New Taipei City, June 4, 2026 — Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) announced that Chairman Young Liu recently met with SK Group Chairman Chey Tae-won in Taipei to discuss the future development of the global AI industry, including potential collaboration in AI servers, AI data centers, and energy solutions, with the aim of strengthening next-generation AI infrastructure competitiveness. As the global AI industry continues to expand, demand for high-performance computing (HPC) and AI infrastructure is growing rapidly. Building a comprehensive and highly efficient AI ecosystem has become increasingly critical to driving innovation and accelerating the adoption of AI applications across industries. During the meeting, the two sides exchanged views on large-scale AI data center developments in Asia, evolving market demand, and potential industry collaboration models. Leveraging its strengths in AI server vertical integration, rack-scale system integration, advanced thermal technologies, and AI data center solutions, Foxconn aims to work closely with industry partners to advance the development of next-generation AI infrastructure. With its industry-leading technological capabilities, SK Group is accelerating the development of core technologies essential for the AI era. Going forward, SK will continue to strengthen its global competitiveness through innovation in next-generation AI memory technologies. In addition, the two companies discussed opportunities in robotics, energy management, and battery technologies. By combining SK Group’s expertise in energy and critical technologies with Foxconn’s strengths in global manufacturing, system integration, and AI application deployment, both parties look forward to exploring future collaboration opportunities and creating new value in the AI era.

New Taipei City, Taiwan, June 4, 2026 — Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced a strategic collaboration with Intel (NASDAQ: INTC) to jointly accelerate the development and deployment of next-generation AI infrastructure and intelligent computing platforms. By combining Intel’s strengths in processor architecture, silicon technologies, and software ecosystem with Foxconn’s global manufacturing scale, system integration expertise, and AI data center deployment capabilities, the two companies will explore comprehensive AI solutions spanning silicon, rack, system, and application layers. The collaboration also aims to accelerate the large-scale deployment of AI-driven technologies across edge and physical AI applications. Young Liu, Chairman and CEO of Hon Hai Technology Group, said: “AI is rapidly transforming industries and society worldwide. Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors, and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV, and smart city. Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration, and global supply chain capabilities to jointly build next-generation AI infrastructure, Edge AI, and Physical AI ecosystems, accelerating the adoption of AI applications worldwide.” Lip-Bu Tan, Intel CEO, said “The rapid growth of AI—especially in inference and agentic workloads at scale—is redefining what modern computing must deliver. These demands require innovation across the full stack—from new silicon and chip design to rackscale systems and extending all the way to edge and physical AI deployments. Our collaboration with Foxconn brings together two innovation leaders with deep expertise in chip design, rack-scale solutions, and global systems integration. Together, we are accelerating the delivery of end-to-end platforms that unlock new capabilities and extend the impact of AI worldwide.” Under the collaboration framework, Intel and Foxconn will work together to scale AI-driven solutions by leveraging Intel’s computing platforms, silicon technologies, and software ecosystem together with Foxconn’s system integration capabilities, manufacturing expertise, and global customer reach. In the AI Rack domain, the two companies will explore the development and commercialization of rack-scale AI infrastructure solutions, including Intel Xeon-based CPU racks and AI accelerator architectures. The collaboration will also focus on advancing high-speed interconnect technologies, thermal and liquid cooling designs, system telemetry, and AI data center scalability to deliver high-performance, energy-efficient AI deployment solutions. In the Edge and Physical AI domain, Intel and Foxconn will jointly define next-generation Edge AI and Physical AI platform architectures, targeting emerging applications such as agentic AI, edge intelligence, and robotics. The collaboration will further promote and support diverse applications across smart manufacturing, smart cities, automotive, and robotics. In addition, the two companies will explore opportunities in design services, including custom ASICs, SoCs, and system integration solutions. By combining Intel’s end-to-end silicon capabilities with Foxconn’s comprehensive design and manufacturing ecosystem, the collaboration spans silicon, modules, and systems to address global market opportunities.

