smart City. Under the bold leadership of Foxconn Chairman Young Liu, named a “Best CEO” in Institutional Investor’s All-Asia Executive Team rankings, the world’s largest electronics manufacturing service provider is transforming itself into a global technology company providing AI-powered, platform-based solutions. A recognized Top 100 Global Innovators by Clarivate, Foxconn is creating a new AI foundry, which represents not only a technological breakthrough but also a shift in mindset. By leveraging the knowledge and intelligence generated through Produce Token, the company aims to bring new value and possibilities to the industry. Its 3+3 strategy advances the company’s future growth in three major industries of electric vehicles, digital health and robotics, and three core technologies of AI, semiconductors and next-generation communications technologies. COMPUTEX 2025 with the theme "AI Next," is set to take place from May 20th to May 23rd at Taipei Nangang Exhibition Center Hall 1 & 2. This event will host nearly 1,400 exhibitors across 4,800 booths, showcasing three major themes: AI & Robotics, Next-Gen Tech, and Future Mobility.Registration for COMPUTEX Keynote will open at early April, please stay tuned and follow us on our website.

Humanoid robotics, GB300 NVL72 infrastructure & digital twins scaling out AI factories 18 March 2025, Taipei, Taiwan, and San Jose, California – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today unveiled the first comprehensive look at its progress toward humanoid robotics, unrivalled infrastructure for the next generation NVIDIA GB300 NVL72 platform, and digital twins accelerating AI factories of the future, at the premier conference on artificial intelligence, GTC 2025. The world’s largest electronics manufacturing service provider, this year in San Jose, brings a tour de force with more than double the delegation size from last year and participation in 6 GTC sessions, unpacking expertise from frontier AI to hybrid and nursing robots to the deployment of advanced physical AI and simulation solutions built on NVIDIA Omniverse and the Mega Omniverse Blueprint in sparking innovation around autonomous driving, smart manufacturing and digital healthcare.“You know Foxconn as the biggest manufacturer of the most advanced AI servers running on the planet's fastest superchips. We do more than that. At GTC we are showcasing how our Tier-1 excellence extends to Smart City, Smart Manufacturing and Smart EV,” said Foxconn Chairman Young Liu, leading a corporate delegation of more than 70 engineers and executives. “This stellar event brings together great partners to exchange insights on where AI is heading. We are delighted to once again support NVIDIA.”On rare display at Foxconn’s GTC Booth 323, a model of the next generation GB300 NVL72 server rack, designed and developed in collaboration with NVIDIA, visually demonstrates the AI infrastructure behind the training and inference of trillion-parameter large language models (LLMs), serving as the computational engine of the AI Factory. From the manufacturing of the NVIDIA GB200 NVL72 to GB300 NVL72 platforms, Foxconn is committed to ensuring optimal computing performance and is qualified as a PBR (Pilot Build Request) Partner by NVIDIA. The advanced superchip ecosystem is accelerated by NVIDIA Blackwell architecture and Foxconn subsidiary Ingrasys’ superior liquid cooling solutions, which utilizes digital twin simulation solutions built on NVIDIA Omniverse to optimize server cooling and data center designs to ensure efficient and stable operations.Foxconn’s optimization of smart manufacturing excellence is happening across its large global footprint, complemented by NVIDIA AI solutions including the NVIDIA AI blueprint for video search and summarization (VSS) for operations and safety monitoring. Alongside real-time simulations of factory layouts and fleet operations on the exhibit floor to showcase how AI drives real-world scenarios, the GTC session – How to Use NVIDIA Omniverse on Smart Factory Design: The Fii Omniverse Digital Twin Project on NVIDIA GB200 Grace Blackwell Superchip Production Line – will tease out the possibility of how Foxconn’s sustainable lighthouse factories can be replicated and exported to industry partners as solutions to scale out AI factories of the future. Foxconn, a Diamond sponsor this year, has also set up a Robotics Zone to exhibit its Hybrid