16 March 2026, San Jose, California, and Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today confirmed its unrivalled role in pacing the AI industrial revolution by exhibiting full-system AI server racks for NVIDIA Vera Rubin NVL72 platform, and, for the first time in the United States, unveiling details of its industrial humanoid robots and scalable modular data centers at NVIDIA GTC 2026. Splashing out on technology at the premier conference on artificial intelligence, the world’s largest electronics manufacturer demonstrated its deep collaboration with NVIDIA and its in-house strength in vertical integration with an array of critical components and cutting-edge systems that power NVIDIA Vera Rubin NVL72 platform. “Foxconn’s vertical integration, precision manufacturing and future technologies come into sharp relief when we work with NVIDIA year after year. This powerful partnership enables AI factories to produce intelligence efficiently and reliably for large-scale training, inference, and agentic workloads,” said Foxconn Chairman Young Liu. Double the size of the year before, the Foxconn delegation, with over a hundred executives, engineers and scientists, at San Jose this year brings expertise on the latest advances in AI factories and physical AI, sharing the newest innovations for NVIDIA HGX and NVIDIA MGX platforms. At GTC Booth 1921, the end-to-end NVIDIA AI Factory Ecosystem showcase features Foxconn’s key building blocks across mechanical design, cooling components, and power delivery that come together to accelerate integration and support rapid deployment. Foxconn will support the latest NVIDIA RTX PRO™ 4500 Blackwell Server Edition GPUswith new servers to power demanding data processing, AI, video and visual computing workloads. For the first time in the United States, Foxconn unveiled details of its AI-powered industrial humanoid robot being developed in collaboration with NVIDIA. Both at Foxconn’s booth and GTC sessions – “Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem” and “Building and Scaling AI Factories With Digital Twins and Robotics” – Foxconn experts show how the robots autonomously execute high-precision, repetitive industrial operations – including pick-and-place, screw fastening, and material handling – demonstrating reliability and operational efficiency in real-world conditions. The robotic skills derived from actual factory scenarios are the result of combining simulation-based training with on-site iteration, leveraging NVIDIA Isaac GR00T, NVIDIA FoundationPose, NVIDIA Isaac Sim and NVIDIA Jetson Thor, to enable rapid deployment and scalable rollout across manufacturing facilities. Meanwhile, the modular data center, or MDC, redefines scalability. Foxconn, with partners, are launching a new generation of AI-ready modular and hybrid architectures to meet demand from new-generation AI models for ultra-high-density compute power and electrical infrastructure. Through highly standardized and modular designs – see a small-scale model at Booth 1921 – the complex construction of an AI data center is transformed into a replicable and expandable industrialized solution, accelerating the journey for enterprises from building compute power to realizing the business value of AI. Foxconn’s Visionbay.ai, as an NVIDIA Cloud Partner (NCP), strategically collaborates with ecosystem leaders, enabling a unified “AI+Workflow” deployment architecture – bridging foundation models, platforms, applications, and compute infrastructure. Executing a global AI infrastructure strategy exceeding 1GW of deployed capacity, Foxconn is scaling from Taiwan into strategic regions worldwide, establishing strong foundations for sovereign AI. Another capability on display at GTC is Genesis, Foxconn’s WEF-recognized AI initiative. Powered by NVIDIA Omniverse and Foxconn FactoryGPT, Genesis demonstrates a fully integrated digital-physical factory. Visitors experience how AI simulates optimal strategies within digital twins and feeds decisions back to real-world production lines – forming a continuous closed-loop optimization cycle. In Smart City, Foxconn’s CityGPT integrates with NVIDIA Metropolis to advance AI-powered transportation and safety, while Smart EV features enhancing ADAS capabilities involving FoxBrain, the Group’s proprietary, traditional Chinese large-language model. Foxconn’s integrated healthcare AI ecosystem on exhibit focuses on four clinical domains, including scrub nurse collaborative robotics, colonoscopy Agentic AI, cardiovascular digital twins, and multimodal precision treatment for breast cancer. These take medical AI from standalone model applications to a fully realized agentic AI healthcare system – capable of perception, reasoning, and action – enabling scalable clinical innovation. On March 17, GTC session Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q is dedicated to breakthroughs in quantum by the Hon Hai Research Institute, Foxconn’s R&D powerhouse looking at future technologies. Information on exhibit hall and hours can be found here. Foxconn GTC sessions and visit Booth 1921 1.    