New AI Factory Infrastructure Supports Scalable Enterprise-Grade Computing to Support Taiwan’s Leadership in AI【21 November 2025, Taipei, Taiwan】At this year’s Hon Hai Tech Day (HHTD25), Visionbay.ai by Hon Hai Technology Group’s dedicated business unit for AI supercomputing and cloud operations—made its first public debut, announcing plans to build Taiwan’s largest GPU cluster as well as its first supercomputing center deployment built on NVIDIA GB300 NVL72. The NVIDIA GB300 NVL72 systems are scheduled to come online in the first half of next year, marking a significant acceleration in Taiwan’s sovereign AI infrastructure development. As Trusted NVIDIA Cloud Partner (NCP), Visionbay showcased its latest “AI Supercomputing Center & Operations Platform”, demonstrating vertically integrated capabilities across every layer of the AI value chain. The platform introduces a comprehensive end-to-end AI Factory solution—from AI infrastructure to application-layer integration services. This milestone marks a new chapter for Taiwan in the global AI race and positions Visionbay as a core engine of Foxconn’s long-term “3+3+3” strategy, driving sovereign AI development and enabling large-scale industrial transformation. The CEO of Visionbay.ai–Neo Yao emphasized, “To stay competitive in the AI era, Taiwan must rapidly establish scalable and cost-effective AI infrastructure. Only with strong, accessible compute can we accelerate AI adoption, expand industry applications, and cultivate a world-class environment for AI talent and innovation.” By integrating the Group’s strengths in component manufacturing, server R&D, supply-chain integration, cooling technology, and LLM development, Visionbay.ai addresses the key challenges enterprises face—including compute shortages, rising self-build costs, and the lack of a truly enterprise-ready AI integration platform. In a fireside conversation with NVIDIA DGX Cloud Vice President Alexis Bjorlin, both leaders highlighted a major shift in enterprise AI strategy: Enterprises can speed development and deployment of AI by adopting an “existing workflows + AI” approach, shortening the time from AI experimentation to full-scale deployment. The session also underscored the increasing importance of secure, sovereign, local supercomputing enabling enterprises to maintain data residency, safeguard domain knowledge, and reduce dependency on overseas compute resources.   Visionbay’s business model centers on a comprehensive AI Factory ecosystem, offering GPUaaS compute leasing, NVIDIA-native software solutions, and a cloud-based AI App Store. By gaining instant access to high-performance training, fine-tuning, development, and inference capabilities, enterprises can adopt AI with minimal barriers—powered by NVIDIA next-generation accelerated computing architecture. Looking ahead, Visionbay.ai will continue advancing its full-stack AI service capabilities under its mission of “Empowering the Future of AI”. In partnership with government, industry, academia, and startups, Visionbay aims to build the next generation of AI-driven future—starting from Taiwan.  About Visionbay.ai Visionbay is the Hon Hai Technology Group’s dedicated business unit for supercomputing and cloud-AI operations. With a mission to empower Asia’s AI ecosystem, Visionbay integrates national-level computing infrastructure with Hon Hai’s deep strengths in manufacturing, design, and supply-chain orchestration. Its end-to-end AI Factory solutions span high-performance compute, cloud operations, supply-chain integration, AI model and tool development, and an AI App Store. Visionbay.ai helps enterprises accelerate digital and AI transformation while building a trusted and sustainable sovereign-AI ecosystem. To learn more, visit www.honhai.com/Visionbay.ai About Hon Hai Technology Group (“Foxconn”) Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD 6.86 trillion (approx. USD 208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visitwww.honhai.com

NVIDIA, OpenAI, Alphabet, IBM, ABB Robotics, Uber, FUSO Participate Onstage21 November 2025, Taipei, Taiwan – Accelerating its transformation into an AI-powered technology platform service company, Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) on Friday welcomed powerful partnerships, including NVIDIA, OpenAI and Alphabet, and shared its unrivalled strength in vertical integration at its annual flagship technology conference, Hon Hai Tech Day 2025. The speed and progressof the world’s largest electronics manufacturer in the fields of supercomputing, smart manufacturing, intelligent electric vehicles and more came into focus as global AI, tech and automotive bellwethers – in a line-up also spotlighting IBM, ABB Robotics, Uber and Mitsubishi Fuso Truck and Bus Corp – took to the stage on opening day of HHTD25. “Our competitive strength is vertical integration. Our technological depth and manufacturing heritage enables deep collaborations with world-class technology leaders, partners who rely on us because they know that Foxconn can turn ideas into reality – quickly, reliably and at scale,” said Foxconn Chairman Young Liu. “It positions us well as we push into frontier technologies paved open by AI and quantum.” OpenAI CEO Sam Altman spoke for the first time about the significance of a new partnership with Foxconn: “Demand for critical components for AI infrastructure is already far outpacing supply and we expect that will only continue over the coming years. This agreement is about strengthening supply chains to meet existing and future needs across the industry,” Altman said via video. Another powerful partner, Alphabet Chief Product Officer of Other Bets, Hiroshi Lockheimer, said via video, “Foxconn is an important partner to Google and Alphabet, and our collaboration has helped bring to life some of the most important technological innovations of the past decade.” Foxconn, a Taiwan NVIDIA Cloud Partner, known as NCP, is investing US$1.4 billion in an advanced supercomputing center, accelerated by 10,000 NVIDIA Blackwell Ultra GPUs, that will be utilizing next-generationNVIDIA GB300 NVL72 AI infrastructure in the first half 2026.   