22 August 2025, Taipei, Taiwan – Mitsubishi Fuso Truck and Bus Corporation (MFTBC) and Hon Hai Technology Group (“Foxconn”) (TWSE:2317) have signed a memorandum of understanding to explore strategic collaboration in zero emission buses, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer.As part of the collaboration that will strengthen the FUSO bus business, the two companies via their subsidiaries – Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – will cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.The four companies will use the MOU as a starting point to investigate future business models aimed at strengthening the FUSO brand and developing new, made-in-Japan buses. Through this initiative, the companies will provide products that meet a wider range of needs in the rapidly evolving bus market and achieve sustainable business growth.MFBM will serve as the operations platform for the development, production, and commercialization of buses in target markets, including exploring the introduction of made-in-Japan ICE and ZEV buses into target markets.With a track record in performance and safety, the award-winning, full-size MODEL T is already operating commercially as part of the public transit systems in Taiwan’s biggest cities. Universal and intelligent in mid-size mobility, MODEL U’s clean and simple appearance emphasizes flexibility and multi-functionality. About Mitsubishi Fuso Truck and Bus CorporationMitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.

Electromechanics, ICT, key markets get boost in new shares exchange30 July 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and TECO Electric & Machinery Co Ltd (“TECO”) (TWSE:1504) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race. The move brings together the strengths of Foxconn, the world’s largest electronics manufacturing service provider and AI server producer, and TECO, a leader in industrial electro-mechanical engineering and green energy innovation. Seizing on the development of global AI data center (AIDC) construction towards standardization and modularization, the two companies will jointly explore AIDC business opportunities. Global customers will be able to tap comprehensive data center modular products, electromechanical engineering services, and cost-competitive, one-stop solutions. According to terms approved by both boards, respectively, TECO will take a 0.519% stake in Hon Hai Precision Industry Co Ltd, the formal name Foxconn trades on at the Taiwan Stock Exchange. In turn, Foxconn will own 10% in TECO. The latter will issue 237,644,068 new shares to Foxconn, and Foxconn will issue 72,481,441 new shares to TECO, implying a share exchange ratio of approx. 1 to 0.305. The no-cash transaction is targeted to complete in the fourth quarter of this year, conditional on regulatory approvals. Foxconn Chairman Young Liu said, “Time-to-market is key in the global super-computing race. Modular design is gaining popularity. As AI data centers grow in size and demand ramps higher, teaming up with TECO means both companies are able to level up and rapidly deliver comprehensive, vertically-integrated solutions to our customers – the Tier-1 CSPs and hyperscalers.” TECO Chairman Morris Li said, “Changing global dynamics are creating new opportunities for business and cooperation. The strategic partnership extends the two companies’ cooperation in the fields of low-carbon smart factories and energy services, toward being a one-stop solution for data centers going forward.” Target markets cover Taiwan and Asia, as well as the Middle East and the US. Foxconn has deep vertical integration capabilities in manufacturing AI server racks and an unrivaled customer base. Liu said Foxconn will actively develop a modular architecture for AI data centers, and with TECO aim to extend the value chain from server components and racks to data center construction. Li said that Texas-based TECO-Westinghouse, a longstanding world leader in manufacturing electric motors, has the advantages of American manufacturing and local services. Together with Foxconn's manufacturing base in the United States, it is in line with the strategic direction of the two companies to expand American manufacturing and reshape the global supply chain. Previously cooperating in factory energy saving and emission reduction, and ESCO energy services, TECO and Foxconn have started discussions on establishing data center business in Taiwan and the United States. Since a data center is mainly composed of equipment inside the computer room (servers, cooling systems, UPS, etc.) and power infrastructure outside the computer room, the strategic alliance integrates the combined strengths each bring in their respective fields of AI servers, electromechanics, and information and communications. Going forward, the strategic alliance will explore the possibility of expanding cooperation in Foxconn’s “3+3+3” areas. As bellwethers in sustainability, both companies will use the strategic alliance as a starting point to enhance a low-carbon smart industry chain that aligns with international trends, and support supply chain resiliency and innovation. Both TECO and Foxconn were named in S&P Global’s Sustainability Yearbook 2025, a milestone ranking that demonstrates corporate sustainability strength.   