Las Vegas, Taipei, Dec. 16, 2026 – FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will participate in CES 2026 from January 6 to 9. Under the theme "Driving the Future of Smart Mobility," FIH will showcase its core automotive electronics solutions, including the latest High-Performance Computing (HPC) platform, In-Vehicle Infotainment (IVI) systems, Advanced Driver Assistance Systems (ADAS), and Telematics Control Units (TCUs).

To demonstrate the centralized computing power and system integration capabilities of the HPC platform, FIH will present an interactive demo vehicle that allows visitors to control various car functions via the IVI interface to experience seamless operation.

FIH Vice President Dr. Wen Kuo stated, "The automotive industry has shifted from being primarily mechanical-driven to software-centric, which requires powerful centralized computing performance, software update capabilities, and cybersecurity resilience. With extensive experience in electronics product R&D, manufacturing, and system integration, FIH is well-positioned to provide automotive electronics solutions that align with industry trends, enabling automakers to accelerate transformation and enhance deployment flexibility."

FIH's HPC platform offers several advantages to support automakers in developing Software-Defined Vehicle (SDV):

l   Powerful Centralized Computing Capabilities: In addition to IVI and ADAS integration, the HPC platform also supports body control functions, e.g. window control, seat, light control, etc. The total product cost will be optimized for car OEMs.

l   Electrical/Electronic Architecture (E/EA) Optimization: Streamlines the traditional Electronic Control Unit (ECU)-intensive distributed architecture by leveraging Zone Control Unit (ZCU), improving overall system collaboration.

l   Accelerated Deployment of Innovative Features: Supports real-time Over-the-Air (OTA) software updates across all systems, helping automakers quickly deploy new features and reduce maintenance costs.

FIH will also present its TCU product line, including the e-Call certified 4G product supplied to a dozen globally renowned auto brands; the 5G variant that supports seamless cloud integration, real-time diagnostics, and high-speed data transmission; and modem-only models customizable for various requirements. In addition, FIH offers a multi-modem, multi-network TCU that enables carmakers to achieve level 4 autonomous driving and remote vehicle operation.

FIH's world-class TCU solutions have obtained ISO 26262 functional safety and ISO/SAE 21434 cybersecurity engineering certifications, as well as compliance with international standards such as ASPICE CL2, UN ECE R155 for cybersecurity, and R156 for software updates, demonstrating FIH’s comprehensive cybersecurity readiness and ensuring safe and reliable large-scale deployment.

In addition to its automotive electronics solutions, FIH will also showcase its self-designed Ku and Ka-band LEO user terminals, which integrate flat-panel phased array antenna system that can be applied to diverse scenarios such as maritime, land mobility, and aviation, supporting customers in deploying next-generation 6G communications.

Leveraging over two decades of experience in wireless communications and ICT, as well as extensive development and integration capabilities in mobile phones and IoT products, FIH continues to deepen its three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics. Through its global footprint and flexible production strategies, FIH aims to create exceptional value for customers worldwide.

Welcome to visit us at Booth No. 4167, West Hall, Las Vegas Convention Center.

CES 2026

FIH Exhibition Information:

l   Dates: January 6 to January 9, 2026 (Tuesday to Friday)

l   Location: Las Vegas Convention Center, the U.S.

l   Booth Number: No.4167

About FIH Mobile Limited

FIH Mobile Limited, a subsidiary of Hon Hai Technology Group (Foxconn), was established in May 2003 and listed on the Hong Kong Stock Exchange in 2005 (Ticker: 2038.HK). Leveraging its core technologies in handset ODM and its experience in hardware-software integration, FIH focuses on three main business categories: smart manufacturing, automotive electronics, and manufacturing equipment/robotics and provides exceptional engineering/manufacturing services and solutions to industry-leading customers.

For more information about FIH Mobile Limited, please visit the official website: https://www.fihmobile.com.