It would make it among the first in Asia to use the most advanced NVIDIA Blackwell platform, said Neo Yao, CEO of Foxconn subsidiary Visionbay, which is leading the project. Yao discussed the pathway for revolutionary AI factories alongside Alexis Bjorlin, Vice President of NVIDIA DGX Cloud, in the first of two morning talks featuring NVIDIA executives on topics of AI-powered supercomputing and robotics. The roadmap to humanoids in Smart Manufacturing – from simple and fixed; to simple but flexible; to complicated but flexible – and how quantum technologies can have the potential to elevate future AGI to another level, came under discussion. On display at HHTD25’s bigger than ever exhibition area were over 200 products and technologies. A model of an AI-ready modular container data center installed with GB300 AI infrastructure was set up for the first time at HHTD25 exhibition area, demonstrating unrivalled turnkey solutions, covering L1 to L12 manufacturing and strong vertical integration capabilities. Presented for the first time on the HHTD25 stage, the MODEL A is a B-segment class EV, combining artificial intelligence technology and modular versatility to bring diverse application scenarios to a single reference electric vehicle. Among EV reference vehicles, six MODEL B's, some in never before seen colors on the crossover; three unique reference styles of the MODEL A; the award-winning MODEL T electric bus built with Foxconn motor and battery; the midi-size MODEL U for shuttle use; the LMUV MODEL D; and North American variant of the family SUV MODEL C were parked for viewing throughout the HHTD25 hall. HHTD25 runs from November 21-22 at the Taipei Nangang Exhibition Center, Hall 1, 4F.   For more on Hon Hai Tech Day 2025 here. About Foxconn here.

TAIPEI, Oct. 22, 2025 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), announced that its Global Headquarters has officially obtained the highest Platinum rating for the UL 2799 Zero Waste to Landfill validation program. This achievement signifies a 100% landfill waste diversion rate and makes it the first Global Headquarters in Taipei among Foxconn’s major subsidiaries to receive this recognition. FIH Senior Assistant Vice President of Business Control Division, Alex Chan, stated, "Promoting circular economy is a key pillar of FIH’s environmental vision. The attainment of the internationally recognized UL 2799 Platinum Certification by our Global Headquarters reflects the collective dedication of our entire team. This milestone underscores our ongoing commitment to optimizing resource use and enhancing waste management. Looking ahead, we will continue to uphold sustainability as a core value, driving long-term resilience and environmental responsibility."   FIH Global Headquarters focuses on design, research and development (R&D), and engineering services. The waste generated from daily operations primarily consists of general office waste, which is inherently difficult to recycle or reuse, making the realization of zero waste to landfill more challenging. To address this, FIH comprehensively reviewed its waste types and quantities, established recycling procedures, and implemented training to raise employee awareness. In response to this initiative, employees actively implemented waste management practices, weaving sustainability principles into their daily operations.   To date, 8 of FIH’s 11 global sites have obtained UL 2799 certification, including the Taipei Global Headquarter, Longhua, Langfang, Hengyang, Beijing, Fushan, Que Vo, and Chihuahua sites. Seven of them have obtained Platinum certification and one has been awarded Gold, successfully accomplishing the goal, "half of the sites obtain the UL 2799 certification at Gold level by 2030," ahead of schedule. The certification of the Global Headquarters further demonstrates FIH's ability to sort and manage different kinds of waste disposal, achieving zero waste to landfill in both production sites and headquarter offices. Beyond actively implementing zero-waste to landfill initiative at its own sites, FIH has also set clear targets requiring suppliers to obtain UL 2799 certification, collaborating with industry partners to build a more sustainable supply chain.   This year, FIH's ESG performance has been recognized by several sustainability rating agencies. Morningstar Sustainalytics ESG Risk Rating evaluated FIH as "Low Risk" (13.4), placing it in the top 7% among all rated companies, which reflects the robustness of the ESG strategy and risk management. As for corporate governance, FIH has attained the ISO 37001 Anti-bribery Management System certification, ensuring its corporate operations adhere to the highest standards of integrity and transparency, thus moving toward a sustainable future with a more robust governance framework.About FIH Mobile Limited FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers. For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.