Building and Scaling AI Factories With Digital Twins and Robotics [S81508] 2.    Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem [S82100] 3.    Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q [S82043]     About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

·       Revenuefor4Qandfull year2025 atrecord highs ·       CashdividendofNT$7.2arecord highsincelisting,payoutratio 52.9% ·       AIserversectortoseestronggrowthin 2026 ·       AIiscoredrivingforceinnew5-yeartransformationstrategy 16 March 2026, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its full year and fourth quarter 2025 financial results. Full-year net profit (attributable to the parent company) totaled NT$189.3 billion and EPS of NT$13.61 reached a record high since its listing in 1991. ROE hit 11.25%, further improving overall profitability. The company also announced a cash dividend of NT$7.2 per share this year, a record high since its listing in 1991, representing a payout ratio of 52.9%, marking the seventh consecutive year that the payout ratio has exceeded 50%. Despite significant changes in tariff policies, geopolitics, and global monetary policies, the AI server sector is expected to see strong growth in 2026. At the same time, the Group also unveiled its five-year plan, focusing on AI as the core driver and three major transformation strategies: Foxconn 1.0 – Operational Excellence; Foxconn 2.0 – Intelligence-Driven Growth; and Foxconn 3.0 – Platform Value Creation. Foxconn’s 2025 full-year revenue reached NT$8.1 trillion, a year-on-year increase of 18%; gross profit reached NT$498.2 billion, up 16% for the same period; operating profit at NT$259.2 billion, rose 29% on year; and net profit (attributable to the parent company) reached NT$189.4 billion, increasing 24%. The profit growth rate exceeded the revenue growth rate, representing best practice for maximizing the Group's profitability. Gross profit margin, operating profit margin, and net profit margin were 6.15%, 3.20%, and 2.34% respectively, compared to 6.25%, 2.92%, and 2.23% in the previous year. This shows that although high-priced AI products diluted the gross profit margin, the operating profit margin steadily grew to over 3%, and profitability of the core business benefited significantly from AI products, resulting in EPS reaching NT$13.61, an increase of NT$2.60 from the previous year. In the October-December quarter, revenue totaled NT$2.61 trillion, a 22% increase from the same period a year ago; gross profit at NT$153.3 billion, was up 17% at the same time; operating profit at NT$85.6 billion, rose 33% on-year; while net profit (attributable to the parent company) at NT$45.2 billion, fell 2% from a year ago. Gross profit margin, operating profit margin, and net profit margin were 5.88%, 3.28%, and 1.73%, respectively, compared to 6.15%, 3.03%, and 2.17% for the same period a year ago. The improved operating profit margin indicates enhanced profitability in the core business. EPS reached NT$3.23, down NT$0.11 from the previous year. Looking at the fourth quarter's operating performance, Foxconn Chairman Young Liu stated that both the fourth quarter and the full year saw record-breaking revenue, exceeding expectations and achieving strong growth. The Group's full year revenue reached NT$8.1 trillion, a record high. Notably, revenue from cloud and networking products surpassed that of smart consumer electronics products for the first time even during the traditional peak season for ICT products, becoming the largest product category in the quarter. Based on the Group's target of an average cash dividend payout ratio of no less than 40%, Chairman Liu announced this year's cash dividend per share will be NT$7.2, a significant increase from NT$5.8 per share last year, with a payout ratio of 52.9%, a new high since the company's listing in 1991, and exceeding 50% for seven consecutive years. The market is paying close attention to the Group's performance in cloud and