About TECO Founded in 1956 as a motor manufacturer, TECO Electric & Machinery Co., Ltd. (“TECO”) has grown into one of the world’s top five industrial motor producers. Today, TECO operates across three core business groups—Green Mechatronic Solutions, Intelligence Energy, and Air & Intelligent Life—building a green ecosystem for energy generation, storage, and efficiency. Beyond motors, TECO has expanded into ESCO energy services, EV powertrain systems, and data center engineering. The company is a market leader in Taiwan’s onshore substations for offshore wind (2.5 GW), has delivered over 700 MW of data center projects across Southeast Asia, and holds more than 85% of Taiwan’s e-bus powertrain market, with recent expansion into India. TECO’s vision is to become the key driver in realizing global electrification, intelligence, and green energy. It has been included for five consecutive years in both the Dow Jones Best in Class Indices and the S&P Global Sustainability Yearbook, and has received the Taiwan Corporate Sustainability Award for eleven straight years. To learn more, visit www.teco.com.tw   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

Multimodal Trajectory Prediction Model Competitively Recognized Internationally10 July 2025, Taipei, Taiwan – Hon Hai Research Institute (HHRI), an R&D powerhouse of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has been recognized for its competitive work in trajectory prediction in autonomous driving technology. The landmark achievements in ModeSeq, taking top spot in the Waymo Open Dataset Challenge and presenting at CVPR 2025, among the world’s most influential AI and computer vision conferences, gathering top-tier tech firms, research institutions, and academic leaders, highlight HHRI’s growing leadership and technical excellence on the international stage. “ModeSeq empowers autonomous vehicles with more accurate and diverse predictions of traffic participant behaviors,” said Yung-Hui Li, Director of the Artificial Intelligence Research Center at HHRI. “It directly enhances decision-making safety, reduces computational cost, and introduces unique mode-extrapolation capabilities to dynamically adjust the number of predicted behavior modes based on scenario uncertainty.”Figure 1: Illustrates the ModeSeq workflow, showing how the model anticipates multiple possible future trajectories (highlighted by red vehicle icons and arrows). It progressively analyzes the scenario and assigns confidence scores (e.g., 0.2) to each potential path.   HHRI’s Artificial Intelligence Research Center, in collaboration with City University of Hong Kong, on June 13, presented "ModeSeq: Taming Sparse Multimodal Motion Prediction with Sequential Mode Modeling" at CVPR 2025(IEEE/CVF Conference on Computer Vision and Pattern Recognition), where its paper was among only the 22% that were accepted. The multimodal trajectory-prediction technology overcomes the limitations of prior methods by both preserving high performance and delivering diverse potential outcome paths. ModeSeq introduces sequential pattern modeling and employs an Early-Match-Take-All (EMTA) loss function to reinforce multimodal predictions. It encodes scenes using Factorized Transformers and decodes them with a hybrid architecture combining Memory Transformers and dedicated ModeSeq layers. The research team further refined it into Parallel ModeSeq, which claimed victory in the prestigious Waymo Open Dataset (WOD) Challenge – Interaction Prediction Track at the CVPR WAD Workshop. The team’s winning entry surpassed strong competitors from the National University of Singapore, University of British Columbia, Vector Institute for AI, University of Waterloo and Georgia Institute of Technology. Building on their success from last year – where ModeSeq placed second globally in the 2024 CVPR Waymo Motion Prediction Challenge – this year’s Parallel ModeSeq emerged triumphant in the 2025 Interaction Prediction track. Led by Director Li of HHRI’s AI Research Lab, in collaboration with Professor Jianping Wang’s group at City University of Hong Kong and researchers from Carnegie Mellon University, ModeSeq outperforms previous approaches on the Motion Prediction Benchmark—achieving superior mAP and soft-mAP scores while maintaining comparable minADE and minFDE metrics. Figure 2: Director Yung-Hui Li (right) and Researcher Ming-Chien Hsu at CVPR 2025 presenting the latest advances in autonomous driving using ModeSeq.   About Hon Hai Research Institute Founded in 2020 under Hon Hai Technology Group, the institute comprises five research centers and one laboratory. Each unit houses high-tech researchers dedicated to forward-looking studies over a 3–7 year horizon. Their mission is to strengthen long-term innovation and product development to support Foxconn’s transformation toward a “Smart First” future and to bolster the company’s “3+3+3” strategic operating model.