No 1 ‘Most Honored Company’ in Technology Hardware, ex-Japan & China23 September 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) has been recognized as Asia’s No 1 “Most Honored Company” in Technology Hardware, outside of Japan and China, by Extel, a trusted leader in proprietary benchmark research and rankings formerly known as Institutional Investor.The world’s largest electronics manufacturer and technology service provider, in the 2025 Extel awards celebrating Asia Equities, also swept up top honors in its categories, including Best CEO for Foxconn Chairman and Chief Executive Officer Young Liu and Best CFO for Chief Financial Officer David Huang.Across award categories, ex-Japan and China, Foxconn was also honored for: ·      Best Company Board ·      Best ESG Program ·      Best IR Program ·      Best IR Team ·      Best IR Professional – Kristen FangThe results make it the biggest winner this year from Taiwan, demonstrating consistent recognition from global capital markets of the Group’s strong Asia Executive Team.“This recognition from international institutional investors not only highlights Foxconn’s global competitiveness but also validates our efforts in investor relations and sustainable development,” said Chairman Liu. “We will share, collaborate and thrive in our work to uphold IR best practices and collectively elevate Taiwan’s overall IR professionalism.”Foxconn CFO Huang said: “Capital investments that propel the Group’s ‘3+3+3’ strategic areas of growth, are done in hand with strict financial discipline to ensure optimal capital allocation, balancing operational and financial risks with the ultimate goal of maximizing shareholder returns.”Foxconn Spokesperson James Wu said: “We have enhanced external investor services, while also strengthening IR’s role in internal information integration and strategic advisory by adopting AI and other advanced technologies. The ‘Most Honored Company’ distinction and seven 1st-place rankings from Extel represent the highest level of recognition from global institutional investors for Foxconn’s management team, reflecting our dedication and professionalism.”The bellwether awards from Extel are the result of surveys this year that invited 5,400 buy-side fund managers and over 800 sell-side analysts to participate, making it one of the most influential and prestigious evaluations in the capital markets. Over the years, Extel’s rigorous selection process has given winners a globally recognized honor. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

22 August 2025, Taipei, Taiwan – Mitsubishi Fuso Truck and Bus Corporation (MFTBC) and Hon Hai Technology Group (“Foxconn”) (TWSE:2317) have signed a memorandum of understanding to explore strategic collaboration in zero emission buses, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer.As part of the collaboration that will strengthen the FUSO bus business, the two companies via their subsidiaries – Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – will cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.The four companies will use the MOU as a starting point to investigate future business models aimed at strengthening the FUSO brand and developing new, made-in-Japan buses. Through this initiative, the companies will provide products that meet a wider range of needs in the rapidly evolving bus market and achieve sustainable business growth.MFBM will serve as the operations platform for the development, production, and commercialization of buses in target markets, including exploring the introduction of made-in-Japan ICE and ZEV buses into target markets.With a track record in performance and safety, the award-winning, full-size MODEL T is already operating commercially as part of the public transit systems in Taiwan’s biggest cities. Universal and intelligent in mid-size mobility, MODEL U’s clean and simple appearance emphasizes flexibility and multi-functionality. About Mitsubishi Fuso Truck and Bus CorporationMitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.