networking products and smart consumer electronics products in 2026. Chairman Liu pointed out that with the unprecedented expansion of capital expenditures by large global CSPs, Foxconn, as the world’s largest AI server provider, will definitely seize this opportunity. As production capacity gradually comes online, AI servers will maintain strong growth. Regarding smart consumer electronics products, addressing market concerns about memory shortages and price increases, Chairman Liu stated that the Group's product portfolio is mainly composed of high-priced models, and the impact is currently observed to be relatively limited. Demand, as originally seen, remains unchanged, and visibility is gradually improving, with significant growth expected this year. Regarding the financial indicators that investors are highly concerned about, Chairman Liu stated that the "Enterprise Value Enhancement Plan" approved by the board of directors Monday incorporates targets such as operating profit margin and ROE into its core commitments in order to actively respond to investors' expectations for improved long-term profitability. ROE has been around 9% in 2023 and 2024. With deeper vertical integration of components, emerging economies of scale, and growing contribution of the AI business, overall profitability further improved in 2025, with ROE reaching 11.25% to steadily move towards a near-term target of 12%. As the global industry stands at the starting point of the new AI era, Foxconn, based on its three-stage transformation plan proposed five years ago – F1.0 Existing Business Optimization, F2.0 Digital Transformation, and F3.0 Transformation To New Industries – is using AI as the core driving force to promote the Group's upgrade through three major transformation strategies: Foxconn 1.0 Operational Excellence; Foxconn 2.0 Intelligence- Driven Growth; and Foxconn 3.0 Platform Value Creation Chairman Liu stated, "Our goal is clear: to transform Foxconn from the world's most important technology manufacturing partner into the most trusted industrial platform in the AI era. This will be the core direction of Foxconn's next stage of growth and the key to continuously creating long-term value for our shareholders."

14 January 2026, Taipei, Taiwan – The LPGA of Taiwan (TLPGA) and the Japan Ladies Professional Golfers’ Association are thrilled to announce the “2026 Taiwan Foxconn Ladies Golf Tournament” on the official circuit of JLPGA for this year, bringing Asia’s most lucrative women’s golf tour to Taiwan for the first time in nearly half a century and an elite line-up of athletes vying for a record US$2 million purse. Stepping up the game, the competition – re-branded from Foxconn TLPGA Players Championship of the past two years – will see the return of title sponsor Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technological solutions provider, and special sponsor for the first time, Japanese technology powerhouse SoftBank Corp. Producing topflight golfers, including Hisako Higuchi and Ai Miyazato, the JLPGA was a sweet spot for Taiwan’s own golf legend Ai-yu Tu, who once swept 71 championships and was a 7x money-title winner on the JLPGA Tour, accumulating over 110 wins in her career and inducted into the Japanese Golf Hall of Fame. Ms Tu is a special advisor for the 2026 Taiwan Foxconn Ladies Golf Tournament. TLPGA Chairwoman Huang Pi-hsun said: "Ms Tu’s glorious achievements on the JLPGA Tour have been a source of pride for Taiwan. I am grateful for Foxconn's support, which has allowed this dream tour to return to Taiwan after 48 years, giving young players a stage to challenge the world." JLPGA Vice President Takako Matsuo said: "Over the past two years, we have witnessed TLPGA and Foxconn successfully taking the game to an elite playing level. As one of Asia’s flagship tournaments this year, we very much look forward to bringing Japanese players to Taiwan in March for high-level competition." The total purse is the second-highest in the JLPGA Tour for 2026 and another record for the Foxconn-sponsored tournament since it was inaugurated in 2024. Originally established as a players championship, the competition has set itself apart with its exceptional ranking points, substantial prize money, and elite sportsmanship. The 2026 Taiwan Foxconn Ladies Golf Tournament will be held March 12-15 at the Orient Golf & Country Club in Taoyuan. Follow the action and stay updated through the tournament’s official Facebook and on Foxconn’s official Instagram. About TLPGA here. About Foxconn here.

