14 October 2025, San Jose, California – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced it is collaborating with NVIDIA to implement the 800 VDC power architecture for AI factories announced at Computex 2025, marking the next step toward modern AI factory infrastructure.

Foxconn’s subsidiary Ingrasys Technology showcased the latest NVIDIA GB300 NVL72 platform, integrated with an In-row CDU solution to achieve new levels of energy efficiency.

Through continuous innovation in high-efficiency power and thermal design, Foxconn reinforces its leadership and highlights Taiwan’s pivotal role in the global AI supply chain.

The new architecture will first be implemented in the Kaohsiung K-1 artificial intelligence data center project, which serves as a demonstration site for the Group’s capabilities in AI servers, data centers and renewable-energy integration and further solidifies Taiwan’s strategic position in the global AI supply chain.

The latest collaboration between the bellwether technology partners, announced at the OCP Global Summit 2025 where Foxconn subsidiary Ingrasys also unveiled its latest NVIDIA GB300 NVL72 platform, highlights the Group’s commitment to deliver safer, more energy-efficient, and rapidly deployable AI factory and data center solutions.

The 800 VDC power architecture is purpose-built for high-density AI workloads. It features a modular and scalable design that significantly reduces current and resistive losses, minimizes conductor usage, and simplifies power distribution – while improving energy-conversion efficiency and system safety. It also supports multiple future generations of NVIDIA Infrastructure platforms platforms, providing a reliable, efficient, and sustainable power foundation to meet the demands of next-generation AI computing.

In addition, Foxconn’s subsidiary Ingrasys Technology also showcased a lineup of next-generation AI solutions, including NVIDIA GB300 NVL72, NVIDIA HGX B300 platform, and the new NVIDIA MGX servers designed for enterprise-grade AI applications. These innovations highlight Foxconn’s strong capabilities in AI infrastructure development, and system integration.

About Foxconn

Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com