·      MODEL A+expands B2B product portfolios in fastest-growing B-segment SUV ·      MODEL K+ SUV playful styling gives nostalgic touches of Japan with neo city pop ·      MODEL Ktaps into kei-class trucks with design language of MODEL T ·      Flexing CDMS strength to accelerate electromobility for automotive clients30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317) on Friday flexed its contract design and manufacturing service (CDMS) strength for automotive clients by unveiling three new reference electric vehicles aimed at under-penetrated markets, while offering cost competitive options and flexible design platforms. Two eye-catching SUVs, the MODEL A+ and MODEL K+, alongside the MODEL K compact truck, extend Foxconn’s electromobility progress into the kei-class trucks popular in Japan and brings the Group’s EV range to a total of 12 reference models. “The new reference EVs join Foxconn’s emerging ecosystem in electromobility that is accelerating time-to-market, time-to-cost and time-to-technology for our customers and partners,” said Jun Seki, Foxconn Chief Strategy Officer for EV. All three new models were on display at Hon Hai Tech Day 2026 (HHTD26), the flagship annual technology conference of the world’s largest electronics manufacturer and the world premiere stage for the Group’s B2B electric vehicles. On the exhibition floor in Taipei, Foxconn’s electromobility ecosystem included demos of full stack, made in Taiwan battery developments from materials to cells and packs to BMS; E/E architecture; and powertrains for E2W and E3W. Among EVs on display, a right-hand drive MODEL B gave attendees a chance to check out the result of CDMS collaboration, while onstage, Honda R&D and Mitsubishi Electric Mobility discussed, in separate remarks, their electromobility developments with Foxconn. MODEL A+ An expressive luxury style yet authentic SUV for affluent drivers, the MODEL A+ is a deliberate move to expand B2B product portfolios in the fastest-growing B-segment SUV. With In-Wheel Motor technology and selectable EEA, a wild exterior design but ultimate space interior addresses flood capability emergencies, temporary living space and backup power for glamping and camping eletromobility lifestyles.   MODEL K+ This is an expressive yet affordable SUV designed for active youth. Playful styling with nostalgic touches recall Japan’s city pop music era of the ‘70s and ‘80s, but with a neo city pop take for the modern day. The highly distinctive lifestyle SUVfor a niche market targets B2B looking to develop their own brand’s lifestyle SUV EV, as well as OEMs looking to offer affordable yet distinctive vehicles for younger customers. With In-Wheel Motor technology, the MODEL K+ offers personalization of exterior, interior, driving range, and EEA for purpose-built capability at a competitive price. MODEL K This is a functional yet futuristic truck for forward-thinking business owners. Aimed at the specialized commercial kei truck class, the MODEL K finds use as last-mile and mobility service applications. Its alignment to support compliance to environmental regulations makes it attractive for decarbonization-focused entrepreneurs, municipalities, and government agencies while offering lower total cost of ownership (TCO) through reduced energy and maintenance costs.A functional beauty, inspired by the design language of Foxconn’s award-winning MODEL T electric bus, the canopy-ready MODEL K conceptualizes a lower bed height and longer bed length. Other reference EV models to-date: ·      MODEL T large bus ·      MODEL C passenger SUV ·      MODEL E luxury sedan ·      MODEL B crossover SUV ·      MODEL V truck ·      MODEL N cargo van ·      MODEL D LMUV ·      MODEL U midi-bus ·      MODEL A modular B-segment  