Hon Hai Technology Group (“Foxconn”) (TWSE:2317), world’s largest electronics manufacturer and leading technological solutions provider, and Pace CCS, the global leader in carbon capture and storage (CCS) design, today announced a major step in solving a key challenge for the CCS industry. The companies have begun operations at a new laboratory in Taipei to develop a chemical injection unit to prevent corrosion in CCS networks. This partnership combines Foxconn’s expertise in precision manufacturing with Pace CCS’s specialized design knowledge. It demonstrates how cross-industry collaboration can advance the shared goal of fighting climate change. Carbon capture and storage is a critical technology for achieving Net Zero emissions. The global demand for carbon capture is estimated at eight billion metric tons of CO2 annually, requiring trillions of dollars in investment. A key technical challenge is protecting CCS infrastructure from corrosion. Chemical reactions within the CO2 stream can create corrosive products such as sulfuric acid and nitric acid. These reactions can also produce water and solids, which lead to corrosion, erosion, and clogged disposal wells. The new laboratory will prove the efficacy of a chemical scavenger, already used in industries including semiconductor manufacturing. The goal is to show it can prevent the formation of these damaging acids and water under real-world CCS conditions. “This is the solution the CCS industry has been waiting for,” said Matthew Healey, Pace CCS Managing Director. “By turning a major technical challenge into a simple operational expense, we’re accelerating global CCS deployment.” “Foxconn is proud to bring our supply chain expertise to the energy transition,” said Ron R. T. Horng, Foxconn’s Chief Environment Officer. “This collaboration shows how cross-industry partnerships can drive meaningful progress against climate change.”   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   About Pace CCS Pace CCS are the global leaders delivering design for CCS projects, with experience with well over 100 CCS projects worldwide. Pace CCS are based in London and Kuala Lumpur. To learn more, visit www.paceccs.com.

18 December 2025, Taipei, Taiwan – The Hon Hai Research Institute (HHRI) is pleased to announce the successful completion of Round 1 of the Australian Quantum Software Network (AQSN) Micro & MesoGrant Scheme. In this inaugural round, HHRI, as the key sponsor, awarded more than AUD 150,000 in competitive funding to support early-career and mid-career researchers across Australia in advancing quantum software and algorithmic research. The AQSN MicroGrant / MesoGrant programs are funding schemes designed to support research in quantum algorithms, quantum software, and quantum theory. AQSN members—including students and researchers—may apply. The MicroGrant is suitable for short-term or early-stage open-source projects, while the MesoGrant supports mid-scale or collaborative research efforts. Funded projects typically run for 6–12 months and require outcomes to be open-sourced and publicly shared, fostering collaboration and knowledge exchange within the quantum software community. AQSN founder and Review Committee member Dr. Simon Devitt stated: ”We sincerely appreciate the support from the Hon Hai Research Institute’s Quantum Computing Research Center and the enthusiastic participation of the Australian quantum research community. Congratulations to all the award recipients. HHRI’s generous sponsorship has enabled AQSN to empower the next generation of quantum pioneers and to build a vital bridge between academic excellence and industrial impact. We are honored to collaborate with HHRI in establishing a strong software foundation for the quantum era.” Dr. Min-Hsiu Hsieh, Director of HHRI’s Quantum Computing Research Center, said:“Scientific breakthroughs often originate from a small yet bold idea. At the Hon Hai Research Institute, we are committed to becoming a catalyst for innovation. By supporting AQSN’s young scholars, we hope to inject fresh momentum into the field of quantum computing. This collaborative initiative represents HHRI’s commitment to nurturing the next generation of quantum talent, and we look forward to seeing students and researchers become key forces driving global quantum technology development.” A total of 9 projects were selected, including six MicroGrants and three MesoGrants fully sponsored by HHRI. These projects reflect the depth and creativity of Australia’s quantum research community, ranging from foundational theory to practical algorithmic development. The successful recipients and their project topics are listed below: MesoGrant Recipients 1.       