19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) on Monday announced a strategic partnership with Thales Group of France in the fields of semiconductors and space, a move that deepens the industrial expertise and broadens the European footprint of the world’s largest electronics manufacturing service provider. Announced at Choose France, a flagship economic summit convened by French PresidentEmmanuel Macron, the first of two MOUs for Foxconn could aggregate additional European industrial investors to sustain an investment in excess of EUR250 million while ensuring a strong European leadership in an outsourced semiconductor assembly and test (OSAT) facility. Foxconn is exploring the potential in preliminary discussions with government-backed Thales and Radiall, a French connector and component maker. If successfully concluded, the facility would address the European aerospace, automotive, space telecoms and defense advanced packaging markets, while bringing together other European industrial investors. The OSAT project would use fan-out wafer level packaging (FOWLP), which would make such a facility a first in the second-largest economy of the European Union. With this development, Foxconn deepens its industrial expertise and global footprint, strengthening the resilience of the supply chain and making key investments in new businesses. The second MOU covers the domain of satellite constellations. Combining the excellence of Foxconn’s unparalleled advanced manufacturing and space technologies of Thales Alenia Space, a Joint Venture between Thales (67%) and Leonardo (33%), this initiative aims at exploring the value of developing together high quality/high-value series satellite production in order to provide superior technological content to customers for their large telecommunications satellite constellation projects in Low Earth Orbit. Foxconn is an emerging stakeholder in the space ecosystem, launching its own low earth orbit CubeSat in 2023 as proof-of-concept, expanding its next-generation beyond 5G (B5G) capabilities and entering satellite constellation manufacturing with the aim to industrialize the LEO sector with its half-century of ICT experience. Choose France, an annual event since 2018, seeks to promote the France’s economic attractiveness and encourage international investment across the country   About Foxconn here.

19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) will kick off COMPUTEX 2025 with the industry's most complete set of solutions for enterprise, agentic and physical AI factories, including advanced superchip AI infrastructure systems featuring the NVIDIA GB300 NVL72 architecture,, as well as systems and solutions for humanoid robots and smart manufacturing platforms – all available from the world’s largest electronics manufacturing service provider. A centerpiece of Foxconn’s industry leadership at this year’s COMPUTEX will be Tuesday’s keynote by Foxconn Chairman Young Liu, outlining the competitive edge generative artificial intelligence plus robotics offer to enterprises in their quest for innovation and for Foxconn as it optimizes its three intelligent platforms. Thanks to genAI driving strong growth momentum in the global robotics industry, Foxconn’s collaboration with key partners will be a highlight of its exhibits this year covering robotics from application to manufacturing. “GenAI plus robotics can assist, augment and optimize the way humans can innovate,” said Chairman Liu. “Foxconn’s three smart platforms all are connected to NVIDIA’s brilliant technologies. With the progress of our Smart Manufacturing, Smart EV and Smart City, Foxconn will help accelerate AI factories to become the standard for enterprise IT transformation underpinned by the NVIDIA platform.” On the COMPUTEX stage for the first time, the Foxconn keynote begins at 0930 a.m. local time on 20 May 2025 on 7F at the Taipei Nangang Exhibition Center Hall 2. Foxconn continues to promote smart manufacturing at multiple locations around the world and is working with NVIDIA to optimize production processes through a variety of AI solutions. On the exhibit floor, at Foxconn Booth L0106, the physical display of NVIDIA GB300 NVL72 AI infrastructure for training and reasoning large language models (LLM) with mega-level parameters, represents the state-of-the-art computing core of the AI factory. Foxconn, which holds more than 40% of the global AI server market, is a major supplier of NVIDIA GB200 NVL72 and the upcoming GB300 NVL72 architecture. Moreover, the NVIDIA MGX 4U, also on display, is a highly flexible air-cooled server designed to meet the diverse computing needs of modern data centers. The system can be equipped with up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, combining advanced AI