NVIDIA technologies support clinical AI orchestration, runtime security and digital twins across Foxconn’s healthcare ecosystemOctober 2026, Taipei, Taiwan – At Hon Hai Tech Day 2026 (HHTD26), Foxconn’s Smart Healthcare exhibition showcases its vision for AI-driven healthcare across the care continuum, organized around three key areas: AI-Assisted Diagnosis & Digital Twins, Embodied AI, and Smart Healthcare Manufacturing. By integrating AI agents, embodied AI, and multimodal medical models, Foxconn connects clinical decision-making with intelligent devices, hospital workflows, and manufacturing capabilities. The exhibition demonstrates Foxconn’s end-to-end integration expertise, spanning AI software, edge computing, robotics, and healthcare manufacturing to build a comprehensive smart healthcare value chain. Foxconn brings together its ecosystem, real-world deployment environments, products, edge-to-cloud infrastructure, and hardware-software integration. Aligned with NVIDIA’s “Five-Layer Cake” AI strategic framework, this approach connects AI technologies with intelligent medical devices and real clinical environments, advancing healthcare AI from individual proof-of-concept applications toward integrated systems and real-world clinical deployment. CoDoClaw: Advancing from AI Models to Clinical AI Agents As a key highlight of the exhibition, CoDoClaw, Foxconn’s Clinical AI Orchestrator, marks a significant milestone in the evolution from AI models to AI agents. Jointly developed by Foxconn and Tung’s Taichung MetroHarbor Hospital, CoDoClaw focuses on diabetes and cardiometabolic multimorbidity management. By integrating multimodal medical models with agentic AI, it connects data and AI capabilities across specialties and healthcare systems, advancing clinical applications from standalone diagnostic support to cross-specialty decision-making and workflow coordination. Built on NVIDIA NemoClaw open agent blueprint and NVIDIA OpenShell secure runtime software, CoDoClaw is designed to interpret clinical contexts, reason through tasks, and orchestrate AI agents within defined clinical workflows. To address the stringent security requirements of healthcare environments, CoDoClaw integrates centralized security policy management, sandbox isolation, and runtime access controls, alongside NVIDIA Sentryagent identity and delegated authority verification capabilities. Together, these mechanisms strengthen runtime security, mitigate risks such as unauthorized actions, sensitive data exposure, and credential leakage, and establish a trusted foundation for the responsible adoption of autonomous AI agents in clinical settings. Extending AI Clinical Capabilities Across Diverse Healthcare Settings Foxconn is also extending its AI-powered clinical capabilities into a variety of diagnostic and care environments. In the telemedicine zone, CoDoctor EKG Screener, an AI-powered electrocardiogram analysis system, brings real-time cardiovascular risk screening and anomaly alerts beyond hospitals into home-based care, community healthcare, and postoperative monitoring environments. At the endoscopy center, CoDoctor Endovia, an AI-assisted colonoscopy analysis software solution, is jointly developed by Foxconn, Kaohsiung Medical University Chung-Ho Memorial Hospital, YUAN High-Tech, Yuan Yu Industry, By integrating edge AI into endoscopic examination workflows, the solution provides real-time lesion detection, pathological classification, bowel preparation quality monitoring, withdrawal speed analysis, and intraoperative 3D navigation. These capabilities help improve examination quality and diagnostic consistency. Integrated Chemotherapy Compounding and Delivery System A major exhibition highlight is the Integrated Chemotherapy Compounding and Delivery System, developed through collaboration among Foxconn, Taipei Veterans General Hospital, Kawasaki Heavy Industries, Yuyama Manufacturing, and FARobot. The system brings together automated medication compounding, in-hospital logistics, and clinical delivery into an integrated healthcare automation ecosystem. Using NVIDIA Omniverse libraries, Foxconn builds digital twins to simulate and evaluate chemotherapy compounding, robotic transport and delivery workflows before deployment, allowing  high-risk chemotherapy workflows to be simulated, monitored, and continuously optimized. It integrates ChemoRo the Spike automated chemotherapy compounding equipment, FARobot autonomous mobile robots, and Foxconn’s Nurabot nursing collaborative robot to coordinate the entire workflow, from compounding and transportation to distribution and clinical delivery. By connecting these systems into a coordinated, end-to-end workflow, Foxconn aims to enhance medication safety, improve clinical efficiency, and increase operational reliability in complex hospital environments.