Clément Canonne (University of Sydney) — Towards Understanding Which Quantum Circuits Can Be Classically Sampled 2.       Harini Hapuarachchi (RMIT University) — Towards a Unified Software Toolkit to Simulate Noise in Diamond-Based Room-Temperature Spin Qubits 3.       Angus Southwell (Monash University) — Quantum Gibbs Sampling via Simplicial Complexes MicroGrant Recipients 1.       Jonas Freiheit (RMIT University) — Optimising Encoding & Readout for Quantum Reservoir Computing Based on Quantum Ising Models 2.       Elija Perrier (University of Technology Sydney) — Coherent Learning for Quantum Agents 3.       Abhinash Kumar Roy (Macquarie University) — Resource-Efficient Characterisation of Multi-Time Quantum Processes 4.       Varun Srivastava (Macquarie University) — Randomised Benchmarking as a Diagnostic for Non-Markovian Noise and Fault-Tolerance Thresholds 5.       Mingyu Sun (University of Technology Sydney) — Scalable Fidelity Estimation and Learnability from Local Measurements 6.       Tianhui Zhu (UNSW) — Implementing Virtual Distillation with Quantum Algorithms HHRI extends its gratitude to the AQSN assessment committees and the entire Australian quantum research community for their enthusiastic participation. Congratulations to all awardees. Hon Hai Research Institute remains committed to supporting quantum research and innovation worldwide, fostering academic collaboration, and accelerating the development of next-generation quantum technologies. We look forward to supporting future rounds of this scheme and the exciting research that will emerge as a result. About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy. To learn more, visit https://www.hh-ri.com

21 November 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE: 2317), the world's largest technology manufacturer and service provider, on Friday detailed its latest progress in electromobility that combines artificial intelligence technology and modular versatility to bring diverse application scenarios to a single reference electric vehicle – the MODEL A. Presented for the first time on stage at Hon Hai Tech Day 2025, the MODEL A is a B segment vehicle, offering B2B customers a choice of seating configurations from single to eight seats, suitable for small families and multi-generational trips. Its highly flexible interior space, coupled with compatible sliding and side-opening doors, means the same reference model can cater, as well, to the needs of taxis, commercial vans, or last-mile delivery in logistics. “This is more than just a single model. It is a symbol of collaboration and innovation in the EV industry,” said Jun Seki, Foxconn Chief Strategy Officer for EV, with three different MODEL A’s on the HHTD25 stage. Its design philosophy of "Being White" emphasizes purity and flexibility, blending Japanese aesthetics with scalability to adapt to various scenarios and needs. The spaciousness and convenience with strong battery and motor performance and semi-zonal control follow extensive research by Foxconn’s Japanese EV development team of local market tastes and work-life needs of users in the Japan market. The MODEL A, which stands for affordable development, utilizes off-the-shelf components to achieve Time To Cost and Time To Market goals. Depending on customer timelines, MODEL A is expected to initially launch in the Japanese market in 2027 with potential adoption later in Southeast Asia. The new design concept incorporates Smart Battery Management and Smart Thermal Management to extend battery life and achieve an optimal balance between comfort and battery consumption. The MODEL A can be equipped with Foxconn's self-developed LiDAR technology, showcasing the future potential of ADAS/AD systems. For commercial vehicle use, the MODEL A's smart cockpit features Smart Translation, supporting multilingual communication. Through an immersive in-car audio experience, the "mobile room" concept is embodied, echoing SHARP Corp's the "LDK+" philosophy showcased at the Japan Mobility Show in October. This not only enhances vehicle performance and usability but also provides flexible solutions for various usage scenarios. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