Robot that supports semiconductor and automation needs with advanced vision recognition and precision mobility. The GTC session – Reinventing Smart Manufacturing: How Foxconn Builds and Deploys an AI Workforce – will detail how the AI Factory can deliver agentic AI and physical AI applications like Factory GPT and embodied intelligence robots. Foxconn’s Nurabot is debuting at GTC; it is a nursing collaborative robot that optimizes medical workflows and enhances patient care and is scheduled to be deployed later this year into partner hospitals in Taiwan. During the on-demand GTC session – Transform Patient Care With Digital Twins and Nursing Collaborative RobotsTransform Patient Care With Digital Twins and Nursing Collaborative Robots – senior Foxconn executives will detail for the first time at a major conference the first digital twin of a busy hospital ward in Taiwan. In another first, GTC session – From Open Source to Frontier AI: Build, Customize, and Extend Foundation Models – will detail FoxBrain, the first Traditional Chinese Large Language Model (LLM) with reasoning capabilities that is expected to become an important engine to drive the upgrade of Foxconn’s three major platforms: Smart Manufacturing. Smart EV. Smart City.Meet a cool avatar at the on-demand GTC session – Improving Road Safety with GenAI, Metropolis, and NVIDIA Omniverse – and pick up a unique chocolate token at our GTC Booth 323. Information on exhibit hall and hours can be found here.More on Foxconn’s GTC sessions here.How to Use NVIDIA Omniverse on Smart Factory Design: The Fii Omniverse Digital Twin Project on NVIDIA GB200 Grace Blackwell Superchip Production Line (Presented by Foxconn) [S74429]Reinventing Smart Manufacturing: How Foxconn Builds and Deploys an AI Workforce [S72841]From Open Source to Frontier AI: Build, Customize, and Extend Foundation Models [S74035]Improving Road Safety with GenAI, Metropolis, and NVIDIA Omniverse [S74446]Transform Patient Care With Digital Twins and Nursing Collaborative Robots [S74078]Physical AI for the Next Frontier of Industrial Digitalization [S73232; panel session]

Former world No. 1’s from South Korea and Taiwan reunite in competition 5 February 2025, Taipei, Taiwan – The LPGA of Taiwan (TLPGA), in collaboration with title sponsor Hon Hai Technology Group (Foxconn), is proud to announce the player roster for the 2nd annual Foxconn TLPGA Players Championship, bringing together a tour de force of 90 women athletes from 11 countries competing for a benchmark US$1.5 million purse. Among the elite talent are 12 pro-golfers ranked in the world’s top 100 from TLPGA, JLPGA, KLPGA and the Ladies European Tour (LET). At the same time, it will be game on for two former World No. 1 golfers, Jiyai Shin of South Korea and Yani Tseng of Taiwan, as they compete together again for the first time in a decade. Also swinging for the home team are Foxconn-sponsored rising star Chia-Yen Wu, ranked No. 3 in Taiwan, and Pei-Yun Chien, Taiwan’s top player in world rankings. Defending champion from last year, Haruka Kawasaki of Japan, will return with 22 other JLPGA stars, including titleholders Shiho Kuwaki and Yuri Yoshida. KLPGA’s Su-Ji Kim (ranked 39) and You-Min Hwang (ranked 50), along with Switzerland’s Chiara Tamburlini (ranked 66 in the world and No. 1 on LET’s leaderboard) and France’s Perrine Delacour (No. 15 on LET’s leaderboard), add to the excitement in making their debut at the Orient Golf & Country Club in Taiwan for the tournament from February 27 to March 2. The line-up represents players from Taiwan, Japan, South Korea, Thailand, China, India, Singapore, France, the United Kingdom, Switzerland and Sweden, who will be competing not only for the lucrative purse, but also 18 champion ranking points, in what has become one of the highest-level tournaments in Asia. This year's tournament includes raffles, vouchers, delicious food trucks and an unforgettable golf experience. Games for points win prizes daily, including airline tickets, SHARP appliances, Belkin accessories, an iPhone 16 and an iPad Air. Free shuttle buses will operate daily from Taipei’s National Taiwan Museum and the Airport MRT A7 Station. The 2025 Foxconn TLPGA Players Championship will air live on VL Sports and Sportcast Sports in Taiwan, and in Japan on Sky A. Follow the action and stay updated through the tournament’s official Facebook page. About TLPGA here. About Foxconn here.