·      Flagship annual technology conference held for 7th year, celebrates tech partnerships ·      Record 321 exhibits demonstrate vertical integration and precision manufacturing ·      20-meter long wall shows components to system integration of next-gen AI infra ·      Most embodied intelligence assembled at HHTD2630 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday confirmed its industrial leadership in token factory solutions with an unprecedented look at components and system technologies enabling next generation AI infrastructure and by giving spotlight to its storied partnerships for the first time. At the 7th annual Hon Hai Tech Day 2026 (HHTD26), Foxconn laid bare the world-beating vertical integration and precision manufacturing strengths behind its work on the NVIDIA Vera Rubin platform, from rack-level full AI supercomputing system integration to sub-micron-level component manufacturing technologies. In two firsts, Foxconn showcased NVIDIA DSX POD, a standardized, factory-built reference design that enables partners to preintegrate NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers, complete critical validation before shipment and connect the units to prepared site infrastructure after delivery, dominated the venue and welcomed visitors, while a new customer zone with key moment photos and milestone technology timelines paid homage to behind-the-scenes partnerships that have captured the imagination of the technology industry. “Foxconn is transforming into a technology manufacturing platform service provider,” said Foxconn Chairman Young Liu. “From testing to the tangible, our vertical integration and precision manufacturing makes the impossible possible. We are building this kind of strength across ecosystems of smart consumer electronics to AI and EV, as well as in space and robotics.” Among a record 321 exhibits at HHTD26, a quarter comprised the Token Factory zone. Extreme co-design is a visual tour at a 20-meter long wall exhibiting PCBs mounted with tens of thousands of micron-level precision-engineered components; AI server cable-free, hose-free and fanless compute tray design in a single generation; next AI megatrend co-packaged optics (CPO); and power, cooling and high-speed data solutions re-imagined for more efficient AI infrastructure. An immersive simulated AI data hall demonstrated how AI compute, networking, power and cooling are co-designed for an AI factory, including NVIDIA 800 VDC power distribution. Foxconn’s dedicated business unit for AI supercomputing & cloud operations and an NVIDIA Cloud Partner, Visionbay.ai, is planning its facility design to follow NVIDIA DSX MaxLPS principles to maximize AI factory performance per watt within a fixed power envelope and optimize computing, power and cooling configurations ahead of construction. Onstage, NVIDIA, Google LLC, and Schneider Electric discussed AI infrastructure; Honda R&D Co Ltd and Mitsubishi Electric Mobility discussed next generation electromobility. The most embodied intelligence for HHTD26 assembled in the Robotics and Humanoid zone, showing the potential of a growing ecosystem and demonstrating real-world application examples of industrial products used in robotics. In another first, Foxconn leaned into its rich heritage in ultra-precision manufacturing processes backed by its proprietary machining, materials processing, and mold making equipment with a Precision Manufacturing zone dotted with technologies that have resulted in Poketomo AI companion robots and one-punch enclosures for laptops. Among the exhibits, the importance of AI safety was a common thread as Foxconn teams demonstrated how the NVIDIA Open Agent Safety Platform could support agent safety across smart healthcare, smart manufacturing and robotics, and smart city. HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference launched for the first time a family-friendly pavilion for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city. For more on Hon Hai Tech Day 2026 here. About Foxconn here.