New AI Factory Infrastructure Supports Scalable Enterprise-Grade Computing to Support Taiwan’s Leadership in AI 【21 November 2025, Taipei, Taiwan】At this year’s Hon Hai Tech Day (HHTD25), Visionbay.ai by Hon Hai Technology Group’s (Foxconn) (TWSE 2317) dedicated business unit for AI supercomputing and cloud operations—made its first public debut, announcing plans to build Taiwan’s largest GPU cluster as well as its first supercomputing center deployment built on NVIDIA GB300 NVL72. The NVIDIA GB300 NVL72 systems are scheduled to come online in the first half of next year, marking a significant acceleration in Taiwan’s sovereign AI infrastructure development. Visionbay showcased its latest “AI Supercomputing Center & Operations Platform”, demonstrating vertically integrated capabilities across every layer of the AI value chain. The platform introduces a comprehensive end-to-end AI Factory solution—from AI infrastructure to application-layer integration services. This milestone marks a new chapter for Taiwan in the global AI race and positions. Visionbay as a core engine of Foxconn’s long-term “3+3+3” strategy, driving sovereign AI development and enabling large-scale industrial transformation. The CEO of Visionbay.ai, Neo Yao emphasized, “To stay competitive in the AI era, Taiwan must rapidly establish scalable and cost-effective AI infrastructure. Only with strong, accessible compute can we accelerate AI adoption, expand industry applications, and cultivate a world-class environment for AI talent and innovation.” By integrating Foxconn’s strengths in component manufacturing, server R&D, supply-chain integration, cooling technology, and LLM development, Visionbay addresses the key challenges enterprises face—including compute shortages, rising self-build costs, and the lack of a truly enterprise-ready AI integration platform. In a fireside conversation with NVIDIA DGX Cloud Vice President Alexis Bjorlin, both leaders highlighted a major shift in enterprise AI strategy: Enterprises can speed development and deployment of AI by adopting an “existing workflows + AI” approach, shortening the time from AI experimentation to full-scale deployment. The session also underscored the increasing importance of secure, sovereign, local supercomputing enabling enterprises to maintain data residency, safeguard domain knowledge, and reduce dependency on overseas compute resources. The business model of Visionbay centers on a comprehensive AI Factory ecosystem, offering GPUaaS compute leasing, NVIDIA-native software solutions, and a cloud-based AI App Store. By gaining instant access to high-performance training, fine-tuning, development, and inference capabilities, enterprises can adopt AI with minimal barriers—powered by NVIDIA next-generation accelerated computing architecture. Looking ahead, Visionbay will continue advancing its full-stack AI service capabilities under its mission of “Empowering the Future of AI”. In partnership with government, industry, academia, and startups, Visionbay aims to build the next generation of AI-driven future—starting from Taiwan.  About Visionbay.ai (“Visionbay”) Visionbay.ai is [A1] the Hon Hai Technology Group’s dedicated business unit for supercomputing and cloud-AI operations. With a mission to empower Asia’s AI ecosystem, Visionbay integrates national-level computing infrastructure with Hon Hai’s deep strengths in manufacturing, design, and supply-chain orchestration. Its end-to-end AI Factory solutions span high-performance compute, cloud operations, supply-chain integration, AI model and tool development, and an AI App Store. Visionbay helps enterprises accelerate digital and AI transformation while building a trusted and sustainable sovereign-AI ecosystem. To learn more, visit www.honhai.com/Visionbay.ai  About Hon Hai Technology Group (“Foxconn”) Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD 6.86 trillion (approx. USD 208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