Pioneering a new foundation for quantum cryptography with meta-complexity13 June 2025, Taipei, Taiwan  – Hon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing. Researchers from HHRI’s Quantum Computing Division have demonstrated the possibility of constructing quantum cryptography without relying on traditional one-way functions, using instead a novel theoretical framework known as meta-complexity. This groundbreaking result has been accepted at Crypto, the world’s leading conference in cryptography, highlighting HHRI’s advanced research capabilities and its growing influence in the global quantum technology landscape. Figure 1: Overview of the relationships between key quantum cryptographic primitives and quantum computational complexity. Black lines indicate known results or straightforward inferences; red lines highlight HHRI’s new discoveries.This groundbreaking research, led by Dr. Taiga Hirooka, a researcher at HHRI, in collaboration with Professor Tomoyuki Morimae of Kyoto University and scientific advisor to HHRI, is the first to establish a deep theoretical connection between core tools in quantum cryptography—such as one-way puzzles and quantum random number generators—and a fundamental decision problem known as GapK. The GapK problem centers on determining whether a given piece of information is intrinsically complex or can be succinctly described, offering a novel lens through which to understand the foundations of quantum cryptography.   This discovery not only establishes a new theoretical foundation for quantum cryptography, but also paves the way for the development of next-generation Proofs of Quantumness—a critical step toward constructing secure and verifiable quantum technologies. The work aligns with concurrent research from two international teams and is widely seen as marking a new chapter in the evolution of quantum cryptography.   Crypto (International Cryptology Conference) is one of the most prestigious and longest-running academic conferences in the field of cryptography. Established in 1981, it has become a cornerstone of the discipline—alongside Eurocrypt and Asiacrypt—and is one of the three flagship events organized by the International Association for Cryptologic Research (IACR). Crypto attracts leading researchers and industry pioneers from around the globe and has served as the launchpad for numerous foundational advances in cryptographic theory and practice. Publishing at Crypto is widely regarded as one of the highest honors in the field, representing a hallmark of excellence in theoretical rigor, technical innovation, and lasting impact.   HHRI’s latest breakthrough, now accepted at Crypto, not only enhances Taiwan’s presence in the field of quantum cryptography but also highlights Foxconn’s sustained investment and growing expertise in quantum computing. The Hon Hai Research Institute will continue to advance quantum computing research to drive global technological innovation and industrial progress. Crypto 2025：https://crypto.iacr.org/2025/   About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has an average of 40 high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy.

21 May 2025, Taipei, Taiwan – Foxconn continues to advance its digital health initiatives, unveiling a range of innovations at the 2025 GTC Taipei. Highlights include the AI-powered nursing collaborative robot, digital twin smart hospital development, and contributions to the global open-source medical imaging platform MONAI. These achievements will also be spotlighted during keynote sessions at GTC Taipei, underscoring Foxconn’s capabilities as a comprehensive smart healthcare solutions provider.   Leveraging Technology to Address Nursing Workforce Shortages: AI Collaborative Robot Enters Clinical Practice Amid the challenges of an aging population and critical nursing staff shortages, Foxconn has partnered with Taichung Veterans General Hospital (ranked among Newsweek’s World’s Best Smart Hospitals 2025), Kawasaki Heavy Industries, to co-develop Nurabot, an AI-powered nursing collaborative robot.          Nurabot is powered by Foxconn’s proprietary traditional Chinese large language model, FoxBrain, developed by the Hon Hai Research Institute (HHRI). The model supports TTS (text-to-speech), ASR (automatic speech recognition), and NLP (natural language processing), and is deployed via the Hon Hai Data Center. The robot is powered by Isaac for Healthcare, a physical AI platform built on NVIDIA’s three computers for healthcare robotics. NuraBot uses  the NVIDIA Jetson AGX Orin™system-on-moduleand is trainedusingNVIDIA Isaac Sim™ , a reference robotic simulation application built on NVIDIA Omniverse and running on NVIDIA OVX™ for physical-virtual simulation, enabling autonomous navigation, multimodal perception, and real-time environmental modeling.   In clinical applications, Nurabot performs repetitive tasks such as medication delivery, specimen transport, ward patrols, and patient education—helping reduce nurses’ workload by up to 30%. It also enhances care standardization and precision, enabling nursing staff to focus more on core patient care and clinical decision-making. Currently undergoing field trials at Taichung Veterans General Hospital, Nurabot is expected to be formally integrated into the hospital’s nursing team operations by the end of the year. Foxconn further elaborates on this application in the featured talk titled “AI Humanoid Collaborative Nursing Robots: Shaping the Future of Nursing and Care,” showcasing how AI and robotics help alleviate workforce burdens and reshape healthcare environments.   