TECO Electric & Machinery Co. (1504) returns to Hon Hai Tech Day today (October 30) for the second year, highlighting their collaboration with Foxconn  on a Modular Data Center (MDC) concept based on the NVIDIA DSX POD reference design. The exhibit integrates IT racks, cooling and power distribution systems within a 40-foot container, demonstrating TECO’s one-stop integration and delivery capabilities spanning critical equipment and electromechanical engineering. Since forming a strategic alliance with Hon Hai Technology Group (“Foxconn”) (2317) through an equity swap last year, TECO has continued to deepen the collaboration and leverage the benefits of vertical integration to capture infrastructure opportunities driven by growing demand for AI computing. TECO Group Chairman Morris Li said, “AI is reshaping competition across industries worldwide. Data centers have become critical infrastructure supporting the expansion of computing capacity and industrial transformation. TECO’s modular solutions integrate power, cooling, engineering and energy management. Through TECO’s acquisition of Malaysia-based Dynaciate (now renamed TECO NXG Integrated Services Sdn. Bhd.), we are accelerating the Group’s strategy to become an “AI data center solutions provider.” By expanding our capacity to undertake modular data center engineering projects and completing more than 80% of the modularization process in the factory, we can shorten delivery lead times, helping customers accelerate deployment and strengthen their competitiveness.” Combining Equipment Manufacturing and Engineering for Faster Deployment The  concept for an All-in-One MDC based on NVIDIA DSX POD on display houses IT racks, AC/DC control panels, cooling systems, an energy management system (EMS) and fire protection equipment in a 40-foot container, demonstrating the integrated configuration of computing equipment and electromechanical infrastructure. TECO is committed to serving as customers’ partner for modular data center infrastructure and electromechanical integration, combining its core capabilities in power equipment, cooling and thermal management, and module manufacturing to provide integrated solutions for high-density AI computing. NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories built by partners inside modular containers, integrated and validated before delivery. DSX POD moves the integration and installation of computing, networking, cabling, rack-level power and liquid cooling to the manufacturing facility, reducing the extensive planning, construction, specialized labor and logistics of a traditional onsite build.   In addition to the DSX POD-based MDC concept with Foxconn, TECO’s MDC solutions comprise five core modules: IT, cooling, power, generators and EMS. Each configuration can be tailored to customer requirements, site conditions and reliability needs. Through modular design and factory prefabrication, some assembly work that would otherwise be performed on site can be completed in the factory before installation and system integration on site. This helps reduce construction complexity while improving project quality and delivery efficiency. Customers can also deploy and expand capacity in stages based on their computing needs, allowing infrastructure scale to grow flexibly with their business. TECO is currently carrying out a megawatt-scale MDC project in Malaysia, applying this integrated approach in an actual deployment to meet major cloud service providers’ needs for fast deployment and flexible expansion. The project is expected to be completed and showcased by year-end. Integrating Power and Thermal Management for High-Density AI Computing TECO has extensive experience in data center infrastructure, having undertaken projects with a cumulative capacity of 1 GW. As AI computing density continues to rise, reliable power and efficient cooling have become critical to data center design, increasing the need for closer integration between power and cooling systems. Alongside its MDC, TECO is exhibiting an 800VDC high-voltage direct current power architecture and Solid-State Transformer (SST) technology, demonstrating approaches to reducing power transmission and conversion losses. The SST also provides electrical isolation to support the power requirements of high-density server racks. On the cooling side, TECO brings together three key solutions: the CDU Pump + Industrial Flat-Wire Power Module, the Process Cooling Water (PCW) System, and the Integrated Dual Cooling Series Water chiller/Heat Pump. These systems work together to connect the server-side and facility-side cooling circuits. Through high-efficiency drive systems, integrated piping, and coordinated configuration of the chiller and centralized control system, the solution addresses the cooling, space and modular expansion needs of high-density server racks. This demonstrates TECO’s ability to extend from critical equipment supply to integrated power and thermal management solutions for data centers. Applying Electric Drive Expertise to Robotics and Physical AI In addition to its modular data center solutions, TECO is also exhibiting the M1/M2 Quadruped Joint Module, the TJM Humanoid Joint Module, and the UTX Application-Specific Joint Module. These modules are designed for highly dynamic motion, whole-body joint control, and heavy-load applications, respectively. Potential applications include legged mobile robots, humanoid robots, industrial automation and smart logistics. Through these joint modules, TECO is extending its core electric drive expertise into robotics, demonstrating its potential to expand beyond conventional electromechanical equipment into Physical AI.