l   Women pro golfers in top 100 among competitors in 2nd annual tournamentl   Defending champion Haruka Kawasaki of Japan sets sights on back-to-back titlesl   Comeback in Taiwan for former World No 1 Jiyai Shin of South Koreal   Foxconn-sponsored Chia-Yen Wu, hometown favorite, spotlighted for 2nd year【Taipei, Taiwan – January 3, 2025】The LPGA of Taiwan (TLPGA), in collaboration with title sponsor Hon Hai Technology Group (Foxconn), is thrilled to announce the 2025 Foxconn TLPGA Players Championship. In its second edition, top women pro golfers will compete for a record-breaking total purse of US$1.5 million, marking a 50% increase from last year and setting a new benchmark for the TLPGA Tour.The multi-day tournament will take place from February 27 to March 2 at the Orient Golf & Country Club in Taiwan, where the event was inaugurated in 2024. For the first time, the TLPGA-sanctioned tournament will feature international live broadcast coverage, airing in Japan on Sky A, alongside VL Sports and Sportcast Sports in Taiwan.Raising the Bar with World-Class CompetitionThe 2025 Foxconn TLPGA Players Championship sets itself apart with its exceptional ranking points, substantial prize money, and elite sportsmanship. Foxconn, the world’s largest electronics manufacturing service provider and as the title sponsor, is honored to drive the TLPGA Tour’s international presence and competitive growth.Aim High. Swing Brilliantly.The 2025 Foxconn TLPGA Players Championship has attracted over 140 international players since registration opened in December 2024, showcasing the tournament’s growing prestige. Leading the field are defending champion Haruka Kawasaki of Japan and last year’s runner-up Yu-Sang Hou of Taiwan. Foxconn-sponsored rising star Chia-Yen Wu, the 20-year-old currently ranked among the top three in Taiwan, will compete for the second year.Adding to the excitement, former World No. 1 Jiyai Shin of South Korea will make her highly anticipated return to Taiwan after seven years, entering as a top contender following her recent triumph at the ISPS Handa Australian Open. This year’s match is set to feature over ten elite players ranked among the world’s top 100. Following the impressive performances by Japanese players last year, the 2025 Foxconn TLPGA Players Championship will see more than 15 players from the JLPGA Tour competing for the championship trophy. The final player roster will be announced on January 17, 2025. Caption: The 2025 Foxconn TLPGA Players Championship features a 50% increase in the total purse, reaching a record-breaking $1.5 million, the highest in the history of the TLPGA-sanctioned Tour. The tournament will return to the Orient Golf & Country Club for the second year.Caption: Former World No. 1 Jiyai Shin, fresh from her 2024 Women’s Australian Open win, and defending champion Haruka Kawasaki, with three JLPGA titles in 2024, are top contenders for this year’s championship.

Imec invites the global automotive ecosystem to join its effort to mutually explore the opportunities presented by chiplet technology LEUVEN (Belgium), October 10, 2024 — Today, at an exclusive gathering in Detroit, bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP). The program brings together stakeholders from across the automotive ecosystem in a pre-competitive research effort unparalleled in the car manufacturing industry. The program’s goal is to evaluate which chiplet architectures and packaging technologies are best suited to support car manufacturers' specific high-performance computing and strict safety requirements, while striving to extend the benefits of chiplet technology – such as increased flexibility, improved performance and cost savings – to the entire automotive industry.  Car makers have been integrating chip technology into their vehicles since the late 1970s. Lately, however, traditional chip architectures have struggled to meet the requirements of ever more demanding automotive solutions, such as advanced driver assistance systems (ADAS) and immersive in-vehicle infotainment (IVI) services. Enter chiplets – i.e., modular chips that are specifically designed to perform specialized functions efficiently and can be seamlessly combined to create more sophisticated compute systems. “The adoption of chiplet technology would signal a disruptive shift in central vehicle computer design, offering distinct advantages over traditional monolithic approaches. Chiplets facilitate rapid customization and upgrades, while reducing development time and costs,” explained Bart Placklé, vice-president of automotive technologies at imec. “However, moving to a chiplet architecture is prohibitively expensive for OEMs if done in isolation. Commercial viability thus hinges on industry alignment around a set of chiplet standards, enabling car manufacturers to procure chiplets from the market and integrate them with proprietary chiplets to build unique offerings.” In search of a chiplet architecture that combines performance, energy efficiency, robustness, cost effectiveness and customization Companies developing supercomputing, data center and smartphone solutions have long explored the benefits of chiplet technology to meet their rapidly increasing computing needs. But the automotive industry has been somewhat more reluctant to embrace the chiplet paradigm due to the unique challenges they face. First, automotive solutions must meet strict robustness and reliability requirements, ensuring continuous operation and passenger safety over a car's typical lifespan of ten to fifteen years. Moreover, cost is another crucial factor to consider. And, finally, superior performance and exceptional energy efficiency are critical to preserving a car's battery life. These are some of the urgent issues imec's Automotive Chiplet Program will address.  A pre-competitive, collaborative research effort unparalleled in the automotive industry Imec’s Automotive Chiplet Program leverages imec’s world-leading track record in advanced 2.5D and 3D packaging with resources and expertise from different parts of the automotive value chain. Bart Placklé: “The agility of chiplets will allow the automotive ecosystem to respond quickly to changing market demands and technological breakthroughs. They also facilitate flexible component integration, limiting the risk of vendor lock-in and improving supply chain resilience. In addition, their optimized performance leads to lower power requirements, enabling compact device design.” “We are convinced that all stakeholders will gain important insights from the program’s pre-competitive, collaborative approach – leveraging the partners’ collective wisdom and means to make rapid progress.  The valuable precompetitive learnings from the program can be instantiated in further R&D and product innovation to accelerate the partners’ own differentiating, long-term roadmaps. In fact, this methodology mirrors the successful practices established in the semiconductor industry over the past four decades. With 40 years of experience in designing, building, and optimizing chip architectures and technologies, and without allegiance to any stakeholder in the automotive ecosystem, imec is uniquely positioned to guide the car manufacturing industry towards the development of a groundbreaking new chiplet architecture tailored to the sector’s specific needs,” he concluded.   About imec Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec leverages its state-of-the-art R&D infrastructure and its team of more than 5,500 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence, beyond 5G communications and sensing technologies, and in application domains such as health and life sciences, mobility, industry 4.0, agrofood, smart cities, sustainable energy, education, … Imec unites world-industry leaders across the semiconductor value chain, Flanders-based and international tech, pharma, medical and ICT companies, start-ups, and academia and knowledge centers. Imec is headquartered in Leuven (Belgium), and has research sites across Belgium, in the Netherlands and the USA, and representation in 3 continents. In 2023, imec's revenue (P&L) totaled 941 million euro. Further information on imec can be found at www.imec-int.com.   Imec is a registered trademark for the activities of imec International (IMEC International, a legal entity set up under Belgian law as a “stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland supported by the Dutch Government),  imec Taiwan (IMEC Taiwan Co.), imec China (IMEC Microelectronics (Shanghai) Co. Ltd.), imec India (IMEC India Private Limited), imec San Francisco (IMEC Inc.) and imec Florida (IMEC USA Nanoelectronics Design Center Inc.).