Kicks off with industry keynote on “Intelligent Alliances” 14 August 2025, Dallas, Texas – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) on Thursday displayed, for the first time in the United States, its North American-variant electric SUV and demonstrated, for only the second time, its cutting-edge artificial intelligence infrastructure, at Taiwan Expo USA, a conference highlighting the strength of a key partnership in this era of industrial evolution. Foxconn, the world’s largest electronics manufacturer will exhibit in Dallas a mass production model of the North American MODEL C family SUV, as well as the NVIDIA GB300 NVL72, HGX and MGX architectures used in AI data centers by cloud service providers and hyperscalers. AI and mobility, along with Smart Manufacturing and Smart City technologies, are being introduced for the first time in Texas, a key state in the US that is part of Foxconn’s broader global footprint. Foxconn Chief Product Officer Jerry Hsiao, invited to deliver the industry keynote on the Expo’s first day, shared Foxconn’s more than 40 years of growth in the United States and offered insights on technology cooperation going forward. “The US is a vital part of our footprint, enabling us to better serve the rapidly growing demand from our customers for AI and data solutions across the world. Foxconn invests heavily in R&D to innovate in areas like cooling technologies, energy efficiency, and modular server design, helping to advance the capabilities of AI infrastructure,” said Mr Hsiao.In remarks titled, “Intelligent Alliances: Driving the AI Era through Taiwan and the US”, Mr Hsiao, who is also a director with the US National Association of Manufacturers (NAM), offered insights on how Foxconn deploys its local US strengths to promote the development of server manufacturing, smart manufacturing, electric vehicles, and AI applications. Foxconn, a Taiwanese company, expanded to the United States in 1980, making the United States the first of its international footprint. Currently, the Group has more than 40 operational sites across 12 American states, employing over 6,500 people. First seen at GTC 2025 earlier this year, Foxconn’s world-class, vertically-integrated AI server system solutions are being displayed for only the second time this year in the US, reaching its central region with the Dallas expo. Equipped with NVIDIA GB300 NVL72, HGX and MGX architectures, and integrated with advanced liquid cooling and power-management technologies, this infrastructure forms a critical backbone for intelligent applications, supporting large language model (LLM) training, AI inference, and scalable data-center operations.The North American-variant of the MODEL C EV is optimized to meet the needs of the US market, including enlarging the S-duct air deflector design, optimizing the side mirror shape to enhance aerodynamic efficiency, incorporating Adaptive Driving Beam technology, and adopting a charging interface that supports the NACS standard. The UI/UX was done jointly by Foxconn and American partners, combining physical and touch controls to match local user habits while improving convenience and safety.Foxconn’s smart manufacturing initiatives feature AI-powered production lines that boost yield while reducing production risk. Its proprietary CityGPT platform, a cornerstone of the Smart City, blends generative AI with digital twin technology to enhance transportation and municipal applications.