30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday showcased modular container built on NVIDIA DSX POD, the fastest path to productive intelligence at scale, to its annual technology fest in Taipei. NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories inside modular containers, integrated and validated before delivery. The units arrive ready to connect out of the box to a prepared site’s power, cooling, networking and other supporting infrastructure, reducing deployment time from six months to as little as 14 days. Partners, including Foxconn, complete rack-to-rack cabling, wiring, piping and functional validation before shipment. The DSX POD-based modular container at the 7th annual Hon Hai Tech Day 2026 (HHTD26) represents the strong, long-standing collaboration between NVIDIA and Foxconn and comes on the heels of its recent announcement at NVIDIA GTC Berlin. HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference is attracting thousands of attendees. Free entry on the second day, a family-friendly pavilion opens for the first time for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city.

Cross-border collaboration advances potential new solution for CCS corrosion mitigation; visitors welcome October 30–31October 30 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest technology manufacturing platform service provider, will showcase a novel approach to CCS corrosion prevention, developed in collaboration with UK-based Pace CCS Holdings Ltd, at Hon Hai Tech Day 2026, taking place October 30–31 at Taipei Nangang Exhibition Center, Hall 1. Laboratory proof-of-concept of an approach to inhibiting acid corrosion has been completed, offering a potential new solution to improve the safety of CO₂ transport and storage in the carbon capture and storage (CCS) industry at lower cost. Pace CCS Chief Technology Officer, Matthew Healey, will share technology trends and the results of the collaboration at the Sustainability Forum Trace impurities in CO₂ streams can form strong acids under certain conditions, potentially leading to corrosion - a significant challenge for CCS infrastructure. Laboratory testing has confirmed that a semiconductor-grade chemical scavenger has the potential to remove key oxidizing constituents, suppressing strong-acid formation at its source versus the need for additional processing to remove impurities, potentially lowering barriers to adoption. Testing began in Taipei in November 2025. Results showed that, under the test conditions, the addition of the scavenger prevented acid corrosion of metal coupons, whereas the untreated control samples exhibited visible corrosion. These findings provide a foundation for evaluating future applications. Ron R. T. Horng, Chief Environmental Officer of Hon Hai Technology Group, said: “As Foxconn advances its net-zero transition, we are also working to apply our manufacturing and systems integration experience to carbon-reduction technologies. By bringing together Foxconn’s capabilities in precision manufacturing, gas-reaction control and piping design with Pace CCS’s engineering expertise, we aim to move the results of laboratory validation progressively toward industrial applications and deliver more practical solutions for net zero.” Matthew Healey, Chief Technology Officer of Pace CCS, said: “Acid-driven corrosion is a critical cost driver in CCS operations. While raising CO₂ purity standards can mitigate risk, it sharply increases upstream treatment costs. By deploying a chemical scavenger to inhibit acid-forming reactions at the source, this potentially offers a more cost-effective solution. Pace is proud to have provided innovative thinking and technical support during laboratory testing. We look forward to continuing our technical support as the technology advances into the next stages of testing and validation.” Provided corrosion risks can be adequately managed, the technology could allow some systems to transport and store CO₂ with higher impurity levels, enabling more emissions sources to participate in storage networks, expanding the potential reach of CCS and reducing costs. Ruth Bradley-Jones, Representative of the British Office Taipei, said: “The collaboration between Foxconn and Pace CCS demonstrates the complementary strengths of Taiwan’s manufacturing and systems integration capabilities and the UK’s expertise in carbon capture and storage. We welcome efforts by businesses from both sides to explore industrial decarbonisation solutions and look forward to seeing continued technical exchange and collaboration translate innovative ideas into practical applications that support the net zero transition.” The CO₂ corrosion mitigation technology will be featured in the Environmental Intelligence exhibition area at this year’s Hon Hai Tech Day, giving visitors an opportunity to learn about the purification process and its potential applications. Foxconn will continue working with international companies collaboratively to advance innovation and research in carbon capture and expand viable pathways toward net zero. October 30 is an invitation-only opening day, while October 31 is open to the public. Registration and admission arrangements are subject to the event organizer’s announcements. About Hon Hai Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 1 million employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us   About Pace CCS Pace CCS is a boutique engineering and advisory consultancy dedicated to making CCS projects bankable, scalable, and cost-effective. Working quietly behind the scenes on the flagship developments shaping the industry’s future, the firm brings deep technical expertise from supporting CCS projects worldwide. Pace CCS delivers practical engineering and grounded problem-solving to overcome complex technical challenges, lower project costs, and de-risk investments.