acceleration capabilities with professional-grade graphics performance to provide breakthrough acceleration for multiple workloads such as generative AI, graphics rendering, and video processing. Foxconn will also showcase the latest generation NVIDIA HGX B300 system. As the latest in the HGX architecture, B300 is designed for the AI inference era and has more powerful computing performance and higher memory capacity to meet the growing needs of AI model deployment. Continuing Foxconn's industry-leading vertical integration advantage in AI servers, the Group is also exhibiting a full range of high-speed signal, high-voltage power supply and liquid-cooled full-speed connection solutions, including: new generation AI chip slot solutions, motherboard PCIE high-speed connectors and cables, GB300 Power Clip, Busbar cable and other related products. Through these innovative solutions, Foxconn strengthens its AI server cooling integration capabilities and continues to provide efficient, stable and customizable thermal management services. In the field of robotics and smart manufacturing platforms, Foxconn’s Semiconductor Hybrid Robot will take a prominent place on the exhibit floor, combining its advanced visual recognition and precision motion technology to provide efficient and safe intelligent transportation solutions for the semiconductor industry. Meanwhile, the AI-powered Nurabot, jointly developed by Foxconn, Taichung Veterans General Hospital and Kawasaki Heavy Industries, leverages all three of NVIDIA’s computers for developing and deploying physical AI. Nurabot’s AI models are trained using their FoxBrain AI Factory powered by NVIDIA DGX SuperPOD, simulated using NVIDIA Omniverse, and deployed on NVIDIA Jetson.  This collaborative nursing robot is expected to be deployed to partner hospitals in Taiwan later this year andis estimated to be able to reduce nursing hours by 30% and improve care efficiency and quality.

19 May 2025, Taipei, Taiwan –. Hon Hai Technology Group (Foxconn) today announced that it is partnering with NVIDIA and to build a state-of-the-art AI Factory supercomputing center in Taiwan. This initiative aims to provide the latest NVIDIA Blackwell infrastructure to industry, government, and academia across the region, accelerating Taiwan’s research and application of artificial intelligence. At the same time, Foxconn’s subsidiary, Big Innovation Company, will become the first NVIDIA Cloud Partner (NCP) in Taiwan, further strengthening the collaboration between the two companies. As part of this initiative, Foxconn is establishing Big Innovation Company, a subsidiary building the AI Factory in Taiwan and further deepening collaboration with NVIDIA. Foxconn’s AI factory will be one of Taiwan’s most powerful supercomputers, based on the NVIDIA Blackwell platform providing high performance computing  to industry, government and academia. TSMC researchers plan to leverage the system to advance their research and development with orders-of-magnitude faster performance, compared with previous-generation systems. “Share, collaborate and thrive. Foxconn is partnering with global leaders to shape a smarter way of life. This NVIDIA AI factory is laying the foundation for government, industry and academia to propel Taiwan toward its next era of innovation,” said Foxconn Chairman Young Liu. “NVIDIA AI factories are the infrastructure for the age of AI and robotics,” said Jensen Huang, Founder and CEO of NVIDIA. “Together, Foxconn and NVIDIA are building a state-of-the-art AI infrastructure for Taiwan's world-leading technology and electronics ecosystem.” “At TSMC, innovation lies at the heart of everything we do. By harnessing advanced AI infrastructure, we empower our researchers to accelerate breakthroughs in semiconductor technology, enabling next-generation solutions for our customers and the world,” said Dr. C.C. Wei, Chairman and CEO of TSMC. “Leveraging this AI factory reinforces our commitment to pushing the limits of AI-driven innovation.” The supercomputer will be equipped with NVIDIA Blackwell Ultra systems, including GB300 NVL72 rack system solutions, equipped with NVIDIA NVLink, NVIDIA Quantum InfiniBand and NVIDIA Spectrum-X Ethernet networking, and will become an important engine for the development of Foxconn's three major strategic platforms: Smart Manufacturing, Smart EV, Smart City. Foxconn joins a global network of NCPs, which offer hosted computing and  services using high-performance infrastructure built with NVIDIA GPUs, networking, and AI software. Foxconn will also contribute computing from the new AI Factory to  NVIDIA DGX Cloud Lepton, an AI platform and marketplace recently announced, which will further expand developers and enterprises' access to the global NVIDIA GPU ecosystem.