Launching a Smart Hospital Ecosystem: Digital Twin Deployment for Operational Simulation As part of its smart hospital initiatives, Foxconn is collaborating with several medical institutions under planning and construction, including the Evergreen Branch of Taichung Veterans General Hospital, Baishatun Tung Hospital – Mazu Hospital, and Cardinal Tien Hospital. These collaborations involveconstructingphysically accurate digital twins of smart medical environments with NVIDIA Omniverse™ libraries and technologies.   These digital twins are used across three stages of hospital development: planning and design, workflow simulation, and operational optimization. Even in the early stages of construction and operations, hospitals can simulate AI-driven clinical scenarios, optimize spatial flow, and validate service efficiency and patient experience in advance.   With the integration of NVIDIAVideo Search & Summarization Agent (VSS ), hospitals can analyze real-time video data, automatically identify medical events and anomalies, generate visual summaries, and send real-time alerts. These capabilities empower management teams to make timely, data-driven decisions that enhance care quality and operational performance.   These digital twin environments also serve as key deployment sites for Nurabot, enabling simulation of robot routes, task validation, and training scenarios in virtual space. This accelerates clinical onboarding and cross-site implementation, further optimizing hospital operations and realizing truly patient-centered smart healthcare services.   Contributing to MONAI Open-Source Medical AI Models: Advancing AI Imaging Innovation To advance core AI healthcare technologies, Foxconn has developed CoroSegmentater, a coronary artery segmentation model set to be contributed to the      MONAI Model Zoo as a shared open-source asset for the global medical AI community. Built on 256-slice CTA imaging and powered by MONAI’s Auto3Dseg framework, the model achieves high-precision 3D segmentation of cardiac and coronary structures. CoroSegmentater can be deployed on NVIDIA OVX™ and simulated using Isaac Sim™ to reconstruct heart anatomy and vascular dynamics. It supports various clinical applications, including AI-assisted diagnostics, preoperative planning, and patient communication. The model is being featured in a special session at GTC Taipei, presented by David Niewolny, Sr. Director of Healthcare Business Development at NVIDIA. This contribution reflects Foxconn’s R&D strength in smart healthcare algorithms and its commitment to advancing global medical AI through open collaboration.   Driving Digital Health Globalization and Expanding AI Healthcare Impact Through its collaborationwith NVIDIA and the cross-sector network of HiMEDt (Taiwan Digital Health Alliance), Foxconn is actively promoting the international expansion of Taiwan’s smart healthcare innovations. Moving forward, Foxconn will further enhance its smart hospital AI platforms, robotic applications, and clinical AI model development to transition global smart healthcare from proof-of-concept to large-scale implementation—paving the way toward a truly patient-centered intelligent care ecosystem.

19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) on Monday announced a strategic partnership with Thales Group of France in the fields of semiconductors and space, a move that deepens the industrial expertise and broadens the European footprint of the world’s largest electronics manufacturing service provider. Announced at Choose France, a flagship economic summit convened by French PresidentEmmanuel Macron, the first of two MOUs for Foxconn could aggregate additional European industrial investors to sustain an investment in excess of EUR250 million while ensuring a strong European leadership in an outsourced semiconductor assembly and test (OSAT) facility. Foxconn is exploring the potential in preliminary discussions with government-backed Thales and Radiall, a French connector and component maker. If successfully concluded, the facility would address the European aerospace, automotive, space telecoms and defense advanced packaging markets, while bringing together other European industrial investors. The OSAT project would use fan-out wafer level packaging (FOWLP), which would make such a facility a first in the second-largest economy of the European Union. With this development, Foxconn deepens its industrial expertise and global footprint, strengthening the resilience of the supply chain and making key investments in new businesses. The second MOU covers the domain of satellite constellations. Combining the excellence of Foxconn’s unparalleled advanced manufacturing and space technologies of Thales Alenia Space, a Joint Venture between Thales (67%) and Leonardo (33%), this initiative aims at exploring the value of developing together high quality/high-value series satellite production in order to provide superior technological content to customers for their large telecommunications satellite constellation projects in Low Earth Orbit. Foxconn is an emerging stakeholder in the space ecosystem, launching its own low earth orbit CubeSat in 2023 as proof-of-concept, expanding its next-generation beyond 5G (B5G) capabilities and entering satellite constellation manufacturing with the aim to industrialize the LEO sector with its half-century of ICT experience. Choose France, an annual event since 2018, seeks to promote the France’s economic attractiveness and encourage international investment across the country   About Foxconn here.