Electromechanics, ICT, key markets get boost in new shares exchange30 July 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and TECO Electric & Machinery Co Ltd (“TECO”) (TWSE:1504) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race. The move brings together the strengths of Foxconn, the world’s largest electronics manufacturing service provider and AI server producer, and TECO, a leader in industrial electro-mechanical engineering and green energy innovation. Seizing on the development of global AI data center (AIDC) construction towards standardization and modularization, the two companies will jointly explore AIDC business opportunities. Global customers will be able to tap comprehensive data center modular products, electromechanical engineering services, and cost-competitive, one-stop solutions. According to terms approved by both boards, respectively, TECO will take a 0.519% stake in Hon Hai Precision Industry Co Ltd, the formal name Foxconn trades on at the Taiwan Stock Exchange. In turn, Foxconn will own 10% in TECO. The latter will issue 237,644,068 new shares to Foxconn, and Foxconn will issue 72,481,441 new shares to TECO, implying a share exchange ratio of approx. 1 to 0.305. The no-cash transaction is targeted to complete in the fourth quarter of this year, conditional on regulatory approvals. Foxconn Chairman Young Liu said, “Time-to-market is key in the global super-computing race. Modular design is gaining popularity. As AI data centers grow in size and demand ramps higher, teaming up with TECO means both companies are able to level up and rapidly deliver comprehensive, vertically-integrated solutions to our customers – the Tier-1 CSPs and hyperscalers.” TECO Chairman Morris Li said, “Changing global dynamics are creating new opportunities for business and cooperation. The strategic partnership extends the two companies’ cooperation in the fields of low-carbon smart factories and energy services, toward being a one-stop solution for data centers going forward.” Target markets cover Taiwan and Asia, as well as the Middle East and the US. Foxconn has deep vertical integration capabilities in manufacturing AI server racks and an unrivaled customer base. Liu said Foxconn will actively develop a modular architecture for AI data centers, and with TECO aim to extend the value chain from server components and racks to data center construction. Li said that Texas-based TECO-Westinghouse, a longstanding world leader in manufacturing electric motors, has the advantages of American manufacturing and local services. Together with Foxconn's manufacturing base in the United States, it is in line with the strategic direction of the two companies to expand American manufacturing and reshape the global supply chain. Previously cooperating in factory energy saving and emission reduction, and ESCO energy services, TECO and Foxconn have started discussions on establishing data center business in Taiwan and the United States. Since a data center is mainly composed of equipment inside the computer room (servers, cooling systems, UPS, etc.) and power infrastructure outside the computer room, the strategic alliance integrates the combined strengths each bring in their respective fields of AI servers, electromechanics, and information and communications. Going forward, the strategic alliance will explore the possibility of expanding cooperation in Foxconn’s “3+3+3” areas. As bellwethers in sustainability, both companies will use the strategic alliance as a starting point to enhance a low-carbon smart industry chain that aligns with international trends, and support supply chain resiliency and innovation. Both TECO and Foxconn were named in S&P Global’s Sustainability Yearbook 2025, a milestone ranking that demonstrates corporate sustainability strength.   About TECO Founded in 1956 as a motor manufacturer, TECO Electric & Machinery Co., Ltd. (“TECO”) has grown into one of the world’s top five industrial motor producers. Today, TECO operates across three core business groups—Green Mechatronic Solutions, Intelligence Energy, and Air & Intelligent Life—building a green ecosystem for energy generation, storage, and efficiency. Beyond motors, TECO has expanded into ESCO energy services, EV powertrain systems, and data center engineering. The company is a market leader in Taiwan’s onshore substations for offshore wind (2.5 GW), has delivered over 700 MW of data center projects across Southeast Asia, and holds more than 85% of Taiwan’s e-bus powertrain market, with recent expansion into India. TECO’s vision is to become the key driver in realizing global electrification, intelligence, and green energy. It has been included for five consecutive years in both the Dow Jones Best in Class Indices and the S&P Global Sustainability Yearbook, and has received the Taiwan Corporate Sustainability Award for eleven straight years. To learn more, visit www.teco.com.tw   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) will kick off COMPUTEX 2025 with the industry's most complete set of solutions for enterprise, agentic and physical AI factories, including advanced superchip AI infrastructure systems featuring the NVIDIA GB300 NVL72 architecture,, as well as systems and solutions for humanoid robots and smart manufacturing platforms – all available from the world’s largest electronics manufacturing service provider. A centerpiece of Foxconn’s industry leadership at this year’s COMPUTEX will be Tuesday’s keynote by Foxconn Chairman Young Liu, outlining the competitive edge generative artificial intelligence plus robotics offer to enterprises in their quest for innovation and for Foxconn as it optimizes its three intelligent platforms. Thanks to genAI driving strong growth momentum in the global robotics industry, Foxconn’s collaboration with key partners will be a highlight of its exhibits this year covering robotics from application to manufacturing. “GenAI plus robotics can assist, augment and optimize the way humans can innovate,” said Chairman Liu. “Foxconn’s three smart platforms