Foxconn is building an AI factory that turns industrial data into intelligence to power a self-learning manufacturing ecosystem. Using NVIDIA infrastructure and software, the company trains AI models and deploys specialized agents that support real-time decisions across manufacturing, electric vehicles, and smart cities. At the center is FoxBrain, Foxconn’s proprietary large language model, developed by adapting open foundation models with industrial data. FoxBrain supports specialized platforms, including Genesis for manufacturing and CityGPT for urban services. NVIDIA DGX SuperPOD serves as the AI factory’s training foundation. Foxconn reports 2.48x faster training for 120-billion-parameter models compared with its previous H100-based systems, processing one trillion tokens in 12 days. NVIDIA software helps manage infrastructure and deploy AI agents across more than 200 facilities. The company reports practical manufacturing improvements: 25% fewer labor hours spent on production scheduling. 50% less engineering workload for injection-molding process changeovers. More than 20 major defect root causes addressed, with a correction rate exceeding 90%, on surface-mount production lines. Foxconn also uses NVIDIA RTX PRO servers, Omniverse, and Isaac to simulate factories and robots before deployment, helping replicate production lines globally. Through its subsidiary Visionbay.ai, an NVIDIA Cloud Partner, Foxconn is extending its AI factory leveraging NVIDIA-Certified Systems to deliver AI-as-a-Service to enterprises and governments across Asia. Discover how Foxconn and NVIDIA are architecting the future of industrial intelligence. Read the full Foxconn DGX SuperPOD case study.

Will leverage “Made in/by Japan” brand to support sustainable growth of Japanese automotive industry16 October 2026, Taipei, Taiwan, Tokyo Japan – Lin Yin International Investment Co., Ltd. (Lin Yin), an investment management subsidiary of Hon Hai Precision Industry Co., Ltd. (Hon Hai Precision Industry) (Foxconn), and Mitsubishi Electric Corporation (Mitsubishi Electric) announced today that they have formalized a strategic alliance for the joint operation of an automotive equipment business. Through the alliance, the companies aim to develop next-generation mobility and thereby strengthen the sustainable growth of the Japanese automotive industry. Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility Co., Ltd., which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility. The share transfer price is expected to be JPY 115.0 billion. The share transfer agreement establishes an enterprise value of JPY 320.0 billion and an equity value of 230.0 billion for the target business. The transfer price corresponds to a 50% stake to be transferred based on the equity value. Subject to the satisfaction of contractual conditions, including obtaining required approvals and clearances from relevant authorities under competition laws and other applicable laws and regulations, the share transfer is expected to be completed on October 1, 2027. The joint-operating arrangement will combine Mitsubishi Electric Mobility’s technological and developmental capabilities, particularly in electric powertrains, software and vehicle control, with Hon Hai Precision Industry’s speed, scale and other strengths in market deployment. By providing high-quality electric-vehicle platforms (basic structures) developed in Japan, the companies expect to contribute to the widespread adoption and advancement of next-generation mobility. The alliance will translate advanced technologies and quality achieved through high-level Japanese manufacturing into new value for mobility. In turn, this is expected to strengthen Japan’s industrial base and support the sustainable growth of the domestic automotive industry. In addition, over the medium to long term, the companies aim to expand Japanese technology and quality to global markets as well as further enhance the value of “Made in/by Japan” and demonstrate new possibilities for Japanese manufacturing to the world. About