19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) will kick off COMPUTEX 2025 with the industry's most complete set of solutions for enterprise, agentic and physical AI factories, including advanced superchip AI infrastructure systems featuring the NVIDIA GB300 NVL72 architecture,, as well as systems and solutions for humanoid robots and smart manufacturing platforms – all available from the world’s largest electronics manufacturing service provider. A centerpiece of Foxconn’s industry leadership at this year’s COMPUTEX will be Tuesday’s keynote by Foxconn Chairman Young Liu, outlining the competitive edge generative artificial intelligence plus robotics offer to enterprises in their quest for innovation and for Foxconn as it optimizes its three intelligent platforms. Thanks to genAI driving strong growth momentum in the global robotics industry, Foxconn’s collaboration with key partners will be a highlight of its exhibits this year covering robotics from application to manufacturing. “GenAI plus robotics can assist, augment and optimize the way humans can innovate,” said Chairman Liu. “Foxconn’s three smart platforms all are connected to NVIDIA’s brilliant technologies. With the progress of our Smart Manufacturing, Smart EV and Smart City, Foxconn will help accelerate AI factories to become the standard for enterprise IT transformation underpinned by the NVIDIA platform.” On the COMPUTEX stage for the first time, the Foxconn keynote begins at 0930 a.m. local time on 20 May 2025 on 7F at the Taipei Nangang Exhibition Center Hall 2. Foxconn continues to promote smart manufacturing at multiple locations around the world and is working with NVIDIA to optimize production processes through a variety of AI solutions. On the exhibit floor, at Foxconn Booth L0106, the physical display of NVIDIA GB300 NVL72 AI infrastructure for training and reasoning large language models (LLM) with mega-level parameters, represents the state-of-the-art computing core of the AI factory. Foxconn, which holds more than 40% of the global AI server market, is a major supplier of NVIDIA GB200 NVL72 and the upcoming GB300 NVL72 architecture. Moreover, the NVIDIA MGX 4U, also on display, is a highly flexible air-cooled server designed to meet the diverse computing needs of modern data centers. The system can be equipped with up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, combining advanced AI acceleration capabilities with professional-grade graphics performance to provide breakthrough acceleration for multiple workloads such as generative AI, graphics rendering, and video processing. Foxconn will also showcase the latest generation NVIDIA HGX B300 system. As the latest in the HGX architecture, B300 is designed for the AI inference era and has more powerful computing performance and higher memory capacity to meet the growing needs of AI model deployment. Continuing Foxconn's industry-leading vertical integration advantage in AI servers, the Group is also exhibiting a full range of high-speed signal, high-voltage power supply and liquid-cooled full-speed connection solutions, including: new generation AI chip slot solutions, motherboard PCIE high-speed connectors and cables, GB300 Power Clip, Busbar cable and other related products. Through these innovative solutions, Foxconn strengthens its AI server cooling integration capabilities and continues to provide efficient, stable and customizable thermal management services. In the field of robotics and smart manufacturing platforms, Foxconn’s Semiconductor Hybrid Robot will take a prominent place on the exhibit floor, combining its advanced visual recognition and precision motion technology to provide efficient and safe intelligent transportation solutions for the semiconductor industry. Meanwhile, the AI-powered Nurabot, jointly developed by Foxconn, Taichung Veterans General Hospital and Kawasaki Heavy Industries, leverages all three of NVIDIA’s computers for developing and deploying physical AI. Nurabot’s AI models are trained using their FoxBrain AI Factory powered by NVIDIA DGX SuperPOD, simulated using NVIDIA Omniverse, and deployed on NVIDIA Jetson.  This collaborative nursing robot is expected to be deployed to partner hospitals in Taiwan later this year andis estimated to be able to reduce nursing hours by 30% and improve care efficiency and quality.