all are connected to NVIDIA’s brilliant technologies. With the progress of our Smart Manufacturing, Smart EV and Smart City, Foxconn will help accelerate AI factories to become the standard for enterprise IT transformation underpinned by the NVIDIA platform.” On the COMPUTEX stage for the first time, the Foxconn keynote begins at 0930 a.m. local time on 20 May 2025 on 7F at the Taipei Nangang Exhibition Center Hall 2. Foxconn continues to promote smart manufacturing at multiple locations around the world and is working with NVIDIA to optimize production processes through a variety of AI solutions. On the exhibit floor, at Foxconn Booth L0106, the physical display of NVIDIA GB300 NVL72 AI infrastructure for training and reasoning large language models (LLM) with mega-level parameters, represents the state-of-the-art computing core of the AI factory. Foxconn, which holds more than 40% of the global AI server market, is a major supplier of NVIDIA GB200 NVL72 and the upcoming GB300 NVL72 architecture. Moreover, the NVIDIA MGX 4U, also on display, is a highly flexible air-cooled server designed to meet the diverse computing needs of modern data centers. The system can be equipped with up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, combining advanced AI acceleration capabilities with professional-grade graphics performance to provide breakthrough acceleration for multiple workloads such as generative AI, graphics rendering, and video processing. Foxconn will also showcase the latest generation NVIDIA HGX B300 system. As the latest in the HGX architecture, B300 is designed for the AI inference era and has more powerful computing performance and higher memory capacity to meet the growing needs of AI model deployment. Continuing Foxconn's industry-leading vertical integration advantage in AI servers, the Group is also exhibiting a full range of high-speed signal, high-voltage power supply and liquid-cooled full-speed connection solutions, including: new generation AI chip slot solutions, motherboard PCIE high-speed connectors and cables, GB300 Power Clip, Busbar cable and other related products. Through these innovative solutions, Foxconn strengthens its AI server cooling integration capabilities and continues to provide efficient, stable and customizable thermal management services. In the field of robotics and smart manufacturing platforms, Foxconn’s Semiconductor Hybrid Robot will take a prominent place on the exhibit floor, combining its advanced visual recognition and precision motion technology to provide efficient and safe intelligent transportation solutions for the semiconductor industry. Meanwhile, the AI-powered Nurabot, jointly developed by Foxconn, Taichung Veterans General Hospital and Kawasaki Heavy Industries, leverages all three of NVIDIA’s computers for developing and deploying physical AI. Nurabot’s AI models are trained using their FoxBrain AI Factory powered by NVIDIA DGX SuperPOD, simulated using NVIDIA Omniverse, and deployed on NVIDIA Jetson.  This collaborative nursing robot is expected to be deployed to partner hospitals in Taiwan later this year andis estimated to be able to reduce nursing hours by 30% and improve care efficiency and quality.

19 May 2025, Taipei, Taiwan –. Hon Hai Technology Group (Foxconn) today announced that it is partnering with NVIDIA and to build a state-of-the-art AI Factory supercomputing center in Taiwan. This initiative aims to provide the latest NVIDIA Blackwell infrastructure to industry, government, and academia across the region, accelerating Taiwan’s research and application of artificial intelligence. At the same time, Foxconn’s subsidiary, Big Innovation Company, will become the first NVIDIA Cloud Partner (NCP) in Taiwan, further strengthening the collaboration between the two companies. As part of this initiative, Foxconn is establishing Big Innovation Company, a subsidiary building the AI Factory in Taiwan and further deepening collaboration with NVIDIA. Foxconn’s AI factory will be one of Taiwan’s most powerful supercomputers, based on the NVIDIA Blackwell platform providing high performance computing  to industry, government and academia. TSMC researchers plan to leverage the system to advance their research and development with orders-of-magnitude faster performance, compared with previous-generation systems. “Share, collaborate and thrive. Foxconn is partnering with global leaders to shape a smarter way of life. This NVIDIA AI factory is laying the foundation for government, industry and academia to propel Taiwan toward its next era of innovation,” said Foxconn Chairman Young Liu. “NVIDIA AI factories are the infrastructure for the age of AI and robotics,” said Jensen Huang, Founder and CEO of NVIDIA. “Together, Foxconn and NVIDIA are building a state-of-the-art AI infrastructure for Taiwan's world-leading technology and electronics ecosystem.” “At TSMC, innovation lies at the heart of everything we do. By harnessing advanced AI infrastructure, we empower our researchers to accelerate breakthroughs in semiconductor technology, enabling next-generation solutions for our customers and the world,” said Dr. C.C. Wei, Chairman and CEO of TSMC. “Leveraging this AI factory reinforces our commitment to pushing the limits of AI-driven innovation.” The supercomputer will be equipped with NVIDIA Blackwell Ultra systems, including GB300 NVL72 rack system solutions, equipped with NVIDIA NVLink, NVIDIA Quantum InfiniBand and NVIDIA Spectrum-X Ethernet networking, and will become an important engine for the development of Foxconn's three major strategic platforms: Smart Manufacturing, Smart EV, Smart City. Foxconn joins a global network of NCPs, which offer hosted computing and  services using high-performance infrastructure built with NVIDIA GPUs, networking, and AI software. Foxconn will also contribute computing from the new AI Factory to  NVIDIA DGX Cloud Lepton, an AI platform and marketplace recently announced, which will further expand developers and enterprises' access to the global NVIDIA GPU ecosystem.  