Strong partnerships evident in Foxconn’s 3 smart platforms, clean energy, space 8 October 2024, Taipei, Taiwan – Artificial intelligence was a running theme through Hon Hai Tech Day 2024 on Tuesday as Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) opened its fifth annual flagship technology conference that displayed the first mass-production-ready NVIDIA GB200 NVL72 platform and took to the stage with a slate of partners to demonstrate the space and clean energy ambitions of the world’s largest manufacturing service provider. Foxconn’s three intelligent platforms – smart manufacturing, smart EV, smart city – received prominent play as keynote speakers in the first day of HHTD24 ranged from leaders such as NVIDIA, Siemens, Bill Gates-backed Breakthrough Energy, GE Vernova from what was formerly General Electric, and one of Europe’s largest space companies, Thales Alenia Space. At the same time, two new reference designs of electric vehicles were unveiled, extending the range of EV models launched since 2021 to a lifestyle multipurpose utility vehicle (LMUV) and a midi electric bus. “A.I. has accelerated our imagination,” said Foxconn Chairman Young Liu to a packed conference of over 2,000 guests, a record. “This acceleration is coming as Foxconn is transforming. We are re-defining ourselves with our three smart platforms. A.I. is driving our transformation, not for the sake of A.I., but because it makes business sense for Foxconn.” Deepu Talla, Vice President of Robotics and Edge Computing for NVIDIA, and Benjamin Ting, Senior Vice President for Cloud Enterprise Solutions Business Group at Foxconn, spoke the companies’ strong partnership in AI. With NVIDIA, Foxconn is not only applying Omniverse and AI to enhance its own factories of the future, but also manufacturing energy-efficient AI systems for its customers, including the world’s fastest AI server and rack systems featuring NVIDIA Blackwell.   The Kaohsiung Super Computing Center was a particular spotlight. Both partners also elaborated on Foxconn’s build out of the world’s largest AI server factory being constructed in Mexico, at more than 400 meters in size, for key customers. Software, robotics and automation are the genesis of factories of the future, while clean energy means collaborating with like-minded partners to pioneer new technologies, be it in ecosystems for electric vehicles or in energy storage systems (ESS). The on-stage conversations and keynotes also pointed to Foxconn’s collaborations to industrialize space to enhance connectivity on the ground. Partners who shared insights for the morning session also included Intrinsic, part of Google-parent Alphabet; consulting leader BCG; US battery technology firm Our Next Energy; and renowned Italian design house Pininfarina. The debut of the MODEL D, as a LMUV, combines the advantages found in SUV and MPV segments. Its styling design was jointly developed with Pininfarina, infusing a sense of harmony to the family of electric vehicles that have been a collaborative work of the Italian and Taiwanese bellwethers. The MODEL U is universal and intelligent in midi size mobility. The sleek reference design of the midi electric bus continues the innovative design language of the award-winning MODEL T full-sized e-bus launched by Foxconn in 2021. The MODEL U’s internal space can be configured according to needs and with its advanced electronic control system and ADAS system, make the driving experience safer and more comfortable. The latest models, including the first variant for the MODEL C tailored for the North American market, highlight the range and maturity of Foxconn’s contract design and manufacturing service (CDMS) business model for automotive B2B customers. The second day of Hon Hai Tech Day, opening to the general public for the first time, is expected to receive more than 8,000 visitors. For more on Hon Hai Tech Day 2024 here. About Foxconn here.