Hon Hai Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 1 million employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us About the Mitsubishi Electric Group Guided by its corporate philosophy, Mitsubishi Electric Corporation (TOKYO: 6503) places sustainability at the core of its operations and values stakeholder trust—encompassing society, customers, shareholders and employees. In pursuing profitability, capital efficiency and growth, Mitsubishi Electric works closely alongside customers to develop value-added solutions that address today’s complex challenges while enhancing the company’s sustainable corporate value. Founded in 1921, Mitsubishi Electric has over a century of experience in delivering reliable, high-quality products and solutions. With over 200 group companies and approximately 150,000 employees worldwide, the company is a recognized global leader in manufacturing, marketing and selling electrical and electronic equipment and systems across a broad range of sectors, including public utility systems, energy systems, defense and space systems, factory automation systems, automotive equipment, building systems, air conditioning systems & home products, digital innovations, and semiconductor & devices. Mitsubishi Electric recorded consolidated revenue of 5,894.7 billion yen (U.S.$ 36.8 billion*) in the fiscal year that ended on March 31, 2026. For more information, please visit www.MitsubishiElectric.com *JPY 160=USD 1, the approximate rate on the Tokyo Foreign Exchange Market on March 31, 2026

Technology sector leadership showcases Asia’s formidable strength12 October 2026, Taipei, Taiwan – Reflecting responsibilities that sit at the intersection of the physical industrial world and the AI world for the largest electronics manufacturer and AI server provider on the planet, Kathy Yangof Hon Hai Technology Group (Foxconn) (TWSE:2317) has been recognized in Most Powerful Women Asia 2026 by Fortune, for a second year. As General Manager of Global Campus Operations and Head of AI Software Business and AI Infrastructure for Foxconn, Yang joins 16 honorees from technology, the most represented sector in this year's prestigious list, ahead of banking with 14. Their presence reflects the increasingly central role technology plays in Asia's economy, as businesses spanning digital platforms, advanced manufacturing and other technology-driven industries grow in scale and influence. "What stands out in this year's ranking is how the landscape of business power in Asia is evolving," said Charmian Choo, Asia list Senior Manager. "We see established leaders continuing to shape some of the region's largest companies, alongside a new generation rising through the ranks. The prominence of technology is particularly striking, reflecting the sector's growing influence on Asia's economy and the women increasingly at the forefront of that transformation." “Women in leadership play an important role in the AI industrial revolution. The real challenge is not deploying technology, but redesigning work, investing in reskilling, and helping our global talent of women and men evolve with it,” said Foxconn’s Yang, whose remit includes Foxconn’s more than 240 sites across 24 countries. “Five years from now, the best factories will not simply be the most automated, but those where humans, AI and robots make one another better.” Earlier this year, Yang was recognized among Fortune’s Most Powerful Women in Business 2026. Her work combines Foxconn’s global manufacturing scale, engineering capabilities and operational know-how with software, data, computing infrastructure and AI. Yang previously served as Foxconn’s Rotating CEO, the first woman to hold the role, during which she focused on strengthening enterprise-wide execution, cross-business alignment, and governance discipline across one of the world’s largest and most complex industrial organizations. She is concurrently a Board Director of Foxconn Industrial Internet (FII) and Chairwoman and CEO of JUSDA, both key units of Foxconn. About Fortune MPW Asia here.