NVIDIA, OpenAI, Alphabet, IBM, ABB Robotics, Uber, FUSO Participate Onstage21 November 2025, Taipei, Taiwan – Accelerating its transformation into an AI-powered technology platform service company, Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) on Friday welcomed powerful partnerships, including NVIDIA, OpenAI and Alphabet, and shared its unrivalled strength in vertical integration at its annual flagship technology conference, Hon Hai Tech Day 2025. The speed and progressof the world’s largest electronics manufacturer in the fields of supercomputing, smart manufacturing, intelligent electric vehicles and more came into focus as global AI, tech and automotive bellwethers – in a line-up also spotlighting IBM, ABB Robotics, Uber and Mitsubishi Fuso Truck and Bus Corp – took to the stage on opening day of HHTD25. “Our competitive strength is vertical integration. Our technological depth and manufacturing heritage enables deep collaborations with world-class technology leaders, partners who rely on us because they know that Foxconn can turn ideas into reality – quickly, reliably and at scale,” said Foxconn Chairman Young Liu. “It positions us well as we push into frontier technologies paved open by AI and quantum.” OpenAI CEO Sam Altman spoke for the first time about the significance of a new partnership with Foxconn: “Demand for critical components for AI infrastructure is already far outpacing supply and we expect that will only continue over the coming years. This agreement is about strengthening supply chains to meet existing and future needs across the industry,” Altman said via video. Another powerful partner, Alphabet Chief Product Officer of Other Bets, Hiroshi Lockheimer, said via video, “Foxconn is an important partner to Google and Alphabet, and our collaboration has helped bring to life some of the most important technological innovations of the past decade.” Foxconn, a Taiwan NVIDIA Cloud Partner, known as NCP, is investing US$1.4 billion in an advanced supercomputing center, accelerated by 10,000 NVIDIA Blackwell Ultra GPUs, that will be utilizing next-generationNVIDIA GB300 NVL72 AI infrastructure in the first half 2026.   It would make it among the first in Asia to use the most advanced NVIDIA Blackwell platform, said Neo Yao, CEO of Foxconn subsidiary Visionbay, which is leading the project. Yao discussed the pathway for revolutionary AI factories alongside Alexis Bjorlin, Vice President of NVIDIA DGX Cloud, in the first of two morning talks featuring NVIDIA executives on topics of AI-powered supercomputing and robotics. The roadmap to humanoids in Smart Manufacturing – from simple and fixed; to simple but flexible; to complicated but flexible – and how quantum technologies can have the potential to elevate future AGI to another level, came under discussion. On display at HHTD25’s bigger than ever exhibition area were over 200 products and technologies. A model of an AI-ready modular container data center installed with GB300 AI infrastructure was set up for the first time at HHTD25 exhibition area, demonstrating unrivalled turnkey solutions, covering L1 to L12 manufacturing and strong vertical integration capabilities. Presented for the first time on the HHTD25 stage, the MODEL A is a B-segment class EV, combining artificial intelligence technology and modular versatility to bring diverse application scenarios to a single reference electric vehicle. Among EV reference vehicles, six MODEL B's, some in never before seen colors on the crossover; three unique reference styles of the MODEL A; the award-winning MODEL T electric bus built with Foxconn motor and battery; the midi-size MODEL U for shuttle use; the LMUV MODEL D; and North American variant of the family SUV MODEL C were parked for viewing throughout the HHTD25 hall. HHTD25 runs from November 21-22 at the Taipei Nangang Exhibition Center, Hall 1, 4F.   For more on Hon Hai Tech Day 2025 here. About Foxconn here.