To help meet increasing international customer demand faster and cost effectivelySan Francisco, CA and Taipei, Taiwan – May 16, 2025 – Robust.AI, a leader in AI-driven warehouse automation, today announced a strategic manufacturing partnership with Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturing services provider, to expand production of its flagship Carter™ multi-function collaborative robotics platform. The partnership will enable Robust.AI to rapidly fulfill increasing demand from its growing international customer base and strengthen the resilience of its supply chain and manufacturing operations. According to a recent Global Market Insights report, the warehouse automation market is forecasted to grow from $26.5 billion in 2024 to $115.8 billion by 2034 – a CAGR of 15.9%. However, 80% of warehouses lack any automation – not even a conveyor belt according to ResearchandMarkets. While AI is poised to create efficiencies in many industries, labor-intensive jobs in logistics and manufacturing require improvements in both physical capabilities and digital intelligence. Designed to augment existing warehouse operations and workforce, Carter’s drop-in automation capabilities help global manufacturing and logistics providers achieve significant productivity gains. Its collaborative, software-defined functionality allows facilities to dynamically switch functions between fulfillment picking, point-to-point transport, or a mobile sorting wall. This unprecedented flexibility enables customers to easily adapt to changing needs and workflows without additional infrastructure costs. Robust.AI recently announced that its Carter fleet deployment at a DHL Supply Chain facility in Las Vegas, NV, delivered more than 60% productivity gains to existing picking operations within weeks of implementation. “As shifting supply chains and international tariffs add complexity and costs to global logistics operations, our strategic manufacturing partnership with Foxconn will enable us to rapidly fulfil orders for Carter robots, which are delivering improved productivity and efficiency to some of the world’s largest logistics and manufacturing companies,” said Anthony Jules, CEO of Robust.AI. “Foxconn’s unparalleled global manufacturing capabilities make it one of the most trusted partners for advanced manufacturing in the world. Our combined robotics expertise will help multinational companies rapidly and cost-effectively streamline their logistics and warehousing operations and augment existing workforces with collaborative robotic automation solutions.” “Foxconn is pleased to expand its manufacturing partnership with Robust.AI and help accelerate and scale the production of its innovative Carter robotics platform worldwide,” said Bob Deng, EVP at Foxconn. “Our close collaboration at the onset of Carter’s development has contributed to the maturity, scalability and reliability of the platform and its manufacturing processes, allowing customers to confidently invest in Robust.AI’s unique warehouse automation solution and see immediate improvement in their warehousing and logistics capabilities.”  As part of its “3+3” development strategy, Foxconn has been building a diverse range of robots tailored to different application scenarios, and has even gone further to assist customers in manufacturing their own robotic products. The partnership with Robust.AI marks another milestone for Foxconn in the robotics industry. Over the past few months, Foxconn engineers have been working closely with Robust AI, training and helping build Carter robots in the U.S. for the past several months, which will greatly decrease production and deployment times as manufacturing scales.   About Robust.AI Robust.AI is founded and led by a world-class robotics team. We bring AI, robotics, and human-centered design together to make robots broadly useful, effortless to adopt, and delightful to use. For more information, visit www.robust.ai. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 32nd among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – next-generation communications technology, AI, and semiconductors – which are key to driving its long-term growth strategy. It is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com