08 October 2026, Taipei, Taiwan – Demonstrating its strong forward-looking R&D capabilities, two fundamental theoretical studies from the Hon Hai Research Institute, under Hon Hai Technology Group (Foxconn), have been accepted by the IEEE Symposium on Foundations of Computer Science (FOCS 2026), universally recognized as the highest distinction in theoretical computer science. The 67th Annual FOCS 2026 will take place from November 8-11, 2026, in New York City, USA. As a flagship conference hosted by IEEE, FOCS stands alongside ACM's STOC as the premier academic venue in global theoretical computer science. The conference focuses on underlying mathematical theories such as algorithm design, computational complexity, cryptography, and quantum computing. The studies were conducted by Min-Hsiu Hsieh, Director of HHRI’s Quantum Computing Research Center, Researcher Michael de Oliveira, Intern Ding-Jun Lin, Intern Adam Wills, and an international collaborative team have both. The two accepted papers—"Worst-case depth hierarchy for shallow quantum circuits" (arXiv:2606.16425) and "Linear-Time Encodable and Decodable Quantum Error-Correcting Codes" (arXiv:2603.04543)—are not only the annual flagship achievements of the Hon Hai Research Institute’s Quantum Computing Research Center, but FOCS itself is a top-tier global theoretical computer science conference with an extremely high acceptance threshold. Notably, among all papers accepted by FOCS this year, Hon Hai Research Institute is the sole research entity representing Taiwan, fully highlighting Foxconn’s leadership in key foundational infrastructure for next-generation quantum technology. Mapping the Limits of Quantum Computational Power to Guide Algorithm Design The first accepted paper, "Worst-case depth hierarchy for shallow quantum circuits," focuses on the "depth hierarchy theory for shallow quantum circuits." In quantum computing, "circuit depth" resembles the total number of sequential steps that must be executed (equivalent to run time). Current quantum hardware, limited by technology, can only execute "shallow computations" with few steps and short run times. However, the scientific community has historically struggled to rigorously prove precisely how much of a leap in quantum computational capability occurs if the run time is increased by just a few additional steps. HHRI’s research team successfully established a mathematical framework that rigorously proves that for every additional layer of computational steps, the problem-solving domain of a quantum computer exhibits a distinct "hierarchical jump." This result is akin to mapping a precise "quantum computational capability chart," helping scientists worldwide clearly grasp the boundaries of current quantum devices, enabling the development of more efficient algorithms, and accelerating the realization of high-performance quantum computers. Equipping Qubits with "Ultra-Fast Protective Armor" to Build Ultra-Low Latency Error-Correction Technology The second paper, "Linear-Time Encodable and Decodable Quantum Error-Correcting Codes," tackles the most challenging noise issue in quantum computing—"linear-time encodable and decodable quantum error-correcting codes." While quantum computers possess immense processing power, qubits are extremely fragile. Minor temperature fluctuations or noise interference from the surrounding environment can instantaneously collapse the computational information. Therefore, quantum computers must detect and repair errors in real time within extremely short timeframes. However, if the computation for error correction and encoding is overly complex and time-consuming, qubits will degrade before the errors can even be fixed. The Quantum Computing Research Center team successfully developed an innovative encoding and decoding architecture that vastly simplifies the correction process, allowing computers to complete error-correction in highly efficient "linear time." This breakthrough is like equipping qubits with smart armor capable of "instant self-repair," laying a crucial cornerstone for building large-scale, stably operating quantum computers and quantum communication networks in the future. Cultivating Foundational Theory to Lead Next-Generation Technology Quantum technology is regarded as the core technology set to disrupt future cybersecurity, materials science, finance, and artificial intelligence. Yet, every hardware engineering breakthrough must be built on a foundation of underlying mathematics and algorithmic theory. HHRI director Hsieh stated that being the sole selection from Taiwan at this top-tier conference not only demonstrates that Taiwan's research in quantum foundational theory has reached world-class standards, but also confirms Foxconn’s commitment to cultivating advanced science and nurturing young scientific talent. Moving forward, the Quantum Computing Research Center will continue to collaborate with world-class research teams to provide the most solid theoretical support for next-generation technological infrastructure.