＊On Monday, June 1, 2026, Foxconn, Radiall and Thales laid the foundation stone for their future joint venture at Le Barp (Nouvelle-Aquitaine) as part of the Choose France 2026 Summit, in the presence of the French Minister Delegate to the Minister of the Economy, Finance, and Industrial, Energy and Digital Sovereignty, responsible for Industry, Mr. Sébastien Martin, the President of S Business Group for Hon Hai Technology Group (Foxconn), Dr. Bob Wei-Ming Chen, the Chairman and CEO of Radiall, Mr. Pierre Gattaz, the Chairman and CEO of Thales, Mr. Patrice Caine and the President of the Nouvelle-Aquitaine Region, Mr. Alain Rousset. ＊This company, called Tessalia Technology SAS, will be dedicated to Outsourced Semiconductor Assembly and Testing (OSAT). It aims to produce more than 50 million System in Package (SiP) components per year by 2033. ＊Within the framework of the EU chips act, this project represents a major step forward in strengthening the French and European semiconductor ecosystem, increasing its capacity for innovation, strategic autonomy and competitiveness.   One year after the announcement by the President of the French Republic, Mr. Emmanuel Macron, at the Choose France 2025 Summit, of the initiation of preliminary discussions among Hon Hai Technology Group (Foxconn), Radiall and Thales, the three companies laid the foundation stone of their future joint venture at Le Barp, near Bordeaux (Nouvelle-Aquitaine), on Monday, June 1, 2026. Le Barp is located in the heart of a rich academic and industrial ecosystem, close to the “Route des Lasers” and with the presence of numerous cleanrooms and a large pool of expertise in these fields.   Foxconn, the world’s largest electronics manufacturing service provider, Radiall, a leading French manufacturer of high-performance interconnect solutionsfor demanding industries, and Thales, a global leader in advanced technologies, have named this new company Tessalia, referring to the tiles of a mosaic (from the Latin “tessella”). They are combining their strengths to create, test and assemble advanced packaging solutions for electronic chips (Systems in Package, SiP) for aerospace, telecom infrastructure, automotive and medical sectors notably. Tessalia will use an innovative encapsulation technology aimed at developing ultra-high-density packaging. This will help simplify printed circuit boards (PCBs) and create smaller, lighter components, thereby improving their integration capability. This technology is emerging as a breakthrough in terms of yields and competitiveness for future products.   Tessalia aims to: -        Be a sovereign and competitive company to meet European needs in the field of semiconductor packaging in strategic sectors. Tessalia will have access to the technology from Foxconn under agreed licensing arrangements. -        Provide to its customers a single interface to manage the entire implementation of advanced packaging for electronic chips. This vertical approach simplifies the packaging stage and guarantees reduced cycle time. It also minimises the carbon footprint of the sector by reducing round trips with multiple suppliers distributed worldwide; -        Promote an autonomous and open player able to manage the European packaging market ecosystem.   Production is expected to start at the end of 2029 and to reach more than 50 million System in Package (SiP) components per year by 2033. This initiative aims to welcome other industrial players to support an investment that could exceed €250 million by 2033. Tessalia is expected to have 800 employees at full production.   In a context of surging demand for electronic equipment and artificial intelligence, and of geopolitical tensions disrupting global supply chains, semiconductor production has become a major strategic challenge, leading to a readjustment of the sector, an acceleration of production capacities and the development of new technologies.   “This new advanced capacity is a key sovereign asset for the European and French semiconductor industry. This project aligns perfectly with Radiall’s strategy, enabling the development of our next advanced connection solutions for demanding applications.” Pierre Gattaz, Chairman and CEO, Radiall   “This is not just a factory. It is a strategic platform for advanced manufacturing, semiconductor resilience, and future technologies in Europe. This project also supports Foxconn’s strategy of Build-Operate-Localize, which expands our global technology footprint through trusted partnerships.” Young Liu, Chairman, Foxconn   “The laying of this first stone today demonstrates our shared ambition, together with Radiall and Foxconn, to build an innovative and competitive European player in the advanced semiconductor packaging market, in a context of strong competition. Tessalia is part of a drive for independence and control over the value chain of all our electronic products.” Patrice Caine, Chairman and CEO, Thales   “I am delighted to welcome this strategic factory, which is crucial for our sovereignty in the electronics sector. It strengthens our regional ecosystem in this sector, which already represents 20,000 jobs. This project also rewards our long-standing efforts in reindustrialization, which have enabled us to become the leading region in France in terms of creating factories”. Alain Rousset, Président, Nouvelle-Aquitaine Region   About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us   About Radiall Founded in 1952, Radiall is a global manufacturer of advanced interconnect solutions, employing over 3,500 people worldwide. The company offers a comprehensive range of RF connectors and cables, coaxial switches, fiber optic and microwave components, multi-contact connectors and more, supported by an international presence ensuring close customer support.   About Thales Thales (Euronext Paris: HO) is a global leader in advanced technologies. Its portfolio of innovative products and services helps address several major challenges: sovereignty, security, sustainability and inclusion. The Group allocates €4.5 billion per year in Research & Development in key areas, particularly for critical environments, such as Artificial Intelligence, Cybersecurity, Quantum and Cloud technologies. Thales has more than 85,000 employees in 65 countries. In 2025, the Group generated sales of €22.1 billion.