TAIPEI, Oct. 22, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), announced that its Global Headquarters has officially obtained the highest Platinum rating for the UL 2799 Zero Waste to Landfill validation program. This achievement signifies a 100% landfill waste diversion rate and makes it the first Global Headquarters in Taipei among Foxconn’s major subsidiaries to receive this recognition. FIH Senior Assistant Vice President of Business Control Division, Alex Chan, stated, "Promoting circular economy is a key pillar of FIH’s environmental vision. The attainment of the internationally recognized UL 2799 Platinum Certification by our Global Headquarters reflects the collective dedication of our entire team. This milestone underscores our ongoing commitment to optimizing resource use and enhancing waste management. Looking ahead, we will continue to uphold sustainability as a core value, driving long-term resilience and environmental responsibility."   FIH Global Headquarters focuses on design, research and development (R&D), and engineering services. The waste generated from daily operations primarily consists of general office waste, which is inherently difficult to recycle or reuse, making the realization of zero waste to landfill more challenging. To address this, FIH comprehensively reviewed its waste types and quantities, established recycling procedures, and implemented training to raise employee awareness. In response to this initiative, employees actively implemented waste management practices, weaving sustainability principles into their daily operations.   To date, 8 of FIH’s 11 global sites have obtained UL 2799 certification, including the Taipei Global Headquarter, Longhua, Langfang, Hengyang, Beijing, Fushan, Que Vo, and Chihuahua sites. Seven of them have obtained Platinum certification and one has been awarded Gold, successfully accomplishing the goal, "half of the sites obtain the UL 2799 certification at Gold level by 2030," ahead of schedule. The certification of the Global Headquarters further demonstrates FIH's ability to sort and manage different kinds of waste disposal, achieving zero waste to landfill in both production sites and headquarter offices. Beyond actively implementing zero-waste to landfill initiative at its own sites, FIH has also set clear targets requiring suppliers to obtain UL 2799 certification, collaborating with industry partners to build a more sustainable supply chain.   This year, FIH's ESG performance has been recognized by several sustainability rating agencies. Morningstar Sustainalytics ESG Risk Rating evaluated FIH as "Low Risk" (13.4), placing it in the top 7% among all rated companies, which reflects the robustness of the ESG strategy and risk management. As for corporate governance, FIH has attained the ISO 37001 Anti-bribery Management System certification, ensuring its corporate operations adhere to the highest standards of integrity and transparency, thus moving toward a sustainable future with a more robust governance framework.About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers. For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

No 1 ‘Most Honored Company’ in Technology Hardware, ex-Japan & China23 September 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has been recognized as Asia’s No 1 “Most Honored Company” in Technology Hardware, outside of Japan and China, by Extel, a trusted leader in proprietary benchmark research and rankings formerly known as Institutional Investor.The world’s largest electronics manufacturer and technology service provider, in the 2025 Extel awards celebrating Asia Equities, also swept up top honors in its categories, including Best CEO for Foxconn Chairman and Chief Executive Officer Young Liu and Best CFO for Chief Financial Officer David Huang.Across award categories, ex-Japan and China, Foxconn was also honored for: ·      Best Company Board ·      Best ESG Program ·      Best IR Program ·      Best IR Team ·      Best IR Professional – Kristen FangThe results make it the biggest winner this year from Taiwan, demonstrating consistent recognition from global capital markets of the Group’s strong Asia Executive Team.“This recognition from international institutional investors not only highlights Foxconn’s global competitiveness but also validates our efforts in investor relations and sustainable development,” said Chairman Liu. “We will share, collaborate and thrive in our work to uphold IR best practices and collectively elevate Taiwan’s overall IR professionalism.”Foxconn CFO Huang said: “Capital investments that propel the Group’s ‘3+3+3’ strategic areas of growth, are done in hand with strict financial discipline to ensure optimal capital allocation, balancing operational and financial risks with the ultimate goal of maximizing shareholder returns.”Foxconn Spokesperson James Wu said: “We have enhanced external investor services, while also strengthening IR’s role in internal information integration and strategic advisory by adopting AI and other advanced technologies. The ‘Most Honored Company’ distinction and seven 1st-place rankings from Extel represent the highest level of recognition from global institutional investors for Foxconn’s management team, reflecting our dedication and professionalism.”The bellwether awards from Extel are the result of surveys this year that invited 5,400 buy-side fund managers and over 800 sell-side analysts to participate, making it one of the most influential and prestigious evaluations in the capital markets. Over the years, Extel’s rigorous selection process has given winners a globally recognized honor. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com