19 May 2025, Taipei, Taiwan –. Hon Hai Technology Group (Foxconn) today announced that it is partnering with NVIDIA and to build a state-of-the-art AI Factory supercomputing center in Taiwan. This initiative aims to provide the latest NVIDIA Blackwell infrastructure to industry, government, and academia across the region, accelerating Taiwan’s research and application of artificial intelligence. At the same time, Foxconn’s subsidiary, Big Innovation Company, will become the first NVIDIA Cloud Partner (NCP) in Taiwan, further strengthening the collaboration between the two companies. As part of this initiative, Foxconn is establishing Big Innovation Company, a subsidiary building the AI Factory in Taiwan and further deepening collaboration with NVIDIA. Foxconn’s AI factory will be one of Taiwan’s most powerful supercomputers, based on the NVIDIA Blackwell platform providing high performance computing  to industry, government and academia. TSMC researchers plan to leverage the system to advance their research and development with orders-of-magnitude faster performance, compared with previous-generation systems. “Share, collaborate and thrive. Foxconn is partnering with global leaders to shape a smarter way of life. This NVIDIA AI factory is laying the foundation for government, industry and academia to propel Taiwan toward its next era of innovation,” said Foxconn Chairman Young Liu. “NVIDIA AI factories are the infrastructure for the age of AI and robotics,” said Jensen Huang, Founder and CEO of NVIDIA. “Together, Foxconn and NVIDIA are building a state-of-the-art AI infrastructure for Taiwan's world-leading technology and electronics ecosystem.” “At TSMC, innovation lies at the heart of everything we do. By harnessing advanced AI infrastructure, we empower our researchers to accelerate breakthroughs in semiconductor technology, enabling next-generation solutions for our customers and the world,” said Dr. C.C. Wei, Chairman and CEO of TSMC. “Leveraging this AI factory reinforces our commitment to pushing the limits of AI-driven innovation.” The supercomputer will be equipped with NVIDIA Blackwell Ultra systems, including GB300 NVL72 rack system solutions, equipped with NVIDIA NVLink, NVIDIA Quantum InfiniBand and NVIDIA Spectrum-X Ethernet networking, and will become an important engine for the development of Foxconn's three major strategic platforms: Smart Manufacturing, Smart EV, Smart City. Foxconn joins a global network of NCPs, which offer hosted computing and  services using high-performance infrastructure built with NVIDIA GPUs, networking, and AI software. Foxconn will also contribute computing from the new AI Factory to  NVIDIA DGX Cloud Lepton, an AI platform and marketplace recently announced, which will further expand developers and enterprises' access to the global NVIDIA GPU ecosystem.  

To help meet increasing international customer demand faster and cost effectivelySan Francisco, CA and Taipei, Taiwan – May 16, 2025 – Robust.AI, a leader in AI-driven warehouse automation, today announced a strategic manufacturing partnership with Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturing services provider, to expand production of its flagship Carter™ multi-function collaborative robotics platform. The partnership will enable Robust.AI to rapidly fulfill increasing demand from its growing international customer base and strengthen the resilience of its supply chain and manufacturing operations. According to a recent Global Market Insights report, the warehouse automation market is forecasted to grow from $26.5 billion in 2024 to $115.8 billion by 2034 – a CAGR of 15.9%. However, 80% of warehouses lack any automation – not even a conveyor belt according to ResearchandMarkets. While AI is poised to create efficiencies in many industries, labor-intensive jobs in logistics and manufacturing require improvements in both physical capabilities and digital intelligence. Designed to augment existing warehouse operations and workforce, Carter’s drop-in automation capabilities help global manufacturing and logistics providers achieve significant productivity gains. Its collaborative, software-defined functionality allows facilities to dynamically switch functions between fulfillment picking, point-to-point transport, or a mobile sorting wall. This unprecedented flexibility enables customers to easily adapt to changing needs and workflows without additional infrastructure costs. Robust.AI recently announced that its Carter fleet deployment at a DHL Supply Chain facility in Las Vegas, NV, delivered more than 60% productivity gains to existing picking operations within weeks of implementation. “As shifting supply chains and international tariffs add complexity and costs to global logistics operations, our strategic manufacturing partnership with Foxconn will enable us to rapidly fulfil orders for Carter robots, which are delivering improved productivity and efficiency to some of the world’s largest logistics and manufacturing companies,” said Anthony Jules, CEO of Robust.AI. “Foxconn’s unparalleled global manufacturing capabilities make it one of the most trusted partners for advanced manufacturing in the world. Our combined robotics expertise will help multinational companies rapidly and cost-effectively streamline their logistics and warehousing operations and augment existing workforces with collaborative robotic automation solutions.” “Foxconn is pleased to expand its manufacturing partnership with Robust.AI and help accelerate and scale the production of its innovative Carter robotics platform worldwide,” said Bob Deng, EVP at Foxconn. “Our close collaboration at the onset of Carter’s development has contributed to the maturity, scalability and reliability of the platform and its manufacturing processes, allowing customers to confidently invest in Robust.AI’s unique warehouse automation solution and see immediate improvement in their warehousing and logistics capabilities.”  As part of its “3+3” development strategy, Foxconn has been building a diverse range of robots tailored to different application scenarios, and has even gone further to assist customers in manufacturing their own robotic products. The partnership with Robust.AI marks another milestone for Foxconn in the robotics industry. Over the past few months, Foxconn engineers have been working closely with Robust AI, training and helping build Carter robots in the U.S. for the past several months, which will greatly decrease production and deployment times as manufacturing scales.   About Robust.AI Robust.AI is founded and led by a world-class robotics team. We bring AI, robotics, and human-centered design together to make robots broadly useful, effortless to adopt, and delightful to use. For more information, visit www.robust.ai. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

Breakthrough study published in Nature Communications29 April 2025, Taipei, Taiwan  – Hon Hai Research Institute (HHRI), in a milestone collaborative effort, has demonstrated that parallel quantum computation can exhibit greater computational power than previously recognized, with its research results accepted for publication in the prestigious journal Nature Communications.Titled "Unconditional advantage of noisy qudit quantum circuits over biased threshold circuits in constant depth," the latest HHRI paper achieves another milestone in quantum computing research. Figure 1: Classes of circuits and the corresponding problems that could be efficiently solved by them. This breakthrough study establishes a fundamental advancement in our understanding of quantum circuit capabilities. The research demonstrates that a class of problems, known as ISMRP, can be efficiently computed by shallow quantum circuits—but not by any polynomial-sized classical biased threshold circuits (bPTC0(k)). This proves a previously unverified advantage of shallow quantum circuits. While many current claims of “quantum advantage” are based on certain unproven assumptions and remain experimentally challenging to verify, this study presents an unconditional proof of quantum circuit supremacy without any computational hardness assumptions. Notably, the team proved that even when quantum circuits are subject to noise, shallow qudit quantum circuits built from local logic gates can solve problems that classical polynomial-sized biased threshold circuits fundamentally cannot. The finding highlights the long-term potential and practical application of quantum computing. This breakthrough solidifies Taiwan’s growing influence in the field of quantum computing and showcases the deep commitment and accumulated expertise in this critical area of research by Hon Hai Research Institute, a key R&D source for Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturing service provider. HHRI will continue to push forward in quantum technology to contribute to global innovation and industrial advancement. The research was a collaborative effort led by Dr. Ming-Hsiu Hsieh, Director of HHRI’s Quantum Computing Research Center, along with institute Researcher Leandro Mendes and PhD intern Michael de Oliveira. Collaborating with HHRI was Sathyawageeswar Subramanian, a senior research fellow from the Department of Computer Science and Technology at the University of Cambridge in the United Kingdom. The article is published in Nature Communications (Volume 16, Article number: 3559, 2025), which ranks 5th globally in Google Scholar’s h5-index metrics with a score of 375 – underscoring the high academic impact of this achievement. Access the full publication here: https://doi.org/10.1038/s41467-025-58545-4   About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has an average